| Patent | Date |
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Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
Grant 6,709,565 - Mayer , et al. March 23, 2 | 2004-03-23 |
Passivation of copper in dual damascene metalization
Grant 6,554,914 - Rozbicki , et al. April 29, 2 | 2003-04-29 |
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
App 20020074238 - Mayer, Steven T. ; et al. | 2002-06-20 |
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
Grant 6,162,344 - Reid , et al. December 19, 2 | 2000-12-19 |
Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer
Grant 6,110,346 - Reid , et al. August 29, 2 | 2000-08-29 |
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
Grant 6,074,544 - Reid , et al. June 13, 2 | 2000-06-13 |
Electroplating system with shields for varying thickness profile of deposited layer
Grant 6,027,631 - Broadbent February 22, 2 | 2000-02-22 |
Gas-based substrate deposition protection
Grant 5,925,411 - van de Ven , et al. July 20, 1 | 1999-07-20 |
Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatus
Grant 5,882,417 - van de Ven , et al. March 16, 1 | 1999-03-16 |
Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
Grant 5,843,233 - van de Ven , et al. December 1, 1 | 1998-12-01 |
Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
Grant 5,769,951 - van de Ven , et al. June 23, 1 | 1998-06-23 |
Method for preventing substrate backside deposition during a chemical vapor deposition operation
Grant 5,679,405 - Thomas , et al. October 21, 1 | 1997-10-21 |
Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
Grant 5,620,525 - van de Ven , et al. April 15, 1 | 1997-04-15 |
Method of generating plasma having high ion density for substrate processing operation
Grant 5,605,599 - Benzing , et al. February 25, 1 | 1997-02-25 |
Wafer surface protection in a gas deposition process
Grant 5,578,532 - van de Ven , et al. November 26, 1 | 1996-11-26 |
Induction plasma source
Grant 5,405,480 - Benzing , et al. April 11, 1 | 1995-04-11 |
Gas-based backside protection during substrate processing
Grant 5,374,594 - van de Ven , et al. December 20, 1 | 1994-12-20 |
Induction plasma source
Grant 5,346,578 - Benzing , et al. September 13, 1 | 1994-09-13 |
Gas-based substrate protection during processing
Grant 5,238,499 - van de Ven , et al. August 24, 1 | 1993-08-24 |
Gas-based backside protection during substrate processing
Grant 5,230,741 - van de Ven , et al. * July 27, 1 | 1993-07-27 |
Sweeping method and magnet track apparatus for magnetron sputtering
Grant 5,188,717 - Broadbent , et al. February 23, 1 | 1993-02-23 |
Cooling method and apparatus for magnetron sputtering
Grant 5,171,415 - Miller , et al. December 15, 1 | 1992-12-15 |
Gas-based backside protection during substrate processing
Grant 5,133,284 - Thomas , et al. July 28, 1 | 1992-07-28 |
Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material
Grant 5,063,175 - Broadbent November 5, 1 | 1991-11-05 |
Electrical interconnection for semiconductor integrated circuits
Grant 4,612,257 - Broadbent September 16, 1 | 1986-09-16 |
Method for manufacturing an electrical interconnection by selective tungsten deposition
Grant 4,517,225 - Broadbent May 14, 1 | 1985-05-14 |
Variable rate semiconductor deposition process
Grant 4,495,221 - Broadbent January 22, 1 | 1985-01-22 |
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