Brennan; John McKenna

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brennan; John McKenna.The latest application filed is for "housing for the oct probe, oct probe assembly, and a method of making such assembly".

Company Profile

0.5.10

Brennan; John McKenna - Vero Beach FL
Brennan; John McKenna - Klongtoey Nua TH
Brennan; John McKenna - Wyomissing PA
Brennan; John McKenna - Pittsford NY
Brennan, John McKenna - Doylestown PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Housing For The Oct Probe, Oct Probe Assembly, And A Method Of Making Such Assembly App 20150025369 - Bhagavatula; Venkata Adiseshaiah ; et al.	2015-01-22
Non-hermetic, Multi-emitter Laser Pump Packages And Methods For Forming The Same App 20130215924 - Brennan; John McKenna ; et al.	2013-08-22
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit Grant 7,637,414 - Bambridge , et al. December 29, 2	2009-12-29
Methods and Apparatus for Wire Bonding with Wire Length Adjustment in an Integrated Circuit App 20080283578 - Bambridge; Timothy Brooks ; et al.	2008-11-20
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit Grant 7,443,042 - Bambridge , et al. October 28, 2	2008-10-28
Techniques for reducing bowing in power transistor devices Grant 7,164,200 - Brennan , et al. January 16, 2	2007-01-16
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit Grant 7,086,148 - Bambridge , et al. August 8, 2	2006-08-08
Integrated circuit device having encapsulant dam with chamfered edge App 20060170079 - Brennan; John McKenna ; et al.	2006-08-03
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit App 20060158856 - Bambridge; Timothy Brooks ; et al.	2006-07-20
Semiconductor packaging techniques for use with non-ceramic packages Grant 7,075,174 - Brennan , et al. July 11, 2	2006-07-11
Techniques for reducing bowing in power transistor devices App 20050189616 - Brennan, John McKenna ; et al.	2005-09-01
Semiconductor packaging techniques for use with non-ceramic packages App 20050191793 - Brennan, John McKenna ; et al.	2005-09-01
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit App 20050183265 - Bambridge, Timothy Brooks ; et al.	2005-08-25
Semiconductor device with improved thermal characteristics App 20050184385 - Brennan, John McKenna ; et al.	2005-08-25

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