| Patent | Date |
|---|
Reactivation Of A Deposited Metal Liner
App 20220310912 - BRUCE; ROBERT L. ; et al. | 2022-09-29 |
Integrated phase change memory cell projection liner and etch stop layer
Grant 11,456,417 - Brew , et al. September 27, 2 | 2022-09-27 |
Integration of selector on confined phase change memory
Grant 11,437,571 - Kim , et al. September 6, 2 | 2022-09-06 |
Embedded Heater In A Phase Change Memory Material
App 20220254995 - HAN; JIN PING ; et al. | 2022-08-11 |
Mitigating Moisture Driven Degradation Of Silicon Doped Chalcogenides
App 20220209113 - Cheng; Cheng-Wei ; et al. | 2022-06-30 |
Phase Change Memory Cell With Ovonic Threshold Switch
App 20220190238 - Gong; Nanbo ; et al. | 2022-06-16 |
Single-sided liner PCM cell for 3D crossbar PCM memory
Grant 11,355,706 - Bruce , et al. June 7, 2 | 2022-06-07 |
Integrated Phase Change Memory Cell Projection Liner And Etch Stop Layer
App 20220165949 - Brew; Kevin W. ; et al. | 2022-05-26 |
Fill-in Confined Cell Pcm Devices
App 20220140237 - Adusumilli; Praneet ; et al. | 2022-05-05 |
Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials
Grant 11,192,101 - Liu , et al. December 7, 2 | 2021-12-07 |
Method to create multilayer microfluidic chips using spin-on carbon as gap fill and spin-on glass tone inversion
Grant 11,084,032 - Liu , et al. August 10, 2 | 2021-08-10 |
III-V extension by high temperature plasma doping
Grant 11,018,225 - Bruce , et al. May 25, 2 | 2021-05-25 |
Vertical array of resistive switching devices having restricted filament regions and tunable top electrode volume
Grant 10,991,763 - Ando , et al. April 27, 2 | 2021-04-27 |
Integration of confined phase change memory with threshold switching material
Grant 10,892,413 - Bruce , et al. January 12, 2 | 2021-01-12 |
Integration Of Selector On Confined Phase Change Memory
App 20200411757 - Kim; Wanki ; et al. | 2020-12-31 |
Single-sided Liner Pcm Cell For 3d Crossbar Pcm Memory
App 20200388760 - Bruce; Robert L. ; et al. | 2020-12-10 |
Barrier Layer For Selector Devices And Memory Devices Using Same
App 20200295083 - CHENG; Huai-Yu ; et al. | 2020-09-17 |
Thin film interconnects with large grains
Grant 10,727,121 - Bruce , et al. | 2020-07-28 |
Interconnect structure including airgaps and substractively etched metal lines
Grant 10,727,114 - Bruce , et al. | 2020-07-28 |
Biosensor for optical detection of nucleotide sequence
Grant 10,718,758 - Bruce , et al. | 2020-07-21 |
Biosensor for electrical detection of a nucleotide sequence
Grant 10,712,308 - Bruce , et al. | 2020-07-14 |
Single-sided liner PCM cell for 3D crossbar PCM memory
Grant 10,707,417 - Bruce , et al. | 2020-07-07 |
Reduction of surface nucleotide hybridization by optimizing a biosensor sensing surface area
Grant 10,665,325 - Bruce , et al. | 2020-05-26 |
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication
Grant 10,643,859 - Bruce , et al. | 2020-05-05 |
Vertical array of resistive switching devices having restricted filament regions and tunable top electrode volume
Grant 10,593,729 - Ando , et al. | 2020-03-17 |
Vertical Array Of Resistive Switching Devices Having Restricted Filament Regions And Tunable Top Electrode Volume
App 20200083293 - Ando; Takashi ; et al. | 2020-03-12 |
Method To Create Multilayer Microfluidic Chips Using Spin-on Carbon As Gap Filling Materials
App 20200070150 - Liu; Chi-Chun ; et al. | 2020-03-05 |
Method To Create Multilayer Microfluidic Chips Using Spin-on Carbon As Gap Fill And Spin-on Glass Tone Inversion
App 20200070151 - Liu; Chi-Chun ; et al. | 2020-03-05 |
Vertical Array Of Resistive Switching Devices Having Restricted Filament Regions And Tunable Top Electrode Volume
App 20190378876 - Ando; Takashi ; et al. | 2019-12-12 |
Reduction Of Surface Nucleotide Hybridization By Optimizing A Biosensor Sensing Surface Area
App 20190318803 - Bruce; Robert L. ; et al. | 2019-10-17 |
Pillar array structure with uniform and high aspect ratio nanometer gaps
Grant 10,393,642 - Astier , et al. A | 2019-08-27 |
Reduction of surface nucleotide hybridization by optimizing a biosensor sensing surface area
Grant 10,373,704 - Bruce , et al. | 2019-08-06 |
Tone inversion integration for phase change memory
Grant 10,312,085 - BrightSky , et al. | 2019-06-04 |
Method Of Forming Field Effect Transistor (fet) Circuits, And Forming Integrated Circuit (ic) Chips With The Fet Circuits
App 20190164773 - Arnold; John C. ; et al. | 2019-05-30 |
Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits
Grant 10,304,692 - Arnold , et al. | 2019-05-28 |
Tone Inversion Integration For Phase Change Memory
App 20190139765 - BrightSky; Matthew J. ; et al. | 2019-05-09 |
Plasma shallow doping and wet removal of depth control cap
Grant 10,276,384 - Bruce , et al. | 2019-04-30 |
Thin Film Interconnects With Large Grains
App 20190096757 - Bruce; Robert L. ; et al. | 2019-03-28 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 10,236,252 - Bruce , et al. | 2019-03-19 |
Articles including ultra low dielectric layers
Grant 10,217,661 - Bruce , et al. Feb | 2019-02-26 |
Tone inversion integration for phase change memory
Grant 10,211,054 - BrightSky , et al. Feb | 2019-02-19 |
Hydrofluorocarbon Gas-assisted Plasma Etch For Interconnect Fabrication
App 20190013209 - Bruce; Robert L. ; et al. | 2019-01-10 |
Thin film interconnects with large grains
Grant 10,170,361 - Bruce , et al. J | 2019-01-01 |
Wet clean process for removing C.sub.xH.sub.yF.sub.z etch residue
Grant 10,167,443 - Bruce , et al. J | 2019-01-01 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 10,128,185 - Bruce , et al. November 13, 2 | 2018-11-13 |
Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch
Grant 10,121,676 - Bruce , et al. November 6, 2 | 2018-11-06 |
Plasma Shallow Doping And Wet Removal Of Depth Control Cap
App 20180218908 - Bruce; Robert L. ; et al. | 2018-08-02 |
Plasma Shallow Doping And Wet Removal Of Depth Control Cap
App 20180218907 - Bruce; Robert L. ; et al. | 2018-08-02 |
Plasma Shallow Doping And Wet Removal Of Depth Control Cap
App 20180218909 - Bruce; Robert L. ; et al. | 2018-08-02 |
Interconnect Structure Including Airgaps And Substractively Etched Metal Lines
App 20180204759 - BRUCE; ROBERT L. ; et al. | 2018-07-19 |
Integration Of Confined Phase Change Memory With Threshold Switching Material
App 20180205017 - Bruce; Robert L. ; et al. | 2018-07-19 |
Nanoporous structures by reactive ion etching
Grant 9,977,002 - Astier , et al. May 22, 2 | 2018-05-22 |
Hydrofluorocarbon Gas-assisted Plasma Etch For Interconnect Fabrication
App 20180122649 - Bruce; Robert L. ; et al. | 2018-05-03 |
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication
Grant 9,934,984 - Bruce , et al. April 3, 2 | 2018-04-03 |
Pillar array structure with uniform and high aspect ratio nanometer gaps
Grant 9,868,119 - Astier , et al. January 16, 2 | 2018-01-16 |
Iii-v Extension By High Temperature Plasma Doping
App 20170373149 - Bruce; Robert L. ; et al. | 2017-12-28 |
Articles Including Ultra Low Dielectric Layers
App 20170365511 - Bruce; Robert L. ; et al. | 2017-12-21 |
Reduction Of Surface Nucleotide Hybridization By Optimizing A Biosensor Sensing Surface Area
App 20170349941 - Bruce; Robert L. ; et al. | 2017-12-07 |
Biosensor For Electrical Detection Of A Nucleotide Sequence
App 20170350855 - Bruce; Robert L. ; et al. | 2017-12-07 |
Biosensor For Optical Detection Of Nucleotide Sequence
App 20170350820 - Bruce; Robert L. ; et al. | 2017-12-07 |
Engineered Etched Interfaces For High Performance Junctions
App 20170287717 - BRUCE; Robert L. ; et al. | 2017-10-05 |
Method of manufacturing an ultra low dielectric layer
Grant 9,773,698 - Bruce , et al. September 26, 2 | 2017-09-26 |
Pillar Array Structure With Uniform And High Aspect Ratio Nanometer Gaps
App 20170205329 - Astier; Yann A. ; et al. | 2017-07-20 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170179023 - Bruce; Robert L. ; et al. | 2017-06-22 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170154815 - Bruce; Robert L. ; et al. | 2017-06-01 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 9,653,395 - Bruce , et al. May 16, 2 | 2017-05-16 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 9,646,881 - Bruce , et al. May 9, 2 | 2017-05-09 |
Pillar array structure with uniform and high aspect ratio nanometer gaps
Grant 9,636,675 - Astier , et al. May 2, 2 | 2017-05-02 |
Low energy etch process for nitrogen-containing dielectric layer
Grant 9,633,948 - Brink , et al. April 25, 2 | 2017-04-25 |
Ultra Low Dielectric Layer
App 20170092534 - Bruce; Robert L. ; et al. | 2017-03-30 |
Hydrofluorocarbon Gas-assisted Plasma Etch For Interconnect Fabrication
App 20170069508 - BRUCE; ROBERT L. ; et al. | 2017-03-09 |
WET CLEAN PROCESS FOR REMOVING CxHyFz ETCH RESIDUE
App 20170044470 - Bruce; Robert L. ; et al. | 2017-02-16 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170040213 - Bruce; Robert L. ; et al. | 2017-02-09 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170040258 - Bruce; Robert L. ; et al. | 2017-02-09 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170040257 - Bruce; Robert L. ; et al. | 2017-02-09 |
Wet clean process for removing C.sub.xH.sub.yF.sub.z etch residue
Grant 9,536,731 - Bruce , et al. January 3, 2 | 2017-01-03 |
Pillar Array Structure With Uniform And High Aspect Ratio Nanometer Gaps
App 20160146717 - Astier; Yann A. ; et al. | 2016-05-26 |
Pillar Array Structure With Uniform And High Aspect Ratio Nanometer Gaps
App 20160144361 - Astier; Yann A. ; et al. | 2016-05-26 |
Low Energy Etch Process For Nitrogen-containing Dielectric Layer
App 20160111374 - Brink; Markus ; et al. | 2016-04-21 |
Surface plasma modification of porous thin-films to optimize pore filling
Grant 9,214,335 - Bruce , et al. December 15, 2 | 2015-12-15 |
Thin Film Interconnects With Large Grains
App 20150348832 - Bruce; Robert L. ; et al. | 2015-12-03 |
Low energy etch process for nitrogen-containing dielectric layer
Grant 9,190,316 - Brink , et al. November 17, 2 | 2015-11-17 |
Surface Plasma Modification Of Porous Thin-films To Optimize Pore Filling
App 20150311066 - Bruce; Robert L. ; et al. | 2015-10-29 |
Nanoporous Structures By Reactive Ion Etching
App 20150268206 - Astier; Yann ; et al. | 2015-09-24 |
Interconnect Structure And Method For Fabricating On-chip Interconnect Structures By Image Reversal
App 20150270219 - BRUCE; ROBERT L. ; et al. | 2015-09-24 |
Silicon Substrate Preparation For Selective Iii-v Epitaxy
App 20150255281 - Bruce; Robert L. ; et al. | 2015-09-10 |
Nanoporous structures by reactive ion etching
Grant 9,117,652 - Astier , et al. August 25, 2 | 2015-08-25 |
Interconnect structure and method for fabricating on-chip interconnect structures by image reversal
Grant 9,054,160 - Bruce , et al. June 9, 2 | 2015-06-09 |
Method and apparatus for enabling internet-based emergency calls
Grant 9,042,298 - Bruce May 26, 2 | 2015-05-26 |
WET CLEAN PROCESS FOR REMOVING CxHyFz ETCH RESIDUE
App 20150118839 - Bruce; Robert L. ; et al. | 2015-04-30 |
Far back end of the line stack encapsulation
Grant 8,994,177 - Barwicz , et al. March 31, 2 | 2015-03-31 |
Semiconductor Device Having A Iii-v Crystalline Compound Material Selectively Grown On The Bottom Of A Space Formed In A Single Element Substrate.
App 20150048423 - Bruce; Robert L. ; et al. | 2015-02-19 |
A Method For Forming A Crystalline Compound Iii-v Material On A Single Element Substrate
App 20150048422 - Bruce; Robert L. ; et al. | 2015-02-19 |
Far back end of the line stack encapsulation
Grant 8,932,956 - Barwicz , et al. January 13, 2 | 2015-01-13 |
Overburden removal for pore fill integration approach
Grant 8,927,430 - Bruce , et al. January 6, 2 | 2015-01-06 |
Nanoporous Structures By Reactive Ion Etching
App 20140370326 - Astier; Yann ; et al. | 2014-12-18 |
Far Back End Of The Line Stack Encapsulation
App 20140151898 - Barwicz; Tymon ; et al. | 2014-06-05 |
Far Back End Of The Line Stack Encapsulation
App 20140151894 - Barwicz; Tymon ; et al. | 2014-06-05 |
Homogeneous porous low dielectric constant materials
Grant 8,492,239 - Bruce , et al. July 23, 2 | 2013-07-23 |
Low Energy Etch Process For Nitrogen-containing Dielectric Layer
App 20130105996 - Brink; Markus ; et al. | 2013-05-02 |
Overburden Removal For Pore Fill Integration Approach
App 20130017682 - Bruce; Robert L. ; et al. | 2013-01-17 |
Homogeneous Porous Low Dielectric Constant Materials
App 20120329273 - Bruce; Robert L. ; et al. | 2012-12-27 |
Ceramic joining
Grant 8,337,648 - Mako , et al. December 25, 2 | 2012-12-25 |
Method And Apparatus For Enabling Internet-based Emergency Calls
App 20120314625 - Bruce; Robert L. | 2012-12-13 |
Interconnect Structure And Method For Fabricating On-chip Interconnect Structures By Image Reversal
App 20120261828 - BRUCE; ROBERT L. ; et al. | 2012-10-18 |
Ceramic joining
App 20040154725 - Mako, Frederick M. ; et al. | 2004-08-12 |
Ceramic joining
Grant 6,692,597 - Mako , et al. February 17, 2 | 2004-02-17 |
Ceramic joining
App 20030102071 - Mako, Frederick M. ; et al. | 2003-06-05 |
Loop detector for traffic signal control
Grant 4,430,636 - Bruce February 7, 1 | 1984-02-07 |
Electro-optic distance measuring device
Grant 4,171,907 - Hill , et al. October 23, 1 | 1979-10-23 |
Method and apparatus for digitally controlling an amplitude modulated pulse envelope on an RF signal
Grant 4,039,951 - Bruce , et al. August 2, 1 | 1977-08-02 |
Single frequency radio ranging system
Grant 4,011,562 - Bruce March 8, 1 | 1977-03-08 |
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