Brandenburg; Scott David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Brandenburg; Scott David.The latest application filed is for "overmolded electronic module with underfilled surface-mount components".
- Brandenburg; Scott David - Kokomo IN
| Patent | Date |
|---|---|
| Overmolded electronic module with underfilled surface-mount components Grant 6,307,749 - Daanen , et al. October 23, 2 | 2001-10-23 |
| Overmolded electronic assembly Grant 6,285,551 - Brandenburg , et al. September 4, 2 | 2001-09-04 |
| Flip chip with backside electrical contact and assembly and method therefor Grant 6,262,489 - Koors , et al. July 17, 2 | 2001-07-17 |
| Method of forming an overmolded electronic assembly Grant 6,180,045 - Brandenburg , et al. January 30, 2 | 2001-01-30 |
| Flip chip-on-flip chip multi-chip module Grant 5,914,535 - Brandenburg June 22, 1 | 1999-06-22 |
| Electronic circuit with integrated terminal pins Grant 5,774,342 - Brandenburg , et al. June 30, 1 | 1998-06-30 |
| Flip chip-on-flip chip multi-chip module Grant 5,770,477 - Brandenburg June 23, 1 | 1998-06-23 |
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