Patent | Date |
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Method of Handling Power Control and Related Communication Device App 20190191389 - Fu; Yi-How ;   et al. | 2019-06-20 |
De-pop On-device Decoupling For Bga App 20150001716 - Chan; Alex ;   et al. | 2015-01-01 |
Thermal warp compensation IC package Grant 8,912,449 - Brown , et al. December 16, 2 | 2014-12-16 |
De-pop on-device decoupling for BGA Grant 8,863,071 - Chan , et al. October 14, 2 | 2014-10-14 |
In-grid on-device decoupling for BGA Grant 8,806,420 - Chan , et al. August 12, 2 | 2014-08-12 |
Land pattern for 0201 components on a 0.8 mm pitch array Grant 8,759,689 - Chan , et al. June 24, 2 | 2014-06-24 |
Thermal Warp Compensation Ic Package App 20130113067 - BROWN; Paul James ;   et al. | 2013-05-09 |
In-grid On-device Decoupling For Bga App 20130062762 - Chan; Alex ;   et al. | 2013-03-14 |
Warp reactive IC package Grant 8,389,864 - Brown , et al. March 5, 2 | 2013-03-05 |
0201 LAND PATTERN FOR 1.0 mm AND .08 mm PITCH ARRAYS App 20120168216 - Chan; Alex ;   et al. | 2012-07-05 |
Thermal Warp Compensation Ic Package App 20120081872 - BROWN; Paul James ;   et al. | 2012-04-05 |
Warp Reactive Ic Package App 20120081871 - Brown; Paul James ;   et al. | 2012-04-05 |
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid Grant 7,714,234 - Brown May 11, 2 | 2010-05-11 |
Emergency alert system enhancement using alert server and metro ATM network for DSL deployment Grant 7,697,558 - Pilon , et al. April 13, 2 | 2010-04-13 |
Printed circuit board thickness adaptors Grant 7,663,888 - Creasy , et al. February 16, 2 | 2010-02-16 |
In-grid decoupling for ball grid array (BGA) devices Grant 7,602,615 - Chan , et al. October 13, 2 | 2009-10-13 |
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid App 20080225502 - Brown; Paul James | 2008-09-18 |
Emergency alert system enhancement using alert server and metro ATM network for DSL deployment App 20080225848 - Pilon; Mark Christopher ;   et al. | 2008-09-18 |
In-grid decoupling for ball grid array (BGA) devices App 20080205011 - Chan; Alex ;   et al. | 2008-08-28 |
Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels) Grant 7,368,667 - Brown May 6, 2 | 2008-05-06 |
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid Grant 7,365,435 - Brown April 29, 2 | 2008-04-29 |
Area array routing masks for improved escape of devices on PCB Grant 7,343,577 - Brown March 11, 2 | 2008-03-11 |
Printed circuit board thickness adaptors App 20080013290 - Creasy; Simon Paul ;   et al. | 2008-01-17 |
Area array routing masks for improved escape of devices on PCB App 20070057362 - Brown; Paul James | 2007-03-15 |
Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels) App 20070034405 - Brown; Paul James | 2007-02-15 |
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid App 20070035005 - Brown; Paul James | 2007-02-15 |