Brauer; Eric A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brauer; Eric A..The latest application filed is for "leaded semiconductor power module with direct bonding and double sided cooling".

Company Profile

0.6.3

Brauer; Eric A. - Avon IN
Brauer; Eric A. - Indianapolis IN
Brauer; Eric A. - Danville IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips Grant 7,795,726 - Myers , et al. September 14, 2	2010-09-14
Leaded semiconductor power module with direct bonding and double sided cooling Grant 7,759,778 - Lowry , et al. July 20, 2	2010-07-20
Leaded semiconductor power module with direct bonding and double sided cooling App 20100065950 - Lowry; Michael J. ; et al.	2010-03-18
Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips App 20080272484 - Myers; Bruce A. ; et al.	2008-11-06
Electrical package employing segmented connector and solder joint Grant 7,049,171 - Brauer May 23, 2	2006-05-23
Electrical Package Employing Segmented Connector And Solder Joint App 20050287699 - Brauer, Eric A.	2005-12-29
Control module with integral fastening/locking assembly Grant 5,373,104 - Brauer December 13, 1	1994-12-13
Self clamping heat sink assembly Grant 5,309,979 - Brauer May 10, 1	1994-05-10
Hole geometry for printed circuit boards Grant 4,646,204 - Brauer February 24, 1	1987-02-24

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