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Patent applications and USPTO patent grants for Bryzek; Aniela.The latest application filed is for "device for use as dual-sided sensor package".
Patent | Date |
---|---|
Device for use as dual-sided sensor package Grant 8,264,074 - Kim , et al. September 11, 2 | 2012-09-11 |
Device For Use As Dual-sided Sensor Package App 20120061775 - KIM; Woojin ;   et al. | 2012-03-15 |
Surface mount package and method for forming multi-chip microsensor device Grant 7,157,312 - Kim , et al. January 2, 2 | 2007-01-02 |
Surface mount package and method for forming multi-chip microsensor device Grant 6,927,482 - Kim , et al. August 9, 2 | 2005-08-09 |
Surface mount package and method for forming multi-chip microsensor device App 20050146000 - Kim, Woojin ;   et al. | 2005-07-07 |
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