Brun; Xavier Francois

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brun; Xavier Francois.The latest application filed is for "inter-component material in microelectronic assemblies having direct bonding".

Company Profile

1.11.3

Brun; Xavier Francois - Hillsboro OR
Brun; Xavier Francois - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inter-component Material In Microelectronic Assemblies Having Direct Bonding App 20220189850 - Liff; Shawna M. ; et al.	2022-06-16
Microelectronic Component Having Molded Regions With Through-mold Vias App 20220181262 - Ganesan; Sanka ; et al.	2022-06-09
Microelectronic component having molded regions with through-mold vias Grant 11,302,643 - Ganesan , et al. April 12, 2	2022-04-12
Microelectronic Component Having Molded Regions With Through-mold Vias App 20210305162 - Ganesan; Sanka ; et al.	2021-09-30
Separation apparatus, separation system, and separation method Grant 10,071,544 - Hirakawa , et al. September 11, 2	2018-09-11
Separation method, computer storage medium, and separation system Grant 10,008,419 - Okada , et al. June 26, 2	2018-06-26
Separation method, separation apparatus, and separation system Grant 9,956,755 - Hirakawa , et al. May 1, 2	2018-05-01
Peeling device, peeling system and peeling method Grant 9,919,509 - Hirakawa , et al. March 20, 2	2018-03-20
Separation apparatus, separation system, and separation method Grant 9,827,756 - Hirakawa , et al. November 28, 2	2017-11-28
Substrate conveyance apparatus and substrate peeling system Grant 9,679,798 - Iwashita , et al. June 13, 2	2017-06-13

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