Brathwaite; George A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Brathwaite; George A..The latest application filed is for "semiconductor package having a ground or power ring and a metal substrate".
- Brathwaite; George A. - Union City CA
- Brathwaite; George A. - Hayward CA
| Patent | Date |
|---|---|
| Semiconductor package having a ground or power ring and a metal substrate Grant 5,877,551 - Tostado , et al. March 2, 1 | 1999-03-02 |
| Components for housing an integrated circuit device Grant 5,578,869 - Hoffman , et al. November 26, 1 | 1996-11-26 |
| Electronic package having improved wire bonding capability Grant 5,506,446 - Hoffman , et al. April 9, 1 | 1996-04-09 |
| Chamfered electronic package component Grant 5,455,386 - Brathwaite , et al. October 3, 1 | 1995-10-03 |
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