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Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers Grant 8,092,734 - Jiang , et al. January 10, 2 | 2012-01-10 |
Packaged Microelectronic Devices And Methods For Packaging Microelectronic Devices App 20080132006 - Jiang; Tongbi ;   et al. | 2008-06-05 |
Packaged Microelectronic Devices And Methods For Packaging Microelectronic Devices App 20080099917 - Jiang; Tongbi ;   et al. | 2008-05-01 |
Packaged microelectronic devices and methods for packaging microelectronic devices Grant 7,312,101 - Jiang , et al. December 25, 2 | 2007-12-25 |
Packaged microelectronic devices and methods for packaging microelectronic devices App 20060030150 - Jiang; Tongbi ;   et al. | 2006-02-09 |
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers App 20050253213 - Jiang, Tongbi ;   et al. | 2005-11-17 |
Semiconductor device structure with adhesion-enhanced semiconductor die App 20050253243 - King, Jerrold L. ;   et al. | 2005-11-17 |
Adhesion enhanced semiconductor die for mold compound packaging App 20050001295 - King, Jerrold L. ;   et al. | 2005-01-06 |
Packaged microelectronic devices and methods for packaging microelectronic devices App 20040214373 - Jiang, Tongbi ;   et al. | 2004-10-28 |
Adhesion enhanced semiconductor die for mold compound packaging Grant 6,740,545 - King , et al. May 25, 2 | 2004-05-25 |
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,699,734 - Schoenfeld , et al. March 2, 2 | 2004-03-02 |
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,600,215 - Schoenfeld , et al. July 29, 2 | 2003-07-29 |
Method and apparatus for coupling a semiconductor die to die terminals App 20030113953 - Schoenfeld, Aaron ;   et al. | 2003-06-19 |
Adhesion enhanced semiconductor die for mold compound packaging App 20030082849 - King, Jerrold L. ;   et al. | 2003-05-01 |
Integrated circuit device having cyanate ester buffer coat and method of fabricating same App 20020195687 - Brooks, J. Mike ;   et al. | 2002-12-26 |
Method of forming an integrated circuit device having cyanate ester buffer coat Grant 6,420,214 - Brooks , et al. July 16, 2 | 2002-07-16 |
Method and apparatus for coupling a semiconductor die to die terminals App 20010052638 - Schoenfeld, Aaron ;   et al. | 2001-12-20 |
Adhesion enhanced semiconductor die for mold compound packaging App 20010024840 - King, Jerrold L. ;   et al. | 2001-09-27 |
Adhesion enhanced semiconductor die for mold compound packaging Grant 6,066,514 - King , et al. May 23, 2 | 2000-05-23 |
Semiconductor device having ball-bonded pads Grant 6,043,564 - Brooks , et al. March 28, 2 | 2000-03-28 |
Integrated circuit device having cyanate ester buffer coat Grant 5,903,046 - Brooks , et al. May 11, 1 | 1999-05-11 |
Semiconductor device having ball-bonded pads Grant 5,824,569 - Brooks , et al. October 20, 1 | 1998-10-20 |
Adhesion enhanced semiconductor die for mold compound packaging Grant 5,583,372 - King , et al. December 10, 1 | 1996-12-10 |