loadpatents
name:-0.0036540031433105
name:-0.0066549777984619
name:-0.0020101070404053
Brotman; Andy Patent Filings

Brotman; Andy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brotman; Andy.The latest application filed is for "redistribution metal and under bump metal interconnect structures and method".

Company Profile
1.5.3
  • Brotman; Andy - Irvine CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Redistribution metal and under bump metal interconnect structures and method
Grant 11,049,829 - Zhao , et al. June 29, 2
2021-06-29
Redistribution Metal And Under Bump Metal Interconnect Structures And Method
App 20200105698 - Zhao; Sam Ziqun ;   et al.
2020-04-02
Redistribution metal and under bump metal interconnect structures and method
Grant 10,504,862 - Zhao , et al. Dec
2019-12-10
Redistribution Metal And Under Bump Metal Interconnect Structures And Method
App 20190123007 - Zhao; Sam Ziqun ;   et al.
2019-04-25
Method and system for predictive multi-component circuit layout generation with reduced design cycle
Grant 6,839,887 - Lampaer , et al. January 4, 2
2005-01-04
Method and system for predictive MOSFET layout generation with reduced design cycle
Grant 6,728,942 - Lampaert , et al. April 27, 2
2004-04-27
Method and system for predictive layout generation for inductors with reduced design cycle
Grant 6,588,002 - Lampaert , et al. July 1, 2
2003-07-01
Method and system for pedictive MOSFET layout generation with reduced design cycle
App 20020188920 - Lampaert, Koen ;   et al.
2002-12-12

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