Brown; Candice H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brown; Candice H..The latest application filed is for "high resolution low power consumption oled display with extended lifetime".

Company Profile

0.9.4

Brown; Candice H. - Sebastopol CA
Brown; Candice H. - Portland OR
Brown; Candice H. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High resolution low power consumption OLED display with extended lifetime Grant 10,229,956 - Hack , et al.	2019-03-12
High Resolution Low Power Consumption Oled Display With Extended Lifetime App 20170287987 - HACK; Michael ; et al.	2017-10-05
High Resolution Low Power Consumption Oled Display With Extended Lifetime App 20170229520 - HACK; Michael ; et al.	2017-08-10
High Resolution Low Power Consumption Oled Display With Extended Lifetime App 20160218150 - HACK; Michael ; et al.	2016-07-28
High Resolution Low Power Consumption Oled Display With Extended Lifetime App 20150349034 - HACK; Michael ; et al.	2015-12-03
Die bonding connector and method Grant 5,426,266 - Brown , et al. June 20, 1	1995-06-20
High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package Grant 4,931,852 - Brown , et al. June 5, 1	1990-06-05
Thermal expansion compensated metal lead frame for integrated circuit package Grant 4,918,511 - Brown April 17, 1	1990-04-17
Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts Grant 4,820,976 - Brown April 11, 1	1989-04-11
Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers Grant 4,801,999 - Hayward , et al. January 31, 1	1989-01-31
Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom Grant 4,729,061 - Brown March 1, 1	1988-03-01
Method of making a package utilizing a self-aligning photoexposure process Grant 4,640,010 - Brown February 3, 1	1987-02-03
Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein Grant 4,616,406 - Brown October 14, 1	1986-10-14

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