Patent | Date |
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Computing a magnetic heading Grant 10,309,781 - Brist , et al. | 2019-06-04 |
Dynamically calibrating magnetic sensors Grant 9,939,497 - Brist , et al. April 10, 2 | 2018-04-10 |
Magnetometer unit for electronic devices Grant 9,816,814 - Daniel , et al. November 14, 2 | 2017-11-14 |
Magnetometer Unit For Electronic Devices App 20150377602 - DANIEL; KEVIN J. ;   et al. | 2015-12-31 |
Dynamically Calibrating Magnetic Sensors App 20140278190 - Brist; Gary A. ;   et al. | 2014-09-18 |
Computing A Magnetic Heading App 20140278222 - Brist; Gary A. ;   et al. | 2014-09-18 |
Method of forming a high speed interconnect Grant 8,732,942 - Hall , et al. May 27, 2 | 2014-05-27 |
Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method Grant 8,307,548 - Alger , et al. November 13, 2 | 2012-11-13 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 8,299,369 - Brist , et al. October 30, 2 | 2012-10-30 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 8,056,221 - Brist , et al. November 15, 2 | 2011-11-15 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect Grant 7,977,581 - Liang , et al. July 12, 2 | 2011-07-12 |
Method Of Making A Fiber Reinforced Printed Circuit Board Panel And A Fiber Reinforced Panel Made According To The Method App 20100328919 - Alger; William O. ;   et al. | 2010-12-30 |
Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method Grant 7,843,057 - Alger , et al. November 30, 2 | 2010-11-30 |
Method of power-ground plane partitioning to utilize channel/trenches Grant 7,797,826 - Brist , et al. September 21, 2 | 2010-09-21 |
Shifted Segment Layout For Differential Signal Traces To Mitigate Bundle Weave Effect App 20100202118 - Liang; Tao ;   et al. | 2010-08-12 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect Grant 7,723,618 - Liang , et al. May 25, 2 | 2010-05-25 |
Carrier substrate with a thermochromatic coating Grant 7,691,458 - Brist , et al. April 6, 2 | 2010-04-06 |
Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery App 20100038127 - Brist; Gary A. ;   et al. | 2010-02-18 |
Connecting a component with an embedded optical fiber Grant 7,630,601 - Mershon , et al. December 8, 2 | 2009-12-08 |
Quasi-waveguide printed circuit board structure App 20090080832 - Horine; Bryce D. ;   et al. | 2009-03-26 |
Embedded waveguide printed circuit board structure Grant 7,480,435 - Brist , et al. January 20, 2 | 2009-01-20 |
Shifted Segment Layout For Differential Signal Traces To Mitigate Bundle Weave Effect App 20080308306 - Liang; Tao ;   et al. | 2008-12-18 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect Grant 7,427,719 - Liang , et al. September 23, 2 | 2008-09-23 |
High Speed Interconnect App 20080172872 - Hall; Stephen H. ;   et al. | 2008-07-24 |
Connecting a component with an embedded optical fiber App 20080159689 - Mershon; Jayne L. ;   et al. | 2008-07-03 |
Connecting a component with an embedded optical fiber Grant 7,373,068 - Mershon , et al. May 13, 2 | 2008-05-13 |
Apparatus and method for an embedded air dielectric for a package and a printed circuit board Grant 7,361,842 - Brist , et al. April 22, 2 | 2008-04-22 |
Conductor trace design to reduce common mode cross-talk and timing skew Grant 7,343,576 - Brist , et al. March 11, 2 | 2008-03-11 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20080029296 - Brist; Gary A. ;   et al. | 2008-02-07 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20080029295 - Brist; Gary A. ;   et al. | 2008-02-07 |
Printed circuit board waveguide App 20070274656 - Brist; Gary A. ;   et al. | 2007-11-29 |
Moisture resistant printed circuit board App 20070235214 - Hall; Stephen H. ;   et al. | 2007-10-11 |
Shifted segment layout for differential signal traces to mitigate bundle weave effect App 20070223205 - Liang; Tao ;   et al. | 2007-09-27 |
Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 7,269,899 - Brist , et al. September 18, 2 | 2007-09-18 |
Connection of package, board, and flex cable Grant 7,249,955 - Horine , et al. July 31, 2 | 2007-07-31 |
Embedded waveguide printed circuit board structure App 20070154155 - Brist; Gary A. ;   et al. | 2007-07-05 |
Quasi-waveguide printed circuit board structure App 20070154157 - Horine; Bryce D. ;   et al. | 2007-07-05 |
High speed interconnect App 20070145595 - Hall; Stephen H. ;   et al. | 2007-06-28 |
Electrical socket with compressible domed contacts Grant 7,234,947 - Alger , et al. June 26, 2 | 2007-06-26 |
Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method App 20070110388 - Alger; William O. ;   et al. | 2007-05-17 |
Built up printed circuit boards App 20070037432 - Mershon; Jayne L. ;   et al. | 2007-02-15 |
Connecting A Component With An Embedded Optical Fiber App 20070025667 - Mershon; Jayne L. ;   et al. | 2007-02-01 |
Apparatus and method for an embedded air dielectric for a package and a printed circuit board App 20070000687 - Brist; Gary A. ;   et al. | 2007-01-04 |
Photo-thermal induced diffusion Grant 7,145,243 - Brist , et al. December 5, 2 | 2006-12-05 |
Electrical socket with compressible domed contacts App 20060258184 - Alger; William O. ;   et al. | 2006-11-16 |
Electrical socket with compressible domed contacts Grant 7,121,841 - Alger , et al. October 17, 2 | 2006-10-17 |
Connection of package, board, and flex cable App 20060148281 - Horine; Bryce D. ;   et al. | 2006-07-06 |
Photo-thermal induced diffusion Grant 7,064,063 - Brist , et al. June 20, 2 | 2006-06-20 |
Conductor trace design to reduce common mode cross-talk and timing skew App 20060123371 - Brist; Gary A. ;   et al. | 2006-06-08 |
Electrical socket with compressible domed contacts App 20060099835 - Alger; William O. ;   et al. | 2006-05-11 |
Conductor trace design to reduce common mode cross-talk and timing skew Grant 7,043,706 - Brist , et al. May 9, 2 | 2006-05-09 |
Printed circuit board trace routing method Grant 7,022,919 - Brist , et al. April 4, 2 | 2006-04-04 |
Carrier substrate with a thermochromatic coating App 20050221066 - Brist, Gary A. ;   et al. | 2005-10-06 |
Methods for forming electrical connections and resulting devices App 20050208749 - Beckman, Michael W. ;   et al. | 2005-09-22 |
Array socket with a dedicated power/ground conductor bus Grant 6,916,183 - Alger , et al. July 12, 2 | 2005-07-12 |
Waveguide in a printed circuit board and method of forming the same Grant 6,882,762 - Brist , et al. April 19, 2 | 2005-04-19 |
Optical fibers embedded in a printed circuit board App 20050063638 - Alger, William O. ;   et al. | 2005-03-24 |
Connecting a component with an embedded optical fiber App 20050063637 - Mershon, Jayne L. ;   et al. | 2005-03-24 |
Printed circuit board trace routing method App 20040262036 - Brist, Gary A. ;   et al. | 2004-12-30 |
Conductor trace design to reduce common mode cross-talk and timing skew App 20040181764 - Brist, Gary A. ;   et al. | 2004-09-16 |
Array socket with a dedicated power/ground conductor bus App 20040175966 - Alger, William O. ;   et al. | 2004-09-09 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 6,747,216 - Brist , et al. June 8, 2 | 2004-06-08 |
Photo-thermal induced diffusion App 20040058561 - Brist, Gary A. ;   et al. | 2004-03-25 |
Photo-thermal induced diffusion App 20040058521 - Brist, Gary A. ;   et al. | 2004-03-25 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20030205407 - Brist, Gary A. ;   et al. | 2003-11-06 |
Photo-thermal induced diffusion Grant 6,642,158 - Brist , et al. November 4, 2 | 2003-11-04 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20030146020 - Brist, Gary A. ;   et al. | 2003-08-07 |
Waveguide in a printed circuit board and method of forming the same App 20030059151 - Brist, Gary A. ;   et al. | 2003-03-27 |