| Patent | Date |
|---|
Silver containing copper alloy
App 20040159379 - Bogel, Andreas ; et al. | 2004-08-19 |
Silver containing copper alloy
Grant 6,749,699 - Bogel , et al. June 15, 2 | 2004-06-15 |
Copper alloy having improved stress relaxation resistance
Grant 6,632,300 - Breedis , et al. October 14, 2 | 2003-10-14 |
Nickel containing high copper alloy
App 20030029532 - Breedis, John F. ; et al. | 2003-02-13 |
Copper alloy having improved stress relaxation resistance
App 20020044881 - Breedis, John F. ; et al. | 2002-04-18 |
Silver containing copper alloy
App 20020039542 - Bogel, Andreas ; et al. | 2002-04-04 |
Grain Refined Tin Brass
App 20010001400 - BRAUER, DENNIS R. ; et al. | 2001-05-24 |
Iron modified tin brass
Grant 6,132,528 - Brauer , et al. October 17, 2 | 2000-10-17 |
Process for improving the bend formability of copper alloys
Grant 5,601,665 - Caron , et al. February 11, 1 | 1997-02-11 |
Copper base alloys having improved bend formability
Grant 5,565,045 - Caron , et al. October 15, 1 | 1996-10-15 |
Copper alloy having high strength and high electrical conductivity
Grant 5,370,840 - Caron , et al. * December 6, 1 | 1994-12-06 |
Copper alloy having high strength and high electrical conductivity
Grant 5,306,465 - Caron , et al. April 26, 1 | 1994-04-26 |
Surface modified copper alloys
Grant 5,096,508 - Breedis , et al. March 17, 1 | 1992-03-17 |
Copper-nickel-tin-silicon alloys having improved processability
Grant 5,074,933 - Ashok , et al. December 24, 1 | 1991-12-24 |
Multipurpose copper alloys and processing therefor with moderate conductivity and high strength
Grant 4,728,372 - Caron , et al. March 1, 1 | 1988-03-01 |
Thermosonic palladium lead wire bonding
Grant 4,674,671 - Fister , et al. June 23, 1 | 1987-06-23 |
Beta copper base alloy adapted to be formed as a semi-solid metal slurry and a process for making same
Grant 4,661,178 - Ashok , et al. April 28, 1 | 1987-04-28 |
Electrical component forming process
Grant 4,649,083 - Fister , et al. March 10, 1 | 1987-03-10 |
Alpha copper base alloy adapted to be formed as a semi-solid metal slurry
Grant 4,642,146 - Ashok , et al. February 10, 1 | 1987-02-10 |
Copper alloys having an improved combination of strength and conductivity
Grant 4,605,532 - Knorr , et al. August 12, 1 | 1986-08-12 |
Multipurpose copper alloys with moderate conductivity and high strength
Grant 4,594,221 - Caron , et al. June 10, 1 | 1986-06-10 |
Beta copper base alloy adapted to be formed as a semi-solid metal slurry and a process for making same
Grant 4,585,494 - Ashok , et al. April 29, 1 | 1986-04-29 |
Copper base alloy adapted to be formed as a semi-solid metal slurry
Grant 4,569,702 - Ashok , et al. February 11, 1 | 1986-02-11 |
Beta copper base alloy adapted to be formed as a semi-solid metal slurry and a process for making same
Grant 4,555,272 - Ashok , et al. November 26, 1 | 1985-11-26 |
Method of forming a composite material having improved bond strength
Grant 4,500,028 - Breedis , et al. February 19, 1 | 1985-02-19 |
Electrical component forming process
Grant 4,500,605 - Fister , et al. February 19, 1 | 1985-02-19 |
Composite copper nickel alloys with improved solderability shelf life
Grant 4,441,118 - Fister , et al. April 3, 1 | 1984-04-03 |
Composite material having improved bond strength
Grant 4,429,022 - Breedis , et al. January 31, 1 | 1984-01-31 |
Process and apparatus for making heat exchanger panels
Grant 4,209,886 - Winter , et al. July 1, 1 | 1980-07-01 |
High strength aluminum extrusion alloy
Grant 4,113,472 - Fister, Jr. , et al. September 12, 1 | 1978-09-12 |
Processing chromium-containing precipitation hardenable copper base alloys
Grant 4,047,980 - Watson , et al. September 13, 1 | 1977-09-13 |
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