| Patent | Date |
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Nanoparticles Comprising Enzalutamide
App 20220249388 - BRUNNER; Heiko ; et al. | 2022-08-11 |
Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
Grant 11,091,849 - Gaida , et al. August 17, 2 | 2021-08-17 |
Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
Grant 11,066,553 - Brunner , et al. July 20, 2 | 2021-07-20 |
Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
Grant 10,882,842 - Jagannathan , et al. January 5, 2 | 2021-01-05 |
Metal Or Metal Alloy Deposition Composition And Plating Compound
App 20200340132 - LLAVONA-SERRANO; Angela ; et al. | 2020-10-29 |
Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
Grant 10,767,275 - Brunner , et al. Sep | 2020-09-08 |
Pyridinium Compounds, A Synthesis Method Therefor, Metal Or Metal Alloy Plating Baths Containing Said Pyridinium Compounds And A
App 20200231565 - JAGANNATHAN; Rangarajan ; et al. | 2020-07-23 |
A Bath And Method For Filling A Vertical Interconnect Access Or Trench Of A Work Piece With Nickel Or A Nickel Alloy
App 20200199766 - GAIDA; Josef ; et al. | 2020-06-25 |
Electrolytic copper plating bath compositions and a method for their use
Grant 10,538,850 - Brunner , et al. Ja | 2020-01-21 |
Plating bath composition and method for electroless plating of palladium
Grant 10,513,780 - Walter , et al. Dec | 2019-12-24 |
Method For Providing A Multilayer Coating On A Surface Of A Substrate
App 20190264328 - BERNHARD; Tobias ; et al. | 2019-08-29 |
Imidazoyl Urea Polymers And Their Use In Metal Or Metal Alloy Plating Bath Compositions
App 20190144667 - BRUNNER; Heiko ; et al. | 2019-05-16 |
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
Grant 10,219,391 - Sparing , et al. Feb | 2019-02-26 |
Plating Bath Composition And Method For Electroless Plating Of Palladium
App 20180340261 - WALTER; Andreas ; et al. | 2018-11-29 |
Plating Bath Composition And Method For Electroless Plating Of Palladium
App 20180340260 - WALTER; Andreas ; et al. | 2018-11-29 |
Aqueous Copper Plating Baths And A Method For Deposition Of Copper Or Copper Alloy Onto A Substrate
App 20180223442 - BRUNNER; Heiko ; et al. | 2018-08-09 |
Electrolytic Copper Plating Bath Compositions And A Method For Their Use
App 20180112320 - BRUNNER; Heiko ; et al. | 2018-04-26 |
Plating bath compositions for electroless plating of metals and metal alloys
Grant 9,909,216 - Brunner , et al. March 6, 2 | 2018-03-06 |
Plating Bath Compositions For Electroless Plating Of Metals And Metal Alloys
App 20170327954 - BRUNNER; Heiko ; et al. | 2017-11-16 |
3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths
Grant 9,790,607 - Schulz , et al. October 17, 2 | 2017-10-17 |
Galvanic nickel electroplating bath for depositing a semi-bright nickel
Grant 9,752,244 - Schulz , et al. September 5, 2 | 2017-09-05 |
Solution And Process For The Pre-treatment Of Copper Surfaces Using An N-alkoxylated Adhesion-promoting Compound
App 20170086305 - SPARING; Christian ; et al. | 2017-03-23 |
Copper plating bath composition
Grant 9,551,080 - Brunner , et al. January 24, 2 | 2017-01-24 |
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
Grant 9,504,161 - Sparing , et al. November 22, 2 | 2016-11-22 |
Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
Grant 9,399,824 - Hartmann , et al. July 26, 2 | 2016-07-26 |
Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths
Grant 9,322,107 - Brunner , et al. April 26, 2 | 2016-04-26 |
Galvanic Nickel Or Nickel Alloy Electroplating Bath For Depositing A Semi-bright Nickel Or Nickel Alloy
App 20160053395 - SCHULZ; Klaus-Dieter ; et al. | 2016-02-25 |
Plating bath for electroless deposition of nickel layers
Grant 9,175,399 - Brunner , et al. November 3, 2 | 2015-11-03 |
Copper Plating Bath Composition
App 20150299883 - BRUNNER; Heiko ; et al. | 2015-10-22 |
Plating Bath For Electroless Deposition Of Nickel Layers
App 20150110965 - Brunner; Heiko ; et al. | 2015-04-23 |
Alkaline plating bath for electroless deposition of cobalt alloys
Grant 8,961,670 - Bera , et al. February 24, 2 | 2015-02-24 |
Alkaline Plating Bath For Electroless Deposition Of Cobalt Alloys
App 20140377471 - Bera; Holger ; et al. | 2014-12-25 |
Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)--group 13 (IIIA)--Group 16 (VIA)
Grant 8,828,278 - Voss , et al. September 9, 2 | 2014-09-09 |
Pyrophosphate-containing Bath For Cyanide-free Deposition Of Copper-tin Alloys
App 20140124376 - Hartmann; Philip ; et al. | 2014-05-08 |
Aqueous, acid bath and method for the electrolytic deposition of copper
Grant 8,679,316 - Brunner , et al. March 25, 2 | 2014-03-25 |
Solution And Process For The Pre-treatment Of Copper Surfaces Using An N-alkoxylated Adhesion-promoting Compound
App 20140076461 - Sparing; Christian ; et al. | 2014-03-20 |
Pyrophosphate-based bath for plating of tin alloy layers
Grant 8,647,491 - Hartmann , et al. February 11, 2 | 2014-02-11 |
Polymers Having Terminal Amino Groups And Use Thereof As Additives For Zinc And Zinc Alloy Electrodeposition Baths
App 20120160698 - Brunner; Heiko ; et al. | 2012-06-28 |
Electroplating Additive For The Deposition Of Metal, A Binary, Ternary, Quaternary Or Pentanary Alloy Of Elements Of Group 11 (ib)-group 13 (iiia)-group 16 (via)
App 20110094583 - Voss; Torsten ; et al. | 2011-04-28 |
Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
App 20110011746 - Brunner; Heiko ; et al. | 2011-01-20 |
Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
Grant 7,872,130 - Brunner , et al. January 18, 2 | 2011-01-18 |
Pyrophosphate-containing Bath For Cyanide-free Deposition Of Copper-tin Alloys
App 20100326838 - Hartmann; Philip ; et al. | 2010-12-30 |
Pyrophosphate-based Bath For Plating Of Tin Alloy Layers
App 20100300890 - Hartmann; Philip ; et al. | 2010-12-02 |
Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings
App 20100236936 - Brunner; Heiko ; et al. | 2010-09-23 |
Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds
Grant 7,786,303 - Brunner , et al. August 31, 2 | 2010-08-31 |
Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings
App 20100155257 - Brunner; Heiko ; et al. | 2010-06-24 |
Navy Blue and Black Mixtures, Method for the Production Thereof, and Their Use for Dying Material Containing Hydroxy Groups
App 20080282485 - Widler; Gunther ; et al. | 2008-11-20 |
Electrolytic Cell Comprising Multilayer Expanded Metal
App 20080245662 - Forster; Hans-Jurgen ; et al. | 2008-10-09 |
Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds
App 20070108062 - Brunner; Heiko ; et al. | 2007-05-17 |
Novel quinoneimine sulfur dye compositions, production thereof and use for dyeing cellulosic material
App 20060288500 - Bechtold; Thomas ; et al. | 2006-12-28 |
Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
App 20060226021 - Brunner; Heiko ; et al. | 2006-10-12 |
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