| Patent | Date |
|---|
Microlens Arrays For Parallel Micropatterning
App 20220266385 - BRODOCEANU; Daniel ; et al. | 2022-08-25 |
Hybrid interconnect for laser bonding using nanoporous metal tips
Grant 11,424,214 - Brodoceanu , et al. August 23, 2 | 2022-08-23 |
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
Grant 11,404,600 - Wu , et al. August 2, 2 | 2022-08-02 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
Grant 11,374,148 - Brodoceanu , et al. June 28, 2 | 2022-06-28 |
Flexible interconnect using conductive adhesive
Grant 11,349,053 - Chio , et al. May 31, 2 | 2022-05-31 |
Microlens arrays for parallel micropatterning
Grant 11,344,971 - Brodoceanu , et al. May 31, 2 | 2022-05-31 |
Liquid crystalline elastomer for pick and place of semiconductor devices
Grant 11,328,942 - Wallin , et al. May 10, 2 | 2022-05-10 |
Magnetic clamping interconnects
Grant 11,296,268 - Sengul , et al. April 5, 2 | 2022-04-05 |
Bonding dummy electrodes of light emitting diode chip to substrate
Grant 11,276,672 - Wu , et al. March 15, 2 | 2022-03-15 |
Bonding corners of light emitting diode chip to substrate using laser
Grant 11,255,529 - Wu , et al. February 22, 2 | 2022-02-22 |
Curved pillar interconnects
Grant 11,239,400 - Chio , et al. February 1, 2 | 2022-02-01 |
Etchant-accessible carrier substrate for display manufacture
Grant 11,152,533 - Thompson , et al. October 19, 2 | 2021-10-19 |
Fluidic pick-up head for assembling light emitting diodes
Grant 11,107,948 - Menguc , et al. August 31, 2 | 2021-08-31 |
Pickup head with photocurable polymers for assembling light emitting diodes
Grant 11,101,159 - Brodoceanu , et al. August 24, 2 | 2021-08-24 |
Using Underfill Or Flux To Promote Placing And Parallel Bonding Of Light Emitting Diodes
App 20210210667 - Brodoceanu; Daniel ; et al. | 2021-07-08 |
Micro light emitting diode with remnants of fabrication substrate for structural support
Grant 11,011,687 - Pourchet , et al. May 18, 2 | 2021-05-18 |
Optics formation using pick-up tools
Grant 11,005,014 - Brodoceanu , et al. May 11, 2 | 2021-05-11 |
Laser-induced selective heating for microLED placement and bonding
Grant 10,998,286 - Brodoceanu , et al. May 4, 2 | 2021-05-04 |
Monitoring dry-etching of polymer layer for transferring semiconductor devices
Grant 10,998,215 - Brodoceanu May 4, 2 | 2021-05-04 |
Atomic force microscopy tips for interconnection
Grant 10,989,735 - Sengul , et al. April 27, 2 | 2021-04-27 |
Using underfill or flux to promote placing and parallel bonding of light emitting diodes
Grant 10,964,867 - Brodoceanu , et al. March 30, 2 | 2021-03-30 |
Atomic Force Microscopy Tips For Interconnection
App 20210055327 - Sengul; Ali ; et al. | 2021-02-25 |
Molded etch masks
Grant 10,910,514 - Brodoceanu , et al. February 2, 2 | 2021-02-02 |
Curing Pre-applied And Laser-ablated Underfill Via A Laser
App 20200395503 - Wu; Jeb ; et al. | 2020-12-17 |
Selectively Bonding Light-emitting Devices Via A Pulsed Laser
App 20200395521 - Brodoceanu; Daniel ; et al. | 2020-12-17 |
Dielectric-dielectric And Metallization Bonding Via Plasma Activation And Laser-induced Heating
App 20200395520 - Brodoceanu; Daniel ; et al. | 2020-12-17 |
Employing Deformable Contacts And Pre-applied Underfill For Bonding Led Devices Via Lasers
App 20200395504 - Brodoceanu; Daniel ; et al. | 2020-12-17 |
Curing Pre-applied And Plasma-etched Underfill Via A Laser
App 20200395519 - Brodoceanu; Daniel ; et al. | 2020-12-17 |
Fabricating parabolic-shaped LEDs
Grant 10,840,418 - Massoubre , et al. November 17, 2 | 2020-11-17 |
Dry-etching of carrier substrate for microLED microassembly
Grant 10,832,933 - Brodoceanu , et al. November 10, 2 | 2020-11-10 |
Bridge Pick-up Head For Transferring Semiconductor Devices
App 20200343121 - Torrents Abad; Oscar ; et al. | 2020-10-29 |
Rigid pickup head with conformable layer
Grant 10,818,643 - Brodoceanu , et al. October 27, 2 | 2020-10-27 |
Laser lift-off masks
Grant 10,811,575 - Brodoceanu , et al. October 20, 2 | 2020-10-20 |
Elastomeric layer fabrication for light emitting diodes
Grant 10,685,946 - Brodoceanu , et al. | 2020-06-16 |
Using Underfill Or Flux To Promote Placing And Parallel Bonding Of Light Emitting Diodes
App 20200111939 - Brodoceanu; Daniel ; et al. | 2020-04-09 |
Method for polymer-assisted chip transfer
Grant 10,586,725 - Saketi , et al. | 2020-03-10 |
Dynamic adjustment of placement parameters for light emitting diodes
Grant 10,568,242 - Brodoceanu , et al. Feb | 2020-02-18 |
Method for polymer-assisted chip transfer
Grant 10,559,486 - Brodoceanu , et al. Feb | 2020-02-11 |
Optics Formation Using Pick-up Tools
App 20200035882 - Brodoceanu; Daniel ; et al. | 2020-01-30 |
Laser Lift-off Masks
App 20200035880 - Brodoceanu; Daniel ; et al. | 2020-01-30 |
Monitoring Dry-etching Of Polymer Layer For Transferring Semiconductor Devices
App 20200006108 - Brodoceanu; Daniel | 2020-01-02 |
Elastomeric Layer Fabrication For Light Emitting Diodes
App 20190333903 - Brodoceanu; Daniel ; et al. | 2019-10-31 |
Method for polymer-assisted chip transfer
Grant 10,388,516 - Abad , et al. A | 2019-08-20 |
Elastomeric layer fabrication for light emitting diodes
Grant 10,319,705 - Brodoceanu , et al. | 2019-06-11 |
Elastomeric Layer Fabrication For Light Emitting Diodes
App 20190148348 - Brodoceanu; Daniel ; et al. | 2019-05-16 |
Elastomeric Layer Fabrication For Light Emitting Diodes
App 20190123031 - Brodoceanu; Daniel ; et al. | 2019-04-25 |
Elastomeric layer fabrication for light emitting diodes
Grant 10,269,781 - Brodoceanu , et al. | 2019-04-23 |
Metal-nanoparticle-arrays And Production Of Metal-nanoparticle-arrays
App 20150321162 - BRODOCEANU; Daniel ; et al. | 2015-11-12 |
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