| Patent | Date |
|---|
Method Of Cmp Integration For Improved Optical Uniformity In Advanced Lcos Back-plane
App 20220223402 - Yu; Lan ; et al. | 2022-07-14 |
Selective Recessing To Form A Fully Aligned Via
App 20220181205 - Briggs; Benjamin D. ; et al. | 2022-06-09 |
Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather
Grant 11,348,060 - Briggs , et al. May 31, 2 | 2022-05-31 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 11,348,872 - Briggs , et al. May 31, 2 | 2022-05-31 |
Structure And Method Of Advanced Lcos Back-plane Having Highly Reflective Pixel Via Metallization
App 20220165912 - Yu; Lan ; et al. | 2022-05-26 |
Structure And Method Of Mirror Grounding In Lcos Devices
App 20220163707 - Yu; Lan ; et al. | 2022-05-26 |
Structure And Method Of Advanced Lcos Back-plane Having Robust Pixel Via Metallization
App 20220163845 - Yu; Lan ; et al. | 2022-05-26 |
Structure And Method Of Bi-layer Pixel Isolation In Advanced Lcos Back-plane
App 20220163834 - Yu; Lan ; et al. | 2022-05-26 |
Method For Lcos Dbr Multilayer Stack Protection Via Sacrificial Hardmask For Rie And Cmp Processes
App 20220163846 - Yu; Lan ; et al. | 2022-05-26 |
Adjustable via dimension and chamfer angle
Grant 11,276,636 - Clevenger , et al. March 15, 2 | 2022-03-15 |
Proximity correction in three-dimensional manufacturing
Grant 11,263,068 - Briggs , et al. March 1, 2 | 2022-03-01 |
Selective recessing to form a fully aligned via
Grant 11,257,717 - Briggs , et al. February 22, 2 | 2022-02-22 |
Encapsulation topography-assisted self-aligned MRAM top contact
Grant 11,195,993 - Rizzolo , et al. December 7, 2 | 2021-12-07 |
Motion-controlled portals in virtual reality
Grant 11,164,377 - Sipolins , et al. November 2, 2 | 2021-11-02 |
Semiconductor Device Including A Porous Dielectric Layer, And Method Of Forming The Semiconductor Device
App 20210335706 - Briggs; Benjamin D. ; et al. | 2021-10-28 |
Selective CVD alignment-mark topography assist for non-volatile memory
Grant 11,158,584 - Rizzolo , et al. October 26, 2 | 2021-10-26 |
Secure access for drone package delivery
Grant 11,138,890 - Briggs , et al. October 5, 2 | 2021-10-05 |
Method for using 3D positional spatial olfaction for virtual marketing
Grant 11,132,712 - Briggs , et al. September 28, 2 | 2021-09-28 |
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom
Grant 11,101,172 - Motoyama , et al. August 24, 2 | 2021-08-24 |
Optimizating Semiconductor Binning By Feed-forward Process Adjustment
App 20210249288 - Briggs; Benjamin D. ; et al. | 2021-08-12 |
Forming barrierless contact
Grant 11,081,388 - Choi , et al. August 3, 2 | 2021-08-03 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20210217653 - Penny; Christopher J. ; et al. | 2021-07-15 |
Optimizing semiconductor binning by feed-forward process adjustment
Grant 11,049,744 - Briggs , et al. June 29, 2 | 2021-06-29 |
Selective CVD alignment-mark topography assist for non-volatile memory
Grant 11,018,090 - Rizzolo , et al. May 25, 2 | 2021-05-25 |
Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material
Grant 11,004,790 - Briggs , et al. May 11, 2 | 2021-05-11 |
Top via process accounting for misalignment by increasing reliability
Grant 10,991,619 - Zhang , et al. April 27, 2 | 2021-04-27 |
Interconnect with self-forming wrap-all-around barrier layer
Grant 10,978,342 - Huang , et al. April 13, 2 | 2021-04-13 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 10,978,393 - Briggs , et al. April 13, 2 | 2021-04-13 |
Remote physical training
Grant 10,971,030 - Briggs , et al. April 6, 2 | 2021-04-06 |
Self aligned via and pillar cut for at least a self aligned double pitch
Grant 10,957,581 - Briggs , et al. March 23, 2 | 2021-03-23 |
Self aligned via and pillar cut for at least a self aligned double pitch
Grant 10,957,582 - Briggs , et al. March 23, 2 | 2021-03-23 |
Hybrid BEOL metallization utilizing selective reflection mask
Grant 10,957,646 - Briggs , et al. March 23, 2 | 2021-03-23 |
Encapsulation Topography-Assisted Self-Aligned MRAM Top Contact
App 20210083179 - Rizzolo; Michael ; et al. | 2021-03-18 |
Selective Recessing To Form A Fully Aligned Via
App 20210082758 - Briggs; Benjamin D. ; et al. | 2021-03-18 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,943,866 - Briggs , et al. March 9, 2 | 2021-03-09 |
Semiconductor Interconnect Structure With Double Conductors
App 20210043563 - Briggs; Benjamin D. ; et al. | 2021-02-11 |
Paint on micro chip touch screens
Grant 10,915,620 - Ashoori , et al. February 9, 2 | 2021-02-09 |
Back end of line electrical fuse structure and method of fabrication
Grant 10,916,501 - Briggs , et al. February 9, 2 | 2021-02-09 |
Dynamic rigidity mechanism
Grant 10,912,986 - Briggs , et al. February 9, 2 | 2021-02-09 |
Adjustable Via Dimension and Chamfer Angle
App 20210035904 - Clevenger; Lawrence A. ; et al. | 2021-02-04 |
Extreme ultraviolet (EUV) lithography patterning methods utilizing EUV resist hardening
Grant 10,901,317 - Briggs , et al. January 26, 2 | 2021-01-26 |
Self-aligned Contact Scheme For Pillar-based Memory Elements
App 20210020508 - Briggs; Benjamin D. ; et al. | 2021-01-21 |
Self-forming Barrier For Use In Air Gap Formation
App 20200402849 - Briggs; Benjamin D. ; et al. | 2020-12-24 |
Ion Implantation Assisted Curing For Flowable Porous Dielectrics
App 20200388531 - Sil; Devika ; et al. | 2020-12-10 |
Magnetic tunnel junction performance monitoring based on magnetic field coupling
Grant 10,830,841 - Lanzillo , et al. November 10, 2 | 2020-11-10 |
Selective recessing to form a fully aligned via
Grant 10,832,952 - Briggs , et al. November 10, 2 | 2020-11-10 |
Top Via Process Accounting For Misalignment By Increasing Reliability
App 20200335393 - Zhang; Chen ; et al. | 2020-10-22 |
Auto-incorrect in chatbot human-machine interfaces
Grant 10,812,417 - Briggs , et al. October 20, 2 | 2020-10-20 |
Low Aspect Ratio Interconnect
App 20200328156 - Briggs; Benjamin D. ; et al. | 2020-10-15 |
Semiconductor interconnect structure with double conductors
Grant 10,804,193 - Briggs , et al. October 13, 2 | 2020-10-13 |
Magnetic tunnel junction with low series resistance
Grant 10,796,833 - Lanzillo , et al. October 6, 2 | 2020-10-06 |
Semiconductor Device With Selective Insulator For Improved Capacitance
App 20200303239 - Penny; Christopher J. ; et al. | 2020-09-24 |
Self-aligned airgaps with conductive lines and vias
Grant 10,784,156 - Briggs , et al. Sept | 2020-09-22 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,784,197 - Briggs , et al. Sept | 2020-09-22 |
Semiconductor device with selective dielectric deposition
Grant 10,777,411 - Nguyen , et al. Sept | 2020-09-15 |
Self-forming barrier for use in air gap formation
Grant 10,763,166 - Briggs , et al. Sep | 2020-09-01 |
Semiconductor device with selective insulator for improved capacitance
Grant 10,763,160 - Penny , et al. Sep | 2020-09-01 |
Accelerated wafer testing using non-destructive and localized stress
Grant 10,746,782 - Briggs , et al. A | 2020-08-18 |
Medication scheduling and alerts
Grant 10,747,850 - Ashoori , et al. A | 2020-08-18 |
Accelerated wafer testing using non-destructive and localized stress
Grant 10,739,397 - Briggs , et al. A | 2020-08-11 |
Fully aligned semiconductor device with a skip-level via
Grant 10,741,751 - Lanzillo , et al. A | 2020-08-11 |
Top via back end of the line interconnect integration
Grant 10,734,277 - Yang , et al. | 2020-08-04 |
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom
App 20200243379 - Motoyama; Koichi ; et al. | 2020-07-30 |
Interconnect with Self-Forming Wrap-All-Around Barrier Layer
App 20200243383 - Huang; Huai ; et al. | 2020-07-30 |
Structure and method for forming fully-aligned trench with an up-via integration scheme
Grant 10,727,124 - Clevenger , et al. | 2020-07-28 |
Forming High Carbon Content Flowable Dielectric Film With Low Processing Damage
App 20200234949 - Briggs; Benjamin D. ; et al. | 2020-07-23 |
Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield
Grant 10,720,567 - Briggs , et al. | 2020-07-21 |
Forming Barrierless Contact
App 20200227313 - Choi; Kisik ; et al. | 2020-07-16 |
Non-intrusive unmanned entity inspection
Grant 10,676,216 - Chan , et al. | 2020-06-09 |
Capacitance reduction in sea of lines BEOL metallization
Grant 10,679,934 - Briggs , et al. | 2020-06-09 |
Hybrid Beol Metallization Utilizing Selective Reflection Mask
App 20200176388 - BRIGGS; Benjamin D. ; et al. | 2020-06-04 |
Low aspect ratio interconnect
Grant 10,672,707 - Briggs , et al. | 2020-06-02 |
Back End Of Line Electrical Fuse Structure And Method Of Fabrication
App 20200161239 - Briggs; Benjamin D. ; et al. | 2020-05-21 |
Top Via Back End Of The Line Interconnect Integration
App 20200161175 - Yang; Chih-Chao ; et al. | 2020-05-21 |
Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array
Grant 10,658,585 - Ando , et al. | 2020-05-19 |
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom
Grant 10,658,233 - Motoyama , et al. | 2020-05-19 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,651,078 - Penny , et al. | 2020-05-12 |
Structure And Method For Forming Fully-aligned Trench With An Up-via Integration Scheme
App 20200135560 - Clevenger; Lawrence A. ; et al. | 2020-04-30 |
Fully Aligned Semiconductor Device With A Skip-level Via
App 20200136028 - Lanzillo; Nicholas A. ; et al. | 2020-04-30 |
Selective recessing to form a fully aligned via
Grant 10,636,706 - Briggs , et al. | 2020-04-28 |
Cognitive System For Localized Lidar Pollution Detection Using Autonomous Vehicles
App 20200125969 - Briggs; Benjamin D. ; et al. | 2020-04-23 |
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom
App 20200126854 - Motoyama; Koichi ; et al. | 2020-04-23 |
Non-intrusive unmanned entity inspection
Grant 10,629,009 - Chan , et al. | 2020-04-21 |
Dual-damascene formation with dielectric spacer and thin liner
Grant 10,629,478 - Briggs , et al. | 2020-04-21 |
Back end of line electrical fuse structure and method of fabrication
Grant 10,615,119 - Briggs , et al. | 2020-04-07 |
Computer-mediated reality including physical damping feedback
Grant 10,606,231 - Briggs , et al. | 2020-03-31 |
Magnetic Tunnel Junction With Low Series Resistance
App 20200098499 - Lanzillo; Nicholas A. ; et al. | 2020-03-26 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20200091079 - Briggs; Benjamin D. ; et al. | 2020-03-19 |
Fold over emitter and collector field emission transistor
Grant 10,593,506 - Briggs , et al. | 2020-03-17 |
Proximity Correction In Three-dimensional Manufacturing
App 20200081761 - Briggs; Benjamin D. ; et al. | 2020-03-12 |
Hybrid BEOL metallization utilizing selective reflection mask
Grant 10,586,767 - Briggs , et al. | 2020-03-10 |
Sentiment analysis of mental health disorder symptoms
Grant 10,580,435 - Ashoori , et al. | 2020-03-03 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 10,580,740 - Briggs , et al. | 2020-03-03 |
Increasing Cost Benefit And Energy Efficiency With Modular Delivery Drones In Inclement Weather
App 20200065762 - Briggs; Benjamin D. ; et al. | 2020-02-27 |
Selective Cvd Alignment-mark Topography Assist For Non-volatile Memory
App 20200058594 - Rizzolo; Michael ; et al. | 2020-02-20 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20200058591 - Briggs; Benjamin D. ; et al. | 2020-02-20 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20200058590 - Briggs; Benjamin D. ; et al. | 2020-02-20 |
Selective Cvd Alignment-mark Topography Assist For Non-volatile Memory
App 20200051924 - Rizzolo; Michael ; et al. | 2020-02-13 |
Fully aligned semiconductor device with a skip-level via
Grant 10,553,789 - Lanzillo , et al. Fe | 2020-02-04 |
Proximity correction in three-dimensional manufacturing
Grant 10,545,806 - Briggs , et al. Ja | 2020-01-28 |
Hybrid Beol Metallization Utilizing Selective Reflection Mask
App 20200027840 - BRIGGS; Benjamin D. ; et al. | 2020-01-23 |
Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer
Grant 10,541,206 - Briggs , et al. Ja | 2020-01-21 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20200013718 - Briggs; Benjamin D. ; et al. | 2020-01-09 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,529,662 - Briggs , et al. J | 2020-01-07 |
Selective CVD alignment-mark topography assist for non-volatile memory
Grant 10,515,903 - Rizzolo , et al. Dec | 2019-12-24 |
Enhanced self-alignment of vias for a semiconductor device
Grant 10,515,894 - Briggs , et al. Dec | 2019-12-24 |
Extreme Ultraviolet (euv) Lithography Patterning Methods Utilizing Euv Resist Hardening
App 20190384180 - Briggs; Benjamin D. ; et al. | 2019-12-19 |
Selective Cvd Alignment-mark Topography Assist For Non-volatile Memory
App 20190355668 - Rizzolo; Michael ; et al. | 2019-11-21 |
Motion-controlled Portals In Virtual Reality
App 20190355175 - Sipolins; Aldis ; et al. | 2019-11-21 |
Non-intrusive Unmanned Entity Inspection
App 20190333292 - Chan; Yuk L. ; et al. | 2019-10-31 |
Non-intrusive Unmanned Entity Inspection
App 20190329909 - Chan; Yuk L. ; et al. | 2019-10-31 |
Paint On Micro Chip Touch Screens
App 20190325126 - Ashoori; Maryam ; et al. | 2019-10-24 |
Paint On Micro Chip Touch Screens
App 20190325127 - Ashoori; Maryam ; et al. | 2019-10-24 |
Self Aligned Via And Pillar Cut For At Least A Self Aligned Double Pitch
App 20190318960 - Briggs; Benjamin D. ; et al. | 2019-10-17 |
Self-forming barrier for cobalt interconnects
Grant 10,446,496 - Briggs , et al. Oc | 2019-10-15 |
Self Aligned Via And Pillar Cut For At Least A Self Aligned Double Pitch
App 20190311946 - Briggs; Benjamin D. ; et al. | 2019-10-10 |
Self-orientation And Self-placement Of Computing Devices In A Fluid
App 20190313533 - Skordas; Spyridon ; et al. | 2019-10-10 |
Fold Over Emitter And Collector Field Emission Transistor
App 20190304733 - Briggs; Benjamin D. ; et al. | 2019-10-03 |
Self-forming barrier for cobalt interconnects
Grant 10,431,544 - Briggs , et al. O | 2019-10-01 |
Orator effectiveness through real-time feedback system with automatic detection of human behavioral and emotional states of orator and audience
Grant 10,431,116 - Briggs , et al. O | 2019-10-01 |
Fold over emitter and collector field emission transistor
Grant 10,424,456 - Briggs , et al. Sept | 2019-09-24 |
Paint on micro chip touch screens
Grant 10,404,306 - Ashoori , et al. Sep | 2019-09-03 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20190267278 - Penny; Christopher J. ; et al. | 2019-08-29 |
Fully aligned via employing selective metal deposition
Grant 10,395,986 - Briggs , et al. A | 2019-08-27 |
Self aligned via and pillar cut for at least a self aligned double pitch
Grant 10,395,977 - Briggs , et al. A | 2019-08-27 |
Dedicated Contacts For Controlled Electroforming Of Memory Cells In Resistive Random-access Memory Array
App 20190259943 - Ando; Takashi ; et al. | 2019-08-22 |
Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array
Grant 10,381,561 - Ando , et al. A | 2019-08-13 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20190237402 - Briggs; Benjamin D. ; et al. | 2019-08-01 |
Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface
Grant 10,361,157 - Briggs , et al. | 2019-07-23 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,361,117 - Penny , et al. | 2019-07-23 |
Dedicated Contacts For Controlled Electroforming Of Memory Cells In Resistive Random-access Memory Array
App 20190214558 - Ando; Takashi ; et al. | 2019-07-11 |
Auto-incorrect In Chatbot Human-machine Interfaces
App 20190215282 - BRIGGS; Benjamin D. ; et al. | 2019-07-11 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications
Grant 10,347,825 - Briggs , et al. July 9, 2 | 2019-07-09 |
Extreme Ultraviolet (euv) Lithography Patterning Methods Utilizing Euv Resist Hardening
App 20190198325 - Briggs; Benjamin D. ; et al. | 2019-06-27 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20190181033 - Penny; Christopher J. ; et al. | 2019-06-13 |
Back End Of Line Electrical Fuse Structure And Method Of Fabrication
App 20190181091 - Briggs; Benjamin D. ; et al. | 2019-06-13 |
Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects
Grant 10,319,783 - Briggs , et al. | 2019-06-11 |
Capacitance Reduction In Sea Of Lines Beol Metallization
App 20190172783 - Briggs; Benjamin D. ; et al. | 2019-06-06 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications
Grant 10,312,434 - Briggs , et al. | 2019-06-04 |
Secure Access For Drone Package Delivery
App 20190164441 - Briggs; Benjamin D. ; et al. | 2019-05-30 |
Self-forming Barrier For Use In Air Gap Formation
App 20190157146 - Briggs; Benjamin D. ; et al. | 2019-05-23 |
Computer-mediated Reality Including Physical Damping Feedback
App 20190155236 - Briggs; Benjamin D. ; et al. | 2019-05-23 |
Wraparound top electrode line for crossbar array resistive switching device
Grant 10,297,750 - Ando , et al. | 2019-05-21 |
Low Aspect Ratio Interconnect
App 20190148296 - Briggs; Benjamin D. ; et al. | 2019-05-16 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20190148303 - Briggs; Benjamin D. ; et al. | 2019-05-16 |
Wraparound Top Electrode Line For Crossbar Array Resistive Switching Device
App 20190148637 - Ando; Takashi ; et al. | 2019-05-16 |
Barrier layers in trenches and vias
Grant 10,290,541 - Briggs , et al. | 2019-05-14 |
Cognitive system to improve athletic performance with motivation from different training styles
Grant 10,276,053 - Briggs , et al. | 2019-04-30 |
Selective recessing to form a fully aligned via
Grant 10,276,436 - Briggs , et al. | 2019-04-30 |
Sentiment analysis of mental health disorder symptoms
Grant 10,276,190 - Ashoori , et al. | 2019-04-30 |
Drone Delivery Routing And Communication
App 20190122177 - BRIGGS; BENJAMIN D. ; et al. | 2019-04-25 |
Optimizating Semiconductor Binning By Feed-forward Process Adjustment
App 20190122911 - Briggs; Benjamin D. ; et al. | 2019-04-25 |
Method For Using 3d Positional Spatial Olfaction For Virtual Marketing
App 20190114671 - BRIGGS; Benjamin D. ; et al. | 2019-04-18 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 10,256,191 - Briggs , et al. | 2019-04-09 |
Wet etch removal of Ru selective to other metals
Grant 10,242,909 - Briggs , et al. | 2019-03-26 |
High-density MIM capacitors
Grant 10,229,967 - Briggs , et al. | 2019-03-12 |
Self-forming barrier for use in air gap formation
Grant 10,229,851 - Briggs , et al. | 2019-03-12 |
Dual-damascene Formation With Dielectric Spacer And Thin Liner
App 20190067087 - Briggs; Benjamin D. ; et al. | 2019-02-28 |
Low aspect ratio interconnect
Grant 10,211,153 - Briggs , et al. Feb | 2019-02-19 |
Enhanced self-alignment of vias for asemiconductor device
Grant 10,211,151 - Briggs , et al. Feb | 2019-02-19 |
Reducing metallic interconnect resistivity through application of mechanical strain
Grant 10,211,155 - Briggs , et al. Feb | 2019-02-19 |
Metal silicate spacers for fully aligned vias
Grant 10,211,138 - Briggs , et al. Feb | 2019-02-19 |
Enabling low resistance gates and contacts integrated with bilayer dielectrics
Grant 10,204,828 - Bao , et al. Feb | 2019-02-12 |
Smartwatch blackbox
Grant 10,195,901 - Briggs , et al. Fe | 2019-02-05 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 10,192,829 - Briggs , et al. Ja | 2019-01-29 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20190013278 - Briggs; Benjamin D. ; et al. | 2019-01-10 |
Airgap protection layer for via alignment
Grant 10,170,411 - Briggs , et al. J | 2019-01-01 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length
Grant 10,170,416 - Briggs , et al. J | 2019-01-01 |
Sentiment Analysis Of Mental Health Disorder Symptoms
App 20180366144 - Ashoori; Maryam ; et al. | 2018-12-20 |
Dynamic Rigidity Mechanism
App 20180361225 - Briggs; Benjamin D. ; et al. | 2018-12-20 |
Predictive Notification Of Personality Shifts For Mental Illness Management
App 20180366142 - ASHOORI; Maryam ; et al. | 2018-12-20 |
Sentiment Analysis Of Mental Health Disorder Symptoms
App 20180366143 - Ashoori; Maryam ; et al. | 2018-12-20 |
Predictive Notification Of Personality Shifts For Mental Illness Management
App 20180366141 - ASHOORI; Maryam ; et al. | 2018-12-20 |
Neutral atom beam nitridation for copper interconnect
Grant 10,153,202 - Briggs , et al. Dec | 2018-12-11 |
Paint On Micro Chip Touch Screens
App 20180351596 - Ashoori; Maryam ; et al. | 2018-12-06 |
Proximity Correction In Three-dimensional Manufacturing
App 20180349220 - Briggs; Benjamin D. ; et al. | 2018-12-06 |
Accelerated Wafer Testing Using Non-destructive And Localized Stress
App 20180328979 - Briggs; Benjamin D. ; et al. | 2018-11-15 |
Accelerated Wafer Testing Using Non-destructive And Localized Stress
App 20180328977 - Briggs; Benjamin D. ; et al. | 2018-11-15 |
WET ETCH REMOVAL OF Ru SELECTIVE TO OTHER METALS
App 20180323151 - Briggs; Benjamin D. ; et al. | 2018-11-08 |
Method And System For Targeted Advertising Based On Natural Language Analytics
App 20180315094 - Ashoori; Maryam ; et al. | 2018-11-01 |
Selective Recessing To Form A Fully Aligned Via
App 20180315654 - Briggs; Benjamin D. ; et al. | 2018-11-01 |
Selective Recessing To Form A Fully Aligned Via
App 20180315653 - Briggs; Benjamin D. ; et al. | 2018-11-01 |
Method And System For Targeted Advertising Based On Natural Language Analytics
App 20180315093 - Ashoori; Maryam ; et al. | 2018-11-01 |
Dynamic rigidity mechanism
Grant 10,099,108 - Briggs , et al. October 16, 2 | 2018-10-16 |
Semiconductor device formed by wet etch removal of Ru selective to other metals
Grant 10,090,247 - Briggs , et al. October 2, 2 | 2018-10-02 |
Reducing Metallic Interconnect Resistivity Through Application Of Mechanical Strain
App 20180277482 - Briggs; Benjamin D. ; et al. | 2018-09-27 |
Skip-vias bypassing a metallization level at minimum pitch
Grant 10,083,905 - Briggs , et al. September 25, 2 | 2018-09-25 |
Prevention of Switching of Spins in Magnetic Tunnel Junctions by On-Chip Parasitic Magnetic Shield
App 20180269383 - Briggs; Benjamin D. ; et al. | 2018-09-20 |
Metal Silicate Spacers For Fully Aligned Vias
App 20180269144 - Briggs; Benjamin D. ; et al. | 2018-09-20 |
Enhanced Self-alignment Of Vias For A Semiconductor Device
App 20180254242 - BRIGGS; Benjamin D. ; et al. | 2018-09-06 |
Emotional Analysis And Depiction In Virtual Reality
App 20180247443 - Briggs; Benjamin D. ; et al. | 2018-08-30 |
Selective Deposition And Nitridization Of Bottom Electrode Metal For Mram Applications
App 20180240971 - Briggs; Benjamin D. ; et al. | 2018-08-23 |
Selective Deposition And Nitridization Of Bottom Electrode Metal For Mram Applications
App 20180240968 - Briggs; Benjamin D. ; et al. | 2018-08-23 |
Metal silicate spacers for fully aligned vias
Grant 10,049,974 - Briggs , et al. August 14, 2 | 2018-08-14 |
Reduced tip-to-tip and via pitch at line end
Grant 10,049,920 - Anderson , et al. August 14, 2 | 2018-08-14 |
Smartwatch blackbox
Grant 10,046,601 - Briggs , et al. August 14, 2 | 2018-08-14 |
Smartwatch blackbox
Grant 10,046,698 - Briggs , et al. August 14, 2 | 2018-08-14 |
Social media modification of behavior and mobile screening for impairment
Grant 10,045,096 - Briggs , et al. August 7, 2 | 2018-08-07 |
Remote Physical Training
App 20180207484 - Briggs; Benjamin D. ; et al. | 2018-07-26 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20180211920 - Briggs; Benjamin D. ; et al. | 2018-07-26 |
Integrated Magnetic Tunnel Junction (mtj) In Back End Of Line (beol) Interconnects
App 20180197915 - Briggs; Benjamin D. ; et al. | 2018-07-12 |
Reduced tip-to-tip and via pitch at line end
Grant 10,020,223 - Anderson , et al. July 10, 2 | 2018-07-10 |
Barrier Layers In Trenches And Vias
App 20180174899 - Briggs; Benjamin D. ; et al. | 2018-06-21 |
Selective and non-selective barrier layer wet removal
Grant 10,002,831 - Briggs , et al. June 19, 2 | 2018-06-19 |
Airgap Protection Layer For Via Alignment
App 20180151491 - Briggs; Benjamin D. ; et al. | 2018-05-31 |
Uniform dielectric recess depth during fin reveal
Grant 9,984,916 - Briggs , et al. May 29, 2 | 2018-05-29 |
Uniform dielectric recess depth during fin reveal
Grant 9,984,935 - Briggs , et al. May 29, 2 | 2018-05-29 |
Barrier layers in trenches and vias
Grant 9,984,923 - Briggs , et al. May 29, 2 | 2018-05-29 |
Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield
Grant 9,985,199 - Briggs , et al. May 29, 2 | 2018-05-29 |
Fully aligned via with integrated air gaps
Grant 9,966,337 - Briggs , et al. May 8, 2 | 2018-05-08 |
Barrier Planarization For Interconnect Metallization
App 20180114718 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Barrier Planarization For Interconnect Metallization
App 20180114719 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Selective Blocking Boundary Placement For Circuit Locations Requiring Electromigration Short-length
App 20180114750 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Skip-vias Bypassing A Metallization Level At Minimum Pitch
App 20180114752 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Fold Over Emitter And Collector Field Emission Transistor
App 20180108508 - Briggs; Benjamin D. ; et al. | 2018-04-19 |
Fold over emitter and collector field emission transistor
Grant 9,941,088 - Briggs , et al. April 10, 2 | 2018-04-10 |
Uniform dielectric recess depth during fin reveal
Grant 9,941,134 - Briggs , et al. April 10, 2 | 2018-04-10 |
Reducing metallic interconnect resistivity through application of mechanical strain
Grant 9,941,211 - Briggs , et al. April 10, 2 | 2018-04-10 |
Heterogeneous Metallization Using Solid Diffusion Removal Of Metal Interconnects
App 20180090372 - Briggs; Benjamin D. ; et al. | 2018-03-29 |
Airgap protection layer for via alignment
Grant 9,929,088 - Briggs , et al. March 27, 2 | 2018-03-27 |
Self-aligned Airgaps With Conductive Lines And Vias
App 20180082885 - Briggs; Benjamin D. ; et al. | 2018-03-22 |
Virtual And Augmented Reality Using High-throughput Wireless Visual Data Transmission
App 20180081425 - Briggs; Benjamin D. ; et al. | 2018-03-22 |
Single or mutli block mask management for spacer height and defect reduction for BEOL
Grant 9,916,986 - Briggs , et al. March 13, 2 | 2018-03-13 |
Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects
Grant 9,917,137 - Briggs , et al. March 13, 2 | 2018-03-13 |
Skip-vias bypassing a metallization level at minimum pitch
Grant 9,911,651 - Briggs , et al. March 6, 2 | 2018-03-06 |
Smartwatch Blackbox
App 20180056862 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Neutral Atom Beam Nitridation For Copper Interconnect
App 20180061705 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Metal Silicate Spacers For Fully Aligned Vias
App 20180061750 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Neutral Atom Beam Nitridation For Copper Interconnect
App 20180061704 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Self-forming Barrier For Use In Air Gap Formation
App 20180061708 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Low Aspect Ratio Interconnect
App 20180061761 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Neutral atom beam nitridation for copper interconnect
Grant 9,905,459 - Briggs , et al. February 27, 2 | 2018-02-27 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length
Grant 9,905,513 - Briggs , et al. February 27, 2 | 2018-02-27 |
Self-aligned airgaps with conductive lines and vias
Grant 9,899,256 - Briggs , et al. February 20, 2 | 2018-02-20 |
Structure and fabrication method for enhanced mechanical strength crack stop
Grant 9,899,338 - Briggs , et al. February 20, 2 | 2018-02-20 |
Structure And Fabrication Method For Enhanced Mechanical Strength Crack Stop
App 20180047676 - Briggs; Benjamin D. ; et al. | 2018-02-15 |
Selective Recessing To Form A Fully Aligned Via
App 20180040510 - Briggs; Benjamin D. ; et al. | 2018-02-08 |
Barrier planarization for interconnect metallization
Grant 9,881,833 - Briggs , et al. January 30, 2 | 2018-01-30 |
Security key system
Grant 9,881,431 - Briggs , et al. January 30, 2 | 2018-01-30 |
Structure And Method For Improved Stabilization Of Cobalt Cap And/or Cobalt Liner In Interconnects
App 20180005953 - Briggs; Benjamin D. ; et al. | 2018-01-04 |
Self-aligned Airgaps With Conductive Lines And Vias
App 20180005868 - Briggs; Benjamin D. ; et al. | 2018-01-04 |
Barrier Layers In Trenches And Vias
App 20180005880 - Briggs; Benjamin D. ; et al. | 2018-01-04 |
Health monitoring using parallel cognitive processing
Grant 9,858,388 - Ashoori , et al. January 2, 2 | 2018-01-02 |
Smartwatch Blackbox
App 20170368991 - Briggs; Benjamin D. ; et al. | 2017-12-28 |
Smartwatch Blackbox
App 20170368992 - Briggs; Benjamin D. ; et al. | 2017-12-28 |
Single Or Mutli Block Mask Management For Spacer Height And Defect Reduction For Beol
App 20170372909 - BRIGGS; BENJAMIN D. ; et al. | 2017-12-28 |
Dynamic Rigidity Mechanism
App 20170361201 - Briggs; Benjamin D. ; et al. | 2017-12-21 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20170358533 - Briggs; Benjamin D. ; et al. | 2017-12-14 |
High-density MIM capacitors
Grant 9,837,485 - Briggs , et al. December 5, 2 | 2017-12-05 |
Semiconductor interconnect structure with double conductors
Grant 9,837,350 - Briggs , et al. December 5, 2 | 2017-12-05 |
Forming deep airgaps without flop over
Grant 9,837,305 - Briggs , et al. December 5, 2 | 2017-12-05 |
Method for maximizing air gap in back end of the line interconnect through via landing modification
Grant 9,837,355 - Briggs , et al. December 5, 2 | 2017-12-05 |
Structure and fabrication method for enhanced mechanical strength crack stop
Grant 9,824,982 - Briggs , et al. November 21, 2 | 2017-11-21 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20170317025 - Briggs; Benjamin D. ; et al. | 2017-11-02 |
Selective And Non-selective Barrier Layer Wet Removal
App 20170317026 - Briggs; Benjamin D. ; et al. | 2017-11-02 |
Selective and non-selective barrier layer wet removal
Grant 9,806,023 - Briggs , et al. October 31, 2 | 2017-10-31 |
Selective And Non-selective Barrier Layer Wet Removal
App 20170301624 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
High-density Mim Capacitors
App 20170301749 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
Airgap Protection Layer For Via Alignment
App 20170301621 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
Heterogeneous metallization using solid diffusion removal of metal interconnects
Grant 9,793,206 - Briggs , et al. October 17, 2 | 2017-10-17 |
Semiconductor Interconnect Structure With Double Conductors
App 20170294381 - BRIGGS; BENJAMIN D. ; et al. | 2017-10-12 |
Semiconductor Interconnect Structure With Double Conductors
App 20170294382 - BRIGGS; BENJAMIN D. ; et al. | 2017-10-12 |
High-density Mim Capacitors
App 20170288011 - Briggs; Benjamin D. ; et al. | 2017-10-05 |
Proximity Feedback For Medicine Identification
App 20170286633 - Ashoori; Maryam ; et al. | 2017-10-05 |
Medication Scheduling And Alerts
App 20170286632 - Ashoori; Maryam ; et al. | 2017-10-05 |
Matching a spent firearm cartridge
Grant 9,778,007 - Briggs , et al. October 3, 2 | 2017-10-03 |
Method for Maximizing Air Gap in Back End of the Line Interconnect through Via Landing Modification
App 20170278796 - Briggs; Benjamin D. ; et al. | 2017-09-28 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20170278788 - Briggs; Benjamin D. ; et al. | 2017-09-28 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20170278740 - Briggs; Benjamin D. ; et al. | 2017-09-28 |
Smartwatch blackbox
Grant 9,758,095 - Briggs , et al. September 12, 2 | 2017-09-12 |
Security key system
Grant 9,760,817 - Briggs , et al. September 12, 2 | 2017-09-12 |
Hybrid Metal Interconnects With A Bamboo Grain Microstructure
App 20170256495 - Briggs; Benjamin D. ; et al. | 2017-09-07 |
Hybrid Metal Interconnects With A Bamboo Grain Microstructure
App 20170256494 - Briggs; Benjamin D. ; et al. | 2017-09-07 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 9,754,891 - Briggs , et al. September 5, 2 | 2017-09-05 |
Hybrid metal interconnects with a bamboo grain microstructure
Grant 9,754,885 - Briggs , et al. September 5, 2 | 2017-09-05 |
Hybrid metal interconnects with a bamboo grain microstructure
Grant 9,754,883 - Briggs , et al. September 5, 2 | 2017-09-05 |
Uniform Dielectric Recess Depth During Fin Reveal
App 20170236756 - Briggs; Benjamin D. ; et al. | 2017-08-17 |
Uniform Dielectric Recess Depth During Fin Reveal
App 20170236717 - Briggs; Benjamin D. ; et al. | 2017-08-17 |
Self-forming Barrier For Cobalt Interconnects
App 20170236781 - Briggs; Benjamin D. ; et al. | 2017-08-17 |
Self-forming Barrier For Cobalt Interconnects
App 20170236749 - Briggs; Benjamin D. ; et al. | 2017-08-17 |
Security Key System
App 20170221285 - Briggs; Benjamin D. ; et al. | 2017-08-03 |
Security Key System
App 20170220915 - Briggs; Benjamin D. ; et al. | 2017-08-03 |
Smartwatch Blackbox
App 20170210288 - Briggs; Benjamin D. ; et al. | 2017-07-27 |
Cognitive System to Improve Athletic Performance with Motivation from Different Training Styles
App 20170213470 - Briggs; Benjamin D. ; et al. | 2017-07-27 |
Forming chamferless vias using thermally decomposable porefiller
Grant 9,685,366 - Briggs , et al. June 20, 2 | 2017-06-20 |
Selective and non-selective barrier layer wet removal
Grant 9,685,406 - Briggs , et al. June 20, 2 | 2017-06-20 |
Orator Effectiveness Through Real-Time Feedback System With Automatic Detection of Human Behavioral and Emotional States of Orator and Audience
App 20170169727 - Briggs; Benjamin D. ; et al. | 2017-06-15 |
Uniform dielectric recess depth during fin reveal
Grant 9,666,474 - Briggs , et al. May 30, 2 | 2017-05-30 |
Real-Time Harm Prevention Through Feedback System With Automatic Detection of Human Behavioral and Emotional States
App 20170140629 - Briggs; Benjamin D. ; et al. | 2017-05-18 |
Social Media Modification of Behavior and Mobile Screening for Impairment
App 20170134832 - Briggs; Benjamin D. ; et al. | 2017-05-11 |
Uniform Dielectric Recess Depth During Fin Reveal
App 20170125302 - Briggs; Benjamin D. ; et al. | 2017-05-04 |
Uniform Dielectric Recess Depth During Fin Reveal
App 20170125286 - Briggs; Benjamin D. ; et al. | 2017-05-04 |
Self Aligned Via And Pillar Cut For At Least A Self Aligned Double Pitch
App 20170117177 - Briggs; Benjamin D. ; et al. | 2017-04-27 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20170084540 - Briggs; Benjamin D. ; et al. | 2017-03-23 |
Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element
Grant 9,583,498 - Briggs , et al. February 28, 2 | 2017-02-28 |
Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element
Grant 9,559,107 - Briggs , et al. January 31, 2 | 2017-01-31 |
Airgap protection layer for via alignment
Grant 9,553,019 - Briggs , et al. January 24, 2 | 2017-01-24 |
Self aligned via and pillar cut for at least a self aligned double pitch
Grant 9,548,243 - Briggs , et al. January 17, 2 | 2017-01-17 |
Self Aligned Via And Pillar Cut For At Least A Self Aligned Double Pitch
App 20170004996 - Briggs; Benjamin D. ; et al. | 2017-01-05 |
Structure And Method For Beol Nanoscale Damascene Sidewall-defined Non-volatile Memory Element
App 20160343723 - Briggs; Benjamin D. ; et al. | 2016-11-24 |
Structure And Method For Beol Nanoscale Damascene Sidewall-defined Non-volatile Memory Element
App 20160343721 - Briggs; Benjamin D. ; et al. | 2016-11-24 |
Fold Over Emitter And Collector Field Emission Transistor
App 20160307723 - Briggs; Benjamin D. ; et al. | 2016-10-20 |
Fold over emitter and collector field emission transistor
Grant 9,431,205 - Briggs , et al. August 30, 2 | 2016-08-30 |
Structure and fabrication method for electromigration immortal nanoscale interconnects
Grant 9,418,934 - Briggs , et al. August 16, 2 | 2016-08-16 |
Security key system
Grant 9,418,327 - Briggs , et al. August 16, 2 | 2016-08-16 |
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