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Patent applications and USPTO patent grants for Branson International Plasma Corporation.The latest application filed is for "plasma etching device and process".
Patent | Date |
---|---|
Plasma etching device and process Grant 5,099,100 - Bersin , et al. March 24, 1 | 1992-03-24 |
Plasma reactor and process with wafer temperature control Grant 5,016,332 - Reichelderfer, deceased , et al. May 21, 1 | 1991-05-21 |
Plasma etching apparatus Grant 4,631,105 - Carroll , et al. December 23, 1 | 1986-12-23 |
Process and gas mixture for etching aluminum Grant 4,380,488 - Reichelderfer , et al. April 19, 1 | 1983-04-19 |
Process and gas mixture for etching silicon dioxide and silicon nitride Grant 4,324,611 - Vogel , et al. April 13, 1 | 1982-04-13 |
Computer controlled system for processing semiconductor wafers Grant 4,313,783 - Davies , et al. February 2, 1 | 1982-02-02 |
Process and gas for treatment of semiconductor devices Grant 4,303,467 - Scornavacca , et al. December 1, 1 | 1981-12-01 |
Gas plasma reactor for circuit boards and the like Grant 4,285,800 - Welty August 25, 1 | 1981-08-25 |
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