loadpatents
name:-0.021660804748535
name:-0.012969017028809
name:-0.0026729106903076
BROWN; Paul James Patent Filings

BROWN; Paul James

Patent Applications and Registrations

Patent applications and USPTO patent grants for BROWN; Paul James.The latest application filed is for "method of handling power control and related communication device".

Company Profile
1.17.16
  • BROWN; Paul James - Taoyuan City TW
  • Brown; Paul James - Ottawa CA
  • Brown; Paul James - Wakefield N/A CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of Handling Power Control and Related Communication Device
App 20190191389 - Fu; Yi-How ;   et al.
2019-06-20
De-pop On-device Decoupling For Bga
App 20150001716 - Chan; Alex ;   et al.
2015-01-01
Thermal warp compensation IC package
Grant 8,912,449 - Brown , et al. December 16, 2
2014-12-16
De-pop on-device decoupling for BGA
Grant 8,863,071 - Chan , et al. October 14, 2
2014-10-14
In-grid on-device decoupling for BGA
Grant 8,806,420 - Chan , et al. August 12, 2
2014-08-12
Land pattern for 0201 components on a 0.8 mm pitch array
Grant 8,759,689 - Chan , et al. June 24, 2
2014-06-24
Thermal Warp Compensation Ic Package
App 20130113067 - BROWN; Paul James ;   et al.
2013-05-09
In-grid On-device Decoupling For Bga
App 20130062762 - Chan; Alex ;   et al.
2013-03-14
Warp reactive IC package
Grant 8,389,864 - Brown , et al. March 5, 2
2013-03-05
0201 LAND PATTERN FOR 1.0 mm AND .08 mm PITCH ARRAYS
App 20120168216 - Chan; Alex ;   et al.
2012-07-05
Thermal Warp Compensation Ic Package
App 20120081872 - BROWN; Paul James ;   et al.
2012-04-05
Warp Reactive Ic Package
App 20120081871 - Brown; Paul James ;   et al.
2012-04-05
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
Grant 7,714,234 - Brown May 11, 2
2010-05-11
Emergency alert system enhancement using alert server and metro ATM network for DSL deployment
Grant 7,697,558 - Pilon , et al. April 13, 2
2010-04-13
Printed circuit board thickness adaptors
Grant 7,663,888 - Creasy , et al. February 16, 2
2010-02-16
In-grid decoupling for ball grid array (BGA) devices
Grant 7,602,615 - Chan , et al. October 13, 2
2009-10-13
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
App 20080225502 - Brown; Paul James
2008-09-18
Emergency alert system enhancement using alert server and metro ATM network for DSL deployment
App 20080225848 - Pilon; Mark Christopher ;   et al.
2008-09-18
In-grid decoupling for ball grid array (BGA) devices
App 20080205011 - Chan; Alex ;   et al.
2008-08-28
Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)
Grant 7,368,667 - Brown May 6, 2
2008-05-06
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
Grant 7,365,435 - Brown April 29, 2
2008-04-29
Area array routing masks for improved escape of devices on PCB
Grant 7,343,577 - Brown March 11, 2
2008-03-11
Printed circuit board thickness adaptors
App 20080013290 - Creasy; Simon Paul ;   et al.
2008-01-17
Area array routing masks for improved escape of devices on PCB
App 20070057362 - Brown; Paul James
2007-03-15
Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)
App 20070034405 - Brown; Paul James
2007-02-15
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
App 20070035005 - Brown; Paul James
2007-02-15

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