Brooks; J. Mike

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brooks; J. Mike.The latest application filed is for "packaged microelectronic devices and methods for packaging microelectronic devices".

Company Profile

0.11.12

Brooks; J. Mike - Caldwell ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers Grant 8,092,734 - Jiang , et al. January 10, 2	2012-01-10
Packaged Microelectronic Devices And Methods For Packaging Microelectronic Devices App 20080132006 - Jiang; Tongbi ; et al.	2008-06-05
Packaged Microelectronic Devices And Methods For Packaging Microelectronic Devices App 20080099917 - Jiang; Tongbi ; et al.	2008-05-01
Packaged microelectronic devices and methods for packaging microelectronic devices Grant 7,312,101 - Jiang , et al. December 25, 2	2007-12-25
Packaged microelectronic devices and methods for packaging microelectronic devices App 20060030150 - Jiang; Tongbi ; et al.	2006-02-09
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers App 20050253213 - Jiang, Tongbi ; et al.	2005-11-17
Semiconductor device structure with adhesion-enhanced semiconductor die App 20050253243 - King, Jerrold L. ; et al.	2005-11-17
Adhesion enhanced semiconductor die for mold compound packaging App 20050001295 - King, Jerrold L. ; et al.	2005-01-06
Packaged microelectronic devices and methods for packaging microelectronic devices App 20040214373 - Jiang, Tongbi ; et al.	2004-10-28
Adhesion enhanced semiconductor die for mold compound packaging Grant 6,740,545 - King , et al. May 25, 2	2004-05-25
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,699,734 - Schoenfeld , et al. March 2, 2	2004-03-02
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,600,215 - Schoenfeld , et al. July 29, 2	2003-07-29
Method and apparatus for coupling a semiconductor die to die terminals App 20030113953 - Schoenfeld, Aaron ; et al.	2003-06-19
Adhesion enhanced semiconductor die for mold compound packaging App 20030082849 - King, Jerrold L. ; et al.	2003-05-01
Integrated circuit device having cyanate ester buffer coat and method of fabricating same App 20020195687 - Brooks, J. Mike ; et al.	2002-12-26
Method of forming an integrated circuit device having cyanate ester buffer coat Grant 6,420,214 - Brooks , et al. July 16, 2	2002-07-16
Method and apparatus for coupling a semiconductor die to die terminals App 20010052638 - Schoenfeld, Aaron ; et al.	2001-12-20
Adhesion enhanced semiconductor die for mold compound packaging App 20010024840 - King, Jerrold L. ; et al.	2001-09-27
Adhesion enhanced semiconductor die for mold compound packaging Grant 6,066,514 - King , et al. May 23, 2	2000-05-23
Semiconductor device having ball-bonded pads Grant 6,043,564 - Brooks , et al. March 28, 2	2000-03-28
Integrated circuit device having cyanate ester buffer coat Grant 5,903,046 - Brooks , et al. May 11, 1	1999-05-11
Semiconductor device having ball-bonded pads Grant 5,824,569 - Brooks , et al. October 20, 1	1998-10-20
Adhesion enhanced semiconductor die for mold compound packaging Grant 5,583,372 - King , et al. December 10, 1	1996-12-10

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