Brunschwiler; Thomas J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brunschwiler; Thomas J..The latest application filed is for "counter-flow expanding channels for enhanced two-phase heat removal".

Company Profile

15.58.58

Brunschwiler; Thomas J. - Thalwil CH
Brunschwiler; Thomas J. - Rueschlikon CH
Brunschwiler; Thomas J - Thalwil SZ
Brunschwiler; Thomas J. - Ihalwil N/A CH
Brunschwiler; Thomas J. - Zurich CH
Brunschwiler; Thomas J. - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adsorption heat exchanger devices Grant 10,882,145 - Brunschwiler , et al. January 5, 2	2021-01-05
Method for electrical coupling and electric coupling arrangement Grant 10,833,049 - Brunschwiler , et al. November 10, 2	2020-11-10
Chip packages with sintered interconnects formed out of pads Grant 10,777,496 - Brunschwiler , et al. Sept	2020-09-15
Counter-flow expanding channels for enhanced two-phase heat removal Grant 10,727,158 - Brunschwiler , et al.	2020-07-28
Counter-flow expanding channels for enhanced two-phase heat removal Grant 10,727,159 - Brunschwiler , et al.	2020-07-28
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20200118907 - Brunschwiler; Thomas J. ; et al.	2020-04-16
Circuitized substrate with electronic components mounted on transversal portion thereof Grant 10,622,295 - Brunschwiler , et al.	2020-04-14
Circuitized substrate with electronic components mounted on transversal portion thereof Grant 10,622,296 - Brunschwiler , et al.	2020-04-14
Chip package for two-phase cooling and assembly process thereof Grant 10,607,963 - Brunschwiler , et al.	2020-03-31
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20200091037 - Brunschwiler; Thomas J. ; et al.	2020-03-19
Counter-flow expanding channels for enhanced two-phase heat removal Grant 10,529,648 - Brunschwiler , et al. J	2020-01-07
Method and device for cooling a heat generating component Grant 10,278,306 - Brunschwiler , et al.	2019-04-30
Chip Packages With Sintered Interconnects Formed Out Of Pads App 20190109084 - Brunschwiler; Thomas J. ; et al.	2019-04-11
Method For Electrical Coupling And Electric Coupling Arrangement App 20190088617 - Brunschwiler; Thomas J. ; et al.	2019-03-21
Method for electrical coupling and electric coupling arrangement Grant 10,170,445 - Brunschwiler , et al. J	2019-01-01
Releasable, threadless conduit connector for liquid manifold Grant 10,132,433 - Brunschwiler , et al. November 20, 2	2018-11-20
Circuitized Substrate With Electronic Components Mounted On Transversal Portion Thereof App 20180315697 - Brunschwiler; Thomas J. ; et al.	2018-11-01
Circuitized Substrate With Electronic Components Mounted On Transversal Portion Thereof App 20180315696 - Brunschwiler; Thomas J. ; et al.	2018-11-01
Releasable, threadless conduit connector for liquid manifold Grant 10,107,426 - Brunschwiler , et al. October 23, 2	2018-10-23
Adsorption Heat Exchanger Devices App 20180281127 - Brunschwiler; Thomas J. ; et al.	2018-10-04
Method and device for cooling a heat generating component Grant 10,091,909 - Brunschwiler , et al. October 2, 2	2018-10-02
Circuitized substrate with electronic components mounted on transversal portion thereof Grant 10,068,839 - Brunschwiler , et al. September 4, 2	2018-09-04
Adsorption heat exchanger devices Grant 10,041,709 - Brunschwiler , et al. August 7, 2	2018-08-07
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20180182686 - Brunschwiler; Thomas J. ; et al.	2018-06-28
Releasable, threadless conduit connector for liquid manifold Grant 10,006,571 - Brunschwiler , et al. June 26, 2	2018-06-26
Dense assembly of laterally soldered, overmolded chip packages Grant 10,008,474 - Brunschwiler , et al. June 26, 2	2018-06-26
Free Programmable Power Supply Array App 20180159431 - Brunschwiler; Thomas J. ; et al.	2018-06-07
Releasable, Threadless Conduit Connector For Liquid Manifold App 20180149294 - BRUNSCHWILER; Thomas J. ; et al.	2018-05-31
Counter-flow expanding channels for enhanced two-phase heat removal Grant 9,941,189 - Brunschwiler , et al. April 10, 2	2018-04-10
Chip stack structures that implement two-phase cooling with radial flow Grant 9,941,250 - Brunschwiler , et al. April 10, 2	2018-04-10
Chip Package For Two-phase Cooling And Assembly Process Thereof App 20180076113 - Brunschwiler; Thomas J. ; et al.	2018-03-15
Dense Assembly of Laterally Soldered, Overmolded Chip Packages App 20180012864 - BRUNSCHWILER; Thomas J. ; et al.	2018-01-11
Circuitized Substrate With Electronic Components Mounted On Transversal Portion Thereof App 20180005934 - Brunschwiler; Thomas J. ; et al.	2018-01-04
Adsorption heat exchanger devices Grant 9,821,418 - Brunschwiler , et al. November 21, 2	2017-11-21
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section Grant 9,698,089 - Brunschwiler , et al. July 4, 2	2017-07-04
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20170179001 - Brunschwiler; Thomas J. ; et al.	2017-06-22
Adsorption Heat Exchanger Devices App 20170131007 - Brunschwiler; Thomas J. ; et al.	2017-05-11
Chip stack structures that implement two-phase cooling with radial flow Grant 9,648,782 - Brunschwiler , et al. May 9, 2	2017-05-09
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow App 20170125388 - Brunschwiler; Thomas J. ; et al.	2017-05-04
Silver alloying post-chip join Grant 9,576,922 - Brunschwiler , et al. February 21, 2	2017-02-21
Substrate Device And Electric Circuit Arrangement App 20160351485 - Brunschwiler; Thomas J. ; et al.	2016-12-01
Method For Electrical Coupling And Electric Coupling Arrangement App 20160351529 - Brunschwiler; Thomas J. ; et al.	2016-12-01
Silver Alloying Post-chip Join App 20160329289 - Brunschwiler; Thomas J. ; et al.	2016-11-10
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section Grant 9,433,077 - Brunschwiler , et al. August 30, 2	2016-08-30
Integrated helical multi-layer inductor structures Grant 9,397,042 - Brunschwiler , et al. July 19, 2	2016-07-19
Adaptive optical interconnection of components of an electro-optical circuit Grant 9,389,362 - Brunschwiler , et al. July 12, 2	2016-07-12
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow App 20160165758 - Brunschwiler; Thomas J. ; et al.	2016-06-09
Bridging Arrangement, Microelectronic Component And Method For Manufacturing A Bridging Arrangement App 20160126202 - Brunschwiler; Thomas J. ; et al.	2016-05-05
Chip stack structures that implement two-phase cooling with radial flow Grant 9,313,921 - Brunschwiler , et al. April 12, 2	2016-04-12
Releasable, Threadless Conduit Connector For Liquid Manifold App 20160061364 - BRUNSCHWILER; Thomas J. ; et al.	2016-03-03
Releasable, Threadless Conduit Connector For Liquid Manifold App 20160059367 - BRUNSCHWILER; Thomas J. ; et al.	2016-03-03
Method for manufacturing a filled cavity between a first and a second surface Grant 9,230,832 - Brunschwiler , et al. January 5, 2	2016-01-05
Bridging arrangement and method for manufacturing a bridging arrangement Grant 9,230,830 - Brunschwiler , et al. January 5, 2	2016-01-05
Method For Manufacturing A Filled Cavity Between A First And A Second Surface App 20150249022 - Brunschwiler; Thomas J. ; et al.	2015-09-03
Substrate Device And Electric Circuit Arrangement App 20150237729 - Brunschwiler; Thomas J. ; et al.	2015-08-20
Integrated helical multi-layer inductor structures App 20150206838 - BRUNSCHWILER; THOMAS J. ; et al.	2015-07-23
Method And Device For Cooling A Heat Generating Component App 20150195955 - Brunschwiler; Thomas J. ; et al.	2015-07-09
Method And Device For Cooling A Heat Generating Component App 20150176911 - Brunschwiler; Thomas J. ; et al.	2015-06-25
Disassemblable electronic assembly with leak-inhibiting coolant capillaries Grant 9,066,460 - Brunschwiler , et al. June 23, 2	2015-06-23
One-dimensional hierarchical nested channel design for continuous feed manufacturing processes Grant 9,054,074 - Brunschwiler , et al. June 9, 2	2015-06-09
Bridging Arrangement And Method For Manufacturing A Bridging Arrangement App 20150155186 - Brunschwiler; Thomas J. ; et al.	2015-06-04
Bridging arrangement and method for manufacturing a bridging arrangement Grant 8,951,445 - Brunschwiler , et al. February 10, 2	2015-02-10
Electronic assembly with detachable coolant manifold and coolant-cooled electronic module Grant 8,937,810 - Brunschwiler , et al. January 20, 2	2015-01-20
Manufacturing an underfill in a semiconductor chip package Grant 8,907,503 - Brunschwiler , et al. December 9, 2	2014-12-09
Adsorption Heat Exchanger Devices App 20140238071 - Brunschwiler; Thomas J. ; et al.	2014-08-28
Disassemblable Electronic Assembly With Leak-inhibiting Coolant Capillaries App 20140198452 - BRUNSCHWILER; Thomas J. ; et al.	2014-07-17
Electronic Assembly With Detachable Coolant Manifold And Coolant-cooled Electronic Module App 20140078672 - BRUNSCHWILER; Thomas J. ; et al.	2014-03-20
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow App 20140071628 - Brunschwiler; Thomas J. ; et al.	2014-03-13
Integrated circuit stack Grant 8,659,898 - Brunschwiler , et al. February 25, 2	2014-02-25
Manufacturing An Underfill In A Semiconductor Chip Package App 20140027932 - Brunschwiler; Thomas J. ; et al.	2014-01-30
Cooling device Grant 8,413,712 - Brunschwiler , et al. April 9, 2	2013-04-09
Manufacturing A Filling Of A Gap Region App 20130062789 - Brunschwiler; Thomas J. ; et al.	2013-03-14
Integrated circuit stack Grant 8,363,402 - Brunschwiler , et al. January 29, 2	2013-01-29
Heat Spreader App 20130008632 - Brunschwiler; Thomas J. ; et al.	2013-01-10
Integrated Circuit Stack App 20120331433 - Brunschwiler; Thomas J. ; et al.	2012-12-27
Patterned structure for a thermal interface Grant 8,327,540 - Michel , et al. December 11, 2	2012-12-11
Bridging Arrangement And Method For Manufacturing A Bridging Arrangement App 20120261819 - Brunschwiler; Thomas J. ; et al.	2012-10-18
Variable flow computer cooling system for a data center and method of operation Grant 8,107,234 - Brunschwiler , et al. January 31, 2	2012-01-31
Double-face Heat Removal Of Vertically Integrated Chip-stacks Utilizing Combined Symmetric Silicon Carrier Fluid Cavity And Micro-channel Cold Plate App 20110205708 - Andry; Paul S. ; et al.	2011-08-25
Variable flow computer cooling system for a data center and method of operation Grant 8,004,832 - Brunschwiler , et al. August 23, 2	2011-08-23
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate Grant 7,990,711 - Andry , et al. August 2, 2	2011-08-02
Semiconductor device with a high thermal dissipation efficiency Grant 7,928,565 - Brunschwiler , et al. April 19, 2	2011-04-19
Method And Device For Cooling A Heat Generating Component App 20110036538 - Brunschwiler; Thomas J. ; et al.	2011-02-17
Variable performance server system and method of operation Grant 7,866,173 - Brunschwiler , et al. January 11, 2	2011-01-11
Integrated Circuit Stack App 20100290188 - Brunschwiler; Thomas J. ; et al.	2010-11-18
Variable flow computer cooling system for a data center and method of operation Grant 7,808,780 - Brunschwiler , et al. October 5, 2	2010-10-05
Variable Flow Computer Cooling System For A Data Center And Method Of Operation App 20100246117 - Brunschwiler; Thomas J. ; et al.	2010-09-30
Variable Flow Computer Cooling System For A Data Center And Method Of Operation App 20100241278 - Brunschwiler; Thomas J. ; et al.	2010-09-23
Patterned structure for a thermal interface Grant 7,748,440 - Michel , et al. July 6, 2	2010-07-06
Semiconductor Device With A High Thermal Dissipation Efficiency App 20100148358 - Brunschwiler; Thomas J. ; et al.	2010-06-17
Semiconductor device with a high thermal dissipation efficiency Grant 7,713,789 - Brunschwiler , et al. May 11, 2	2010-05-11
Patterned Structure For A Thermal Interface App 20100037461 - Michel; Bruno ; et al.	2010-02-18
Variable Performance Server System And Method Of Operation App 20090234705 - Brunschwiler; Thomas J. ; et al.	2009-09-17
Variable Flow Computer Cooling System For A Data Center And Method Of Operation App 20090218078 - Brunschwiler; Thomas J. ; et al.	2009-09-03
One-dimensional Hierarchical Nested Channel Design For Continuous Feed Manufacturing Processes App 20090154107 - Brunschwiler; Thomas J. ; et al.	2009-06-18
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies Grant 7,547,582 - Brunschwiler , et al. June 16, 2	2009-06-16
Semiconductor chip assembly with flexible metal cantilevers Grant 7,532,475 - Michel , et al. May 12, 2	2009-05-12
Surface Adapting Cap With Integral Adapting Material For Single And Multi Chip Module Assembly App 20080073775 - Brunschwiler; Thomas J ; et al.	2008-03-27
Semiconductor Device With A High Thermal Dissipation Efficiency App 20080017978 - Brunschwiler; Thomas J. ; et al.	2008-01-24
Thermal interface with a patterned structure Grant 7,282,799 - Brunschwiler , et al. October 16, 2	2007-10-16
Stress release thermal interfaces App 20070230133 - Michel; Bruno ; et al.	2007-10-04
Semiconductor device with a high thermal dissipation efficiency Grant 7,271,034 - Brunschwiler , et al. September 18, 2	2007-09-18
Cooling device App 20070119565 - Brunschwiler; Thomas J. ; et al.	2007-05-31
Heat spreader App 20070017659 - Brunschwiler; Thomas J. ; et al.	2007-01-25
Thermal interface with a patterned structure App 20060286712 - Brunschwiler; Thomas J. ; et al.	2006-12-21
Semiconductor device with a high thermal dissipation efficiency App 20050277280 - Brunschwiler, Thomas J. ; et al.	2005-12-15
Patterned structure for a thermal interface App 20050263879 - Michel, Bruno ; et al.	2005-12-01