Brunschwiler; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brunschwiler; Thomas.The latest application filed is for "semi-supervised learning with group constraints".

Company Profile

13.48.45

Brunschwiler; Thomas - Thalwil CH
Brunschwiler; Thomas - Rueschlikon CH
Brunschwiler; Thomas - Canton Zurich CH
Brunschwiler, Thomas - Arbeff CH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask Grant 11,251,160 - Oggioni , et al. February 15, 2	2022-02-15
Personalized copper block for selective solder removal Grant 11,235,404 - Arvin , et al. February 1, 2	2022-02-01
Semi-supervised Learning With Group Constraints App 20210357704 - Lustenberger; Patrick ; et al.	2021-11-18
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste Grant 11,164,804 - Arvin , et al. November 2, 2	2021-11-02
Particle-based, anisotropic composite materials for magnetic cores Grant 11,158,450 - Sridhar , et al. October 26, 2	2021-10-26
Personalized Copper Block For Selective Solder Removal App 20210291287 - Arvin; Charles L. ; et al.	2021-09-23
Printed circuit board with edge soldering for high-density packages and assemblies Grant 11,096,290 - Brunschwiler , et al. August 17, 2	2021-08-17
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Particle Metallic Paste App 20210028079 - Arvin; Charles L. ; et al.	2021-01-28
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask Grant 10,886,254 - Oggioni , et al. January 5, 2	2021-01-05
Particle-based, Anisotropic Composite Materials For Magnetic Cores App 20200395162 - Sridhar; Arvind Raj, Mahankali ; et al.	2020-12-17
Manufacturing Of Flip-chip Electronic Device With Carrier Having Heat Dissipation Elements Free Of Solder Mask App 20200357774 - OGGIONI; Stefano ; et al.	2020-11-12
Disconnect assembly for active cooling of packaged electronics Grant 10,767,939 - Schlottig , et al. Sep	2020-09-08
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20200144169 - Bernstein; Kerry ; et al.	2020-05-07
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 10,622,294 - Bernstein , et al.	2020-04-14
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 10,586,760 - Bernstein , et al.	2020-03-10
Disconnect Assembly For Active Cooling Of Packaged Electronics App 20200072562 - Schlottig; Gerd ; et al.	2020-03-05
Disconnect Assembly For Active Cooling Of Packaged Electronics App 20200011617 - Schlottig; Gerd ; et al.	2020-01-09
Disconnect assembly for active cooling of packaged electronics Grant 10,527,365 - Schlottig , et al. J	2020-01-07
High-performance compliant heat-exchanger comprising vapor chamber Grant 10,388,540 - Brunschwiler , et al. A	2019-08-20
Flip-chip Electronic Device With Carrier Having Heat Dissipation Elements Free Of Solder Mask App 20190043838 - OGGIONI; Stefano ; et al.	2019-02-07
Printed Circuit Board With Edge Soldering For High-density Packages And Assemblies App 20190037707 - Brunschwiler; Thomas ; et al.	2019-01-31
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask Grant 10,153,250 - Oggioni , et al. Dec	2018-12-11
Printed circuit board with edge soldering for high-density packages and assemblies Grant 10,098,241 - Brunschwiler , et al. October 9, 2	2018-10-09
High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber App 20180261522 - Brunschwiler; Thomas ; et al.	2018-09-13
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20180090427 - Bernstein; Kerry ; et al.	2018-03-29
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20180090428 - Bernstein; Kerry ; et al.	2018-03-29
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,905,505 - Bernstein , et al. February 27, 2	2018-02-27
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,905,506 - Bernstein , et al. February 27, 2	2018-02-27
Cooling device with nested chambers for computer hardware Grant 9,880,595 - Brunschwiler , et al. January 30, 2	2018-01-30
Cooling Device With Nested Chambers For Computer Hardware App 20170357297 - BRUNSCHWILER; Thomas ; et al.	2017-12-14
Porous Underfill Enabling Rework App 20170200659 - Gaynes; Michael ; et al.	2017-07-13
Printed Circuit Board With Edge Soldering For High-density Packages And Assemblies App 20170118839 - Brunschwiler; Thomas ; et al.	2017-04-27
Flip-chip Electronic Device With Carrier Having Heat Dissipation Elements Free Of Solder Mask App 20160307874 - OGGIONI; Stefano ; et al.	2016-10-20
Integrated device with defined heat flow Grant 9,406,563 - Brunschwiler , et al. August 2, 2	2016-08-02
Transferring heat through an optical layer of integrated circuitry Grant 9,337,122 - Barowski , et al. May 10, 2	2016-05-10
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20160049353 - Bernstein; Kerry ; et al.	2016-02-18
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20160049360 - BERNSTEIN; KERRY ; et al.	2016-02-18
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,252,072 - Bernstein , et al. February 2, 2	2016-02-02
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,252,071 - Bernstein , et al. February 2, 2	2016-02-02
Optimizing heat transfer in 3-D chip-stacks Grant 9,189,037 - Brunschwiler , et al. November 17, 2	2015-11-17
Transferring Heat Through An Optical Layer Of Integrated Circuitry App 20150221575 - Barowski; Harry ; et al.	2015-08-06
Transferring heat through an optical layer of integrated circuitry Grant 9,064,080 - Barowski , et al. June 23, 2	2015-06-23
Transferring heat through an optical layer of integrated circuitry Grant 9,058,461 - Barowski , et al. June 16, 2	2015-06-16
Integrated Device With Defined Heat Flow App 20150104922 - Brunschwiler; Thomas ; et al.	2015-04-16
Integrated circuit package connected to an optical data transmission medium using a coolant Grant 8,989,532 - Barowski , et al. March 24, 2	2015-03-24
Integrated device with defined heat flow Grant 8,878,071 - Brunschwiler , et al. November 4, 2	2014-11-04
Integrated circuit package connected to a data transmission medium Grant 8,805,132 - Barowski , et al. August 12, 2	2014-08-12
Transferring Heat Through An Optical Layer Of Integrated Circuitry App 20140095121 - Barowski; Harry ; et al.	2014-04-03
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20140084443 - Bernstein; Kerry ; et al.	2014-03-27
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20140084448 - Bernstein; Kerry ; et al.	2014-03-27
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 8,629,554 - Bernstein , et al. January 14, 2	2014-01-14
Optimizing Heat Transfer in 3-D Chip-Stacks App 20130331996 - Brunschwiler; Thomas ; et al.	2013-12-12
Manufacturing a filling of a gap in semiconductor devices Grant 8,586,411 - Brunschwiler , et al. November 19, 2	2013-11-19
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 8,487,427 - Bernstein , et al. July 16, 2	2013-07-16
Optimized semiconductor packaging in a three-dimensional stack Grant 8,476,112 - Barowski , et al. July 2, 2	2013-07-02
Thermal power plane for integrated circuits Grant 8,427,833 - Barowski , et al. April 23, 2	2013-04-23
Heat sink integrated power delivery and distribution for integrated circuits Grant 8,405,998 - Barowski , et al. March 26, 2	2013-03-26
Electronic Device Having an Electrode with Enhanced Injection Properties App 20120325144 - Brunschwiler; Thomas ; et al.	2012-12-27
Optimized Semiconductor Packaging in a Three-Dimensional Stack App 20120290999 - Barowski; Harry ; et al.	2012-11-15
Manufacturing A Filling Of A Gap In Semiconductor Devices App 20120282739 - Brunschwiler; Thomas ; et al.	2012-11-08
Coolant Pumping System For Mobile Electronic Systems App 20120273183 - Bruno; Michel ; et al.	2012-11-01
Electronic device having an electrode with enhanced injection properties Grant 8,288,941 - Brunschwiler , et al. October 16, 2	2012-10-16
Optimized semiconductor packaging in a three-dimensional stack Grant 8,253,234 - Barowski , et al. August 28, 2	2012-08-28
Transferring Heat Through An Optical Layer Of Integrated Circuitry App 20120189243 - Barowski; Harry ; et al.	2012-07-26
Integrated Device With Defined Heat Flow App 20120186793 - Brunschwiler; Thomas ; et al.	2012-07-26
Integrated Circuit Package Connected To An Optical Data Transmission Medium Using A Coolant App 20120147559 - Barowski; Harry ; et al.	2012-06-14
Integrated Circuit Package Connected To A Data Transmission Medium App 20120148187 - Barowski; Harry ; et al.	2012-06-14
Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits App 20120106074 - Barowski; Harry ; et al.	2012-05-03
Optimized Semiconductor Packaging in a Three-Dimensional Stack App 20120105144 - Barowski; Harry ; et al.	2012-05-03
Thermal Power Plane for Integrated Circuits App 20120105145 - Barowski; Harry ; et al.	2012-05-03
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 8,106,505 - Bernstein , et al. January 31, 2	2012-01-31
Electronic device having an electrode with enhanced injection properties Grant 8,021,710 - Brunschwiler , et al. September 20, 2	2011-09-20
Cooling system for an electronic component system cabinet Grant 7,872,867 - Brunschwiler , et al. January 18, 2	2011-01-18
Electronic Device Having an Electrode With Enhanced Injection Properties App 20100308316 - Brunschwiler; Thomas ; et al.	2010-12-09
Cooling System For An Electronic Component System Cabinet App 20100053890 - Brunschwiler; Thomas ; et al.	2010-03-04
Coolant Pumping System For Mobile Electronic Systems App 20100044005 - Bruno; Michel ; et al.	2010-02-25
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20090308578 - Bernstein; Kerry ; et al.	2009-12-17
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20090311826 - Bernstein; Kerry ; et al.	2009-12-17
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20090108435 - Bernstein; Kerry ; et al.	2009-04-30
Electronic device having an electrode with enhanced injection properties App 20060038170 - Brunschwiler; Thomas ; et al.	2006-02-23
Optical waveguide coupler and method for producing same App 20020003929 - Holzner, Reto ; et al.	2002-01-10

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