| Patent | Date |
|---|
Carbon Dioxide Capture System And Method With Mass Transfer Contactor
App 20220023794 - Panaccione; Charles ; et al. | 2022-01-27 |
Carbon dioxide capture system and method with mass transfer contactor
Grant 11,167,236 - Panaccione , et al. November 9, 2 | 2021-11-09 |
Carbon Dioxide Capture System And Spectroscopic Evaluation Thereof
App 20210308616 - Panaccione; Charles ; et al. | 2021-10-07 |
Carbon dioxide capture system and spectroscopic evaluation thereof
Grant 11,014,041 - Panaccione , et al. May 25, 2 | 2021-05-25 |
Carbon Dioxide Capture System And Spectroscopic Evaluation Thereof
App 20200009499 - Panaccione; Charles ; et al. | 2020-01-09 |
Carbon Dioxide Capture System And Method With Mass Transfer Contactor
App 20190374898 - PANACCIONE; CHARLES ; et al. | 2019-12-12 |
Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
Grant 8,268,115 - Brown September 18, 2 | 2012-09-18 |
Differential Pressure Application Apparatus For Use In Polishing Layers Of Semiconductor Device Structures And Methods
App 20110239876 - Brown; Nathan R. | 2011-10-06 |
Methods for polishing semiconductor device structures by differentially applying pressure to substrates that carry the semiconductor device structures
Grant 7,947,190 - Brown May 24, 2 | 2011-05-24 |
Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
Grant 7,935,216 - Brown May 3, 2 | 2011-05-03 |
Systems including differential pressure application apparatus
Grant 7,285,037 - Brown October 23, 2 | 2007-10-23 |
Systems including differential pressure application apparatus
App 20060199474 - Brown; Nathan R. | 2006-09-07 |
Polishing carrier head with a modified pressure profile
Grant 7,074,118 - Bottema , et al. July 11, 2 | 2006-07-11 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
Grant 7,066,791 - Brown June 27, 2 | 2006-06-27 |
Systems including differential pressure application apparatus
Grant 7,059,937 - Brown June 13, 2 | 2006-06-13 |
Systems including differential pressure application apparatus
App 20050229369 - Brown, Nathan R. | 2005-10-20 |
Differential pressure application apparatus for use in polishing layers of semiconductor device structures and method
App 20050142807 - Brown, Nathan R. | 2005-06-30 |
Polishing systems for use with semiconductor substrates including differential pressure application apparatus
Grant 6,899,607 - Brown May 31, 2 | 2005-05-31 |
Chemical mechanical polish (CMP) conditioning-disk holder
Grant 6,887,138 - Bottema , et al. May 3, 2 | 2005-05-03 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
Grant 6,881,134 - Brown April 19, 2 | 2005-04-19 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
Grant 6,872,131 - Brown March 29, 2 | 2005-03-29 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
Grant 6,869,345 - Brown March 22, 2 | 2005-03-22 |
Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
Grant 6,863,771 - Brown March 8, 2 | 2005-03-08 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
Grant 6,852,017 - Brown February 8, 2 | 2005-02-08 |
Chemical mechanical polish (CMP) conditioning-disk holder
App 20040259487 - Bottema, Brian E. ; et al. | 2004-12-23 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
App 20040116050 - Brown, Nathan R. | 2004-06-17 |
Methods for polishing semiconductor device structures by differentially applying pressure to substrates that carry the semiconductor device structures
App 20040108064 - Brown, Nathan R. | 2004-06-10 |
Polishing systems for use with semiconductor substrates including differential pressure application apparatus
App 20040102144 - Brown, Nathan R. | 2004-05-27 |
Methods for determining amounts and locations of differential pressure to be applied to semiconductor substrates during polishing of semiconductor device structures carried thereby and for subsequently polishing similar semiconductor device structures
App 20040094269 - Brown, Nathan R. | 2004-05-20 |
Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
Grant 6,722,963 - Brown April 20, 2 | 2004-04-20 |
Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
App 20030019577 - Brown, Nathan R. | 2003-01-30 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
App 20020006773 - Brown, Nathan R. | 2002-01-17 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
App 20010041519 - Brown, Nathan R. | 2001-11-15 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
App 20010039169 - Brown, Nathan R. | 2001-11-08 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
App 20010039173 - Brown, Nathan R. | 2001-11-08 |
| 