| Patent | Date |
|---|
Arrangement for the protection of three-dimensional structures on wafers
Grant 7,514,798 - Brintzinger April 7, 2 | 2009-04-07 |
Process for producing layer structures for signal distribution
Grant 7,393,782 - Brintzinger , et al. July 1, 2 | 2008-07-01 |
Method for producing a rewiring printed circuit board
Grant 7,390,742 - Brintzinger , et al. June 24, 2 | 2008-06-24 |
Electronic component with compliant elevations having electrical contact areas and method for producing it
Grant 7,368,375 - Brintzinger , et al. May 6, 2 | 2008-05-06 |
Method for forming three-dimensional structures on a substrate
Grant 7,335,591 - Brintzinger , et al. February 26, 2 | 2008-02-26 |
Method for improving the mechanical properties of BOC module arrangements
Grant 7,332,430 - Brintzinger , et al. February 19, 2 | 2008-02-19 |
Process for producing metallic interconnects and contact surfaces on electronic components
Grant 7,271,095 - Brintzinger , et al. September 18, 2 | 2007-09-18 |
Arrangement and process for protecting fuses/anti-fuses
Grant 7,235,859 - Brintzinger , et al. June 26, 2 | 2007-06-26 |
Method for fabricating metallic interconnects on electronic components
Grant 7,172,966 - Brintzinger , et al. February 6, 2 | 2007-02-06 |
Connection between a semiconductor chip and an external conductor structure and method for producing it
Grant 7,169,647 - Trovarelli , et al. January 30, 2 | 2007-01-30 |
Method for protecting the redistribution layer on wafers/chips
Grant 7,115,496 - Brintzinger , et al. October 3, 2 | 2006-10-03 |
Method for producing a rewiring printed circuit board
App 20060121257 - Brintzinger; Axel ; et al. | 2006-06-08 |
Arrangement for reducing the electrical crosstalk on a chip
App 20050275085 - Brintzinger, Axel ; et al. | 2005-12-15 |
Process for producing a chip arrangement provided with a molding compound
App 20050277230 - Brintzinger, Axel ; et al. | 2005-12-15 |
Arrangement and process for protecting fuses/anti-fuses
App 20050258506 - Brintzinger, Axel ; et al. | 2005-11-24 |
Manufacturing of a corrosion protected interconnect on a substrate
Grant 6,943,101 - Brintzinger September 13, 2 | 2005-09-13 |
Process for producing layer structures for signal distribution
App 20050191837 - Brintzinger, Axel ; et al. | 2005-09-01 |
Method for fabricating metallic interconnects on electronic components
App 20050186786 - Brintzinger, Axel ; et al. | 2005-08-25 |
Process for producing metallic interconnects and contact surfaces on electronic components
App 20050186772 - Brintzinger, Axel ; et al. | 2005-08-25 |
Method for the solder-stop structuring of elevations on wafers
Grant 6,919,264 - Brintzinger , et al. July 19, 2 | 2005-07-19 |
Fabrication method for an interconnect on a substrate
Grant 6,911,390 - Brintzinger June 28, 2 | 2005-06-28 |
Electronic component with compliant elevations having electrical contact areas and method for producing it
App 20050127521 - Brintzinger, Axel ; et al. | 2005-06-16 |
Methods and apparatus for providing an antifuse function
Grant 6,882,027 - Brintzinger , et al. April 19, 2 | 2005-04-19 |
Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
Grant 6,866,943 - Friese , et al. March 15, 2 | 2005-03-15 |
Method for improving the mechanical properties of BOC module arrangements
App 20040259290 - Brintzinger, Axel ; et al. | 2004-12-23 |
Connection between a semiconductor chip and an external conductor structure and method for producing it
App 20040248341 - Trovarelli, Octavio ; et al. | 2004-12-09 |
Method for protecting the redistribution layer on wafers/chips
App 20040248343 - Brintzinger, Axel ; et al. | 2004-12-09 |
Methods and apparatus for providing an antifuse function
App 20040238919 - Brintzinger, Axel ; et al. | 2004-12-02 |
Method for forming three-dimensional structures on a substrate
App 20040166670 - Brintzinger, Axel ; et al. | 2004-08-26 |
Arrangement for the protection of three-dimensional structures on wafers
App 20040135252 - Brintzinger, Axel | 2004-07-15 |
Method for the solder-stop structuring of elevations on wafers
App 20040087131 - Brintzinger, Axel ; et al. | 2004-05-06 |
Bond Pad Structure Comprising Tungsten Or Tungsten Compound Layer On Top Of Metallization Level
App 20030203216 - Friese, Gerald ; et al. | 2003-10-30 |
Forming a structure on a wafer
Grant 6,638,870 - Brintzinger , et al. October 28, 2 | 2003-10-28 |
Forming a structure on a wafer
App 20030129841 - Brintzinger, Axel ; et al. | 2003-07-10 |
Interconnect on a substrate
App 20030127743 - Brintzinger, Axel | 2003-07-10 |
Fabrication method for an interconnect on a substrate
App 20030092274 - Brintzinger, Axel | 2003-05-15 |
Method For Fabricating An Integrated Circuit, In Particular An Antifuse
App 20020155678 - Brintzinger, Axel ; et al. | 2002-10-24 |
Method of forming a self-aligned antifuse link
Grant 6,465,282 - Tobben , et al. October 15, 2 | 2002-10-15 |
Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downs
Grant 6,436,585 - Narayan , et al. August 20, 2 | 2002-08-20 |
Electrical fuses for semiconductor devices
Grant 6,433,404 - Iyer , et al. August 13, 2 | 2002-08-13 |
Electrical fuses employing reverse biasing to enhance programming
Grant 6,323,535 - Iyer , et al. November 27, 2 | 2001-11-27 |
Mixed fuse technologies
Grant 6,288,436 - Narayan , et al. September 11, 2 | 2001-09-11 |
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