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Patent applications and USPTO patent grants for BRUGGMANN; Horst.The latest application filed is for "manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board".
Patent | Date |
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Manufacturing Sequences For High Density Interconnect Printed Circuit Boards And A High Density Interconnect Printed Circuit Board App 20220304164 - OZKOK; Akif ;   et al. | 2022-09-22 |
Method Of Preparing A High Density Interconnect Printed Circuit Board Including Microvias Filled With Copper App 20220279662 - REENTS; Bert ;   et al. | 2022-09-01 |
Method and apparatus for electroplating a metal onto a substrate Grant 11,015,257 - Fujiwara , et al. May 25, 2 | 2021-05-25 |
Method And Apparatus For Electroplating A Metal Onto A Substrate App 20200080217 - Fujiwara; Toshia ;   et al. | 2020-03-12 |
Method and apparatus for electroplating a metal onto a substrate Grant 10,501,860 - Fujiwara , et al. Dec | 2019-12-10 |
Method And Apparatus For Electroplating A Metal Onto A Substrate App 20180010258 - Fujiwara; Toshia ;   et al. | 2018-01-11 |
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