| Patent | Date |
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Micro-electromechanical System Devices And Methods Of Making Micro-electromechanical System Devices
App 20120205753 - ADAMS; Scott G. ; et al. | 2012-08-16 |
Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
Grant 7,969,274 - Brennan , et al. June 28, 2 | 2011-06-28 |
Method To Improve Inductance With A High-permeability Slotted Plate Core In An Integrated Circuit
App 20090002115 - Brennan; Kenneth D. ; et al. | 2009-01-01 |
Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
Grant 7,436,281 - Brennan , et al. October 14, 2 | 2008-10-14 |
Ferromagnetic capacitor
Grant 7,397,107 - Brennan , et al. July 8, 2 | 2008-07-08 |
Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode
Grant 7,250,334 - Crenshaw , et al. July 31, 2 | 2007-07-31 |
Single mask MIM capacitor and resistor with in trench copper drift barrier
Grant 7,189,615 - Rao , et al. March 13, 2 | 2007-03-13 |
Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step
Grant 7,118,925 - Brennan , et al. October 10, 2 | 2006-10-10 |
System for integrating a toroidal inductor in a semiconductor device
Grant 7,109,838 - Brennan , et al. September 19, 2 | 2006-09-19 |
Single mask MIM capacitor and resistor with in trench copper drift barrier
App 20060160299 - Rao; Satyavolu Srinivas Papa ; et al. | 2006-07-20 |
Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step
App 20060134809 - Brennan; Kenneth D. ; et al. | 2006-06-22 |
Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step
App 20060128036 - Brennan; Kenneth D. ; et al. | 2006-06-15 |
Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
App 20060022787 - Brennan; Kenneth D. ; et al. | 2006-02-02 |
Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode
App 20060024899 - Crenshaw; Darius L. ; et al. | 2006-02-02 |
Dual damascene pattern liner
Grant 6,984,580 - Dostalik , et al. January 10, 2 | 2006-01-10 |
Copper transition layer for improving copper interconnection reliability
Grant 6,951,812 - Jiang , et al. October 4, 2 | 2005-10-04 |
Self aligned vias in dual damascene interconnect, buried mask approach
Grant 6,911,389 - Brennan , et al. June 28, 2 | 2005-06-28 |
Shielded planar capacitor
Grant 6,903,918 - Brennan June 7, 2 | 2005-06-07 |
Dual damascene pattern liner
App 20040222529 - Dostalik, William W. ; et al. | 2004-11-11 |
Dual damascene pattern liner
App 20040222527 - Dostalik, William W. ; et al. | 2004-11-11 |
Self-aligned vias in an integrated circuit structure
Grant 6,787,875 - Brennan , et al. September 7, 2 | 2004-09-07 |
Copper transition layer for improving copper interconnection reliability
App 20040132282 - Jiang, Qing-Tang ; et al. | 2004-07-08 |
Self aligned vias in dual damascene interconnect, buried mask approach
App 20040053501 - Brennan, Kenneth D. ; et al. | 2004-03-18 |
Copper transition layer for improving copper interconnection reliability
Grant 6,693,356 - Jiang , et al. February 17, 2 | 2004-02-17 |
Self-aligned vias in an integrated circuit structure
App 20040021196 - Brennan, Kenneth D. ; et al. | 2004-02-05 |
Dual damascene barrier structures and preferential etching method
App 20030190829 - Brennan, Kenneth D. | 2003-10-09 |
Copper transition layer for improving copper interconnection reliability
App 20030186543 - Jiang, Qing-Tang ; et al. | 2003-10-02 |
Aluminum hardmask for dielectric etch
Grant 6,620,727 - Brennan September 16, 2 | 2003-09-16 |
Treatment of low-k dielectric films to enable patterning of deep submicron features
Grant 6,605,536 - Eissa , et al. August 12, 2 | 2003-08-12 |
Versatile system for integrated circuit containing shielded inductor
Grant 6,600,208 - Brennan , et al. July 29, 2 | 2003-07-29 |
Method of fabricating interlevel connectors using only one photomask step
Grant 6,548,400 - Brennan , et al. April 15, 2 | 2003-04-15 |
Aluminum hardmask for dielectric etch
App 20030040172 - Brennan, Kenneth D. | 2003-02-27 |
Dual hardmask process for the formation of copper/low-k interconnects
App 20030008490 - Xing, Guoqiang ; et al. | 2003-01-09 |
Method of fabricating interlevel connectors using only one photomask step
App 20030001272 - Brennan, Kenneth D. ; et al. | 2003-01-02 |
Method for sealing via sidewalls in porous low-k dielectric layers
App 20020177303 - Jiang, Qing-Tang ; et al. | 2002-11-28 |
Technique for intralevel capacitive isolation of interconnect paths
Grant 6,465,339 - Brankner , et al. October 15, 2 | 2002-10-15 |
Treatment of low-k dielectric films to enable patterning of deep submicron features
App 20020127876 - Eissa, Mona ; et al. | 2002-09-12 |
Versatile system for integrated circuit containing shielded inductor
App 20020096736 - Brennan, Kenneth D. ; et al. | 2002-07-25 |
Treatment of low-k dielectric films to enable patterning of deep submicron features
App 20020064951 - Eissa, Mona M. ; et al. | 2002-05-30 |
System for integrating a toroidal inductor in a semiconductor device
App 20020058355 - Brennan, Kenneth D. ; et al. | 2002-05-16 |
Technique For Intralevel Capacitive Isolation Of Interconnect Paths
App 20020048933 - BRANKNER, KEITH ; et al. | 2002-04-25 |
Method for air gap formation by plasma treatment of aluminum interconnects
Grant 5,880,026 - Xing , et al. March 9, 1 | 1999-03-09 |
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