Brouillette; Guy P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Brouillette; Guy P..The latest application filed is for "method for direct chip attach by solder bumps and an underfill layer".
- Brouillette; Guy P. - Canton Shefford CA
- Brouillette, Guy P. - Saefford CA
| Patent | Date |
|---|---|
| Method for direct chip attach by solder bumps and an underfill layer Grant 6,566,612 - Brouillette , et al. May 20, 2 | 2003-05-20 |
| Method for direct chip attach by solder bumps and an underfill layer App 20020062556 - Brouillette, Guy P. ; et al. | 2002-05-30 |
| Low temperature solder column attach by injection molded solder and structure formed App 20020023945 - Gruber, Peter A. ; et al. | 2002-02-28 |
| Method for direct chip attach by solder bumps and an underfill layer Grant 6,341,418 - Brouillette , et al. January 29, 2 | 2002-01-29 |
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