loadpatents
Patent applications and USPTO patent grants for Bruner; Mike.The latest application filed is for "microelectronic mechanical system and methods".
Patent | Date |
---|---|
Wafer-level seal for non-silicon-based devices Grant 7,466,022 - Miller , et al. December 16, 2 | 2008-12-16 |
Method of forming a floating metal structure in an integrated circuit Grant 7,227,212 - Ben-Tzur , et al. June 5, 2 | 2007-06-05 |
Microelectronic mechanical system and methods Grant 7,183,637 - Bruner February 27, 2 | 2007-02-27 |
Microelectronic mechanical system and methods Grant 7,049,164 - Bruner May 23, 2 | 2006-05-23 |
Microelectronic mechanical system and methods Grant 6,991,953 - Bruner , et al. January 31, 2 | 2006-01-31 |
Microelectronic mechanical system and methods App 20050221528 - Bruner, Mike | 2005-10-06 |
Microelectronic mechanical system and methods Grant 6,930,364 - Bruner August 16, 2 | 2005-08-16 |
Wafer-level seal for non-silicon-based devices App 20050168103 - Miller, Gregory D. ;   et al. | 2005-08-04 |
Method for sealing an active area of a surface acoustic wave device on a wafer Grant 6,877,209 - Miller , et al. April 12, 2 | 2005-04-12 |
Wafer-level seal for non-silicon-based devices Grant 6,846,423 - Miller , et al. January 25, 2 | 2005-01-25 |
Method of forming a floating metal structure in an integrated circuit Grant 6,835,616 - Ben-Tzur , et al. December 28, 2 | 2004-12-28 |
Seal for surface acoustic wave devices App 20040187292 - Miller, Gregory D. ;   et al. | 2004-09-30 |
Microelectronic mechanical system and methods App 20040053434 - Bruner, Mike | 2004-03-18 |
Microelectronic mechanical system and methods App 20030138986 - Bruner, Mike | 2003-07-24 |
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