Brunner; Sebastian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brunner; Sebastian.The latest application filed is for "package including a substrate with high resolution rectangular cross-section interconnects".

Company Profile

5.23.24

Brunner; Sebastian - Deutschlandsberg AT
Brunner; Sebastian - Graz AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package including a substrate with high resolution rectangular cross-section interconnects Grant 11,450,598 - Brunner September 20, 2	2022-09-20
Package Including A Substrate With High Resolution Rectangular Cross-section Interconnects App 20220037246 - BRUNNER; Sebastian	2022-02-03
Component substrate having a protective function Grant 11,239,010 - Faistauer , et al. February 1, 2	2022-02-01
Package Comprising A Substrate That Includes A Stress Buffer Layer App 20210249361 - BRUNNER; Sebastian ; et al.	2021-08-12
Package comprising a substrate that includes a stress buffer layer Grant 11,088,090 - Brunner , et al. August 10, 2	2021-08-10
Multi-LED system Grant 10,818,641 - Feichtinger , et al. October 27, 2	2020-10-27
Component carrier having an ESD protective function and method for producing same Grant 10,490,322 - Brunner , et al. Nov	2019-11-26
Electric component assembly Grant 10,278,285 - Brunner , et al.	2019-04-30
Multi-LED System App 20190103384 - Feichtinger; Thomas ; et al.	2019-04-04
Component Carrier Having An Esd Protective Function And Method For Producing Same App 20190019604 - Brunner; Sebastian ; et al.	2019-01-17
Component Substrate Having A Protective Function And Method For Production Thereof App 20190013120 - Faistauer; Christian ; et al.	2019-01-10
Carrier plate, device having the carrier plate and method for producing a carrier plate Grant 10,117,329 - Brunner , et al. October 30, 2	2018-10-30
Method for producing an electric contact connection of a multilayer component Grant 10,090,454 - Somitsch , et al. October 2, 2	2018-10-02
Chip with protection function and method for producing same Grant 9,865,381 - Miyauchi , et al. January 9, 2	2018-01-09
Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate App 20170311455 - Brunner; Sebastian ; et al.	2017-10-26
Chip with Protection Function and Method for Producing Same App 20170011827 - Miyauchi; Yasuharu ; et al.	2017-01-12
Light-emitting diode device Grant 9,449,958 - Feichtinger , et al. September 20, 2	2016-09-20
Light-emitting diode device Grant 9,337,408 - Feichtinger , et al. May 10, 2	2016-05-10
Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement Grant 9,287,247 - Faistauer , et al. March 15, 2	2016-03-15
Method for producing an electrical component, and electrical component Grant 9,230,719 - Feichtinger , et al. January 5, 2	2016-01-05
Light-Emitting Diode Arrangement, Module, and Method for Producing a Light-Emitting Diode Arrangement App 20150287703 - Faistauer; Christian ; et al.	2015-10-08
Electric Component Assembly App 20150245481 - Brunner; Sebastian ; et al.	2015-08-27
Light-emitting Diode Device App 20150243865 - Feichtinger; Thomas ; et al.	2015-08-27
Carrier Plate, Device Having the Carrier Plate and Method for Producing a Carrier Plate App 20150223329 - Brunner; Sebastian ; et al.	2015-08-06
Light-Emitting Diode Device App 20150144983 - Feichtinger; Thomas ; et al.	2015-05-28
Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer Grant 9,001,523 - Brunner , et al. April 7, 2	2015-04-07
Method for Producing an Electric Contact Connection of a Multilayer Component and Multilayer Component with an Electric Contact Connection App 20150022055 - Somitsch; Dieter ; et al.	2015-01-22
Method For Producing An Electrical Component, And Electrical Component App 20140225710 - Feichtinger; Thomas ; et al.	2014-08-14
Electric component and component and method for the production thereof Grant 8,415,251 - Brunner , et al. April 9, 2	2013-04-09
Module substrate and production method Grant 8,413,321 - Brunner , et al. April 9, 2	2013-04-09
Carrier Device, Arrangement Comprising such a Carrier Device, and Method for Patterning a Layer Stack Comprising at Least One Ceramic Layer App 20120218728 - Brunner; Sebastian ; et al.	2012-08-30
Multilayer Component App 20110148546 - Feichtinger; Thomas ; et al.	2011-06-23
Electric Component And Component And Method For The Production Thereof App 20110146069 - Brunner; Sebastian ; et al.	2011-06-23
Production of an electrical component and component Grant 7,928,558 - Brunner , et al. April 19, 2	2011-04-19
Module Substrate and Production Method App 20100224394 - Brunner; Sebastian ; et al.	2010-09-09
Electric multilayer component Grant 7,710,233 - Feichtinger , et al. May 4, 2	2010-05-04
Electrical component and circuit configuration with the electrical component Grant 7,710,710 - Brunner , et al. May 4, 2	2010-05-04
Module with Flat Construction and Method for Placing Components App 20090174054 - Block; Christian ; et al.	2009-07-09
Electrical Multilayer Component with Solder Contact App 20070271782 - Block; Christian ; et al.	2007-11-29
Method for the Production of an Electrical Component and Component App 20070235834 - Brunner; Sebastian ; et al.	2007-10-11
Electric multilayer component App 20060249758 - Feichtinger; Thomas ; et al.	2006-11-09
Electrical component and switching mechanism App 20060170010 - Brunner; Sebastian ; et al.	2006-08-03

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