Brandenburg; Scott D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Brandenburg; Scott D..The latest application filed is for "single-layer air waveguide antenna integrated on circuit board".
Company Profile
8.53.66
- Brandenburg; Scott D. - Kokomo IN
Patent Activity
| Patent | Date |
|---|---|
| Single-Layer Air Waveguide Antenna Integrated on Circuit Board App 20220302570 - Brandenburg; Scott D. ; et al. | 2022-09-22 |
| Plastic Air-Waveguide Antenna with Conductive Particles App 20220271437 - Brandenburg; Scott D. ; et al. | 2022-08-25 |
| Formed Waveguide Antennas of a Radar Assembly App 20220256685 - Brandenburg; Scott D. ; et al. | 2022-08-11 |
| Electromagnetic Interference Shielding And Thermal Management Systems And Methods For Automotive Radar Applications App 20220248525 - Brandenburg; Scott D. ; et al. | 2022-08-04 |
| Plastic air-waveguide antenna with conductive particles Grant 11,362,436 - Brandenburg , et al. June 14, 2 | 2022-06-14 |
| Thermal interface layer for electronic device Grant 11,315,852 - Brandenburg , et al. April 26, 2 | 2022-04-26 |
| Plastic Air-Waveguide Antenna with Conductive Particles App 20220109247 - Brandenburg; Scott D. ; et al. | 2022-04-07 |
| Heat exchanger for electronics Grant 11,217,505 - Brandenburg , et al. January 4, 2 | 2022-01-04 |
| Liquid Cooled Module with Device Heat Spreader App 20210375718 - Brandenburg; Scott D. ; et al. | 2021-12-02 |
| Waveguide Antenna With Integrated Temperature Management App 20210344100 - Brandenburg; Scott D. ; et al. | 2021-11-04 |
| Liquid cooled module with device heat spreader Grant 11,121,058 - Brandenburg , et al. September 14, 2 | 2021-09-14 |
| Waveguide antenna with integrated temperature management Grant 11,095,014 - Brandenburg , et al. August 17, 2 | 2021-08-17 |
| Waveguide Antenna With Integrated Temperature Management App 20210210832 - Brandenburg; Scott D. ; et al. | 2021-07-08 |
| Thermal Interface Layer For Electronic Device App 20210111096 - Brandenburg; Scott D. ; et al. | 2021-04-15 |
| Heat Exchanger For Electronics App 20210074605 - Brandenburg; Scott D. ; et al. | 2021-03-11 |
| Liquid Cooled Module With Device Heat Spreader App 20210028088 - Brandenburg; Scott D. ; et al. | 2021-01-28 |
| Electrical-circuit assembly with heat-sink Grant 10,849,217 - Brandenburg , et al. November 24, 2 | 2020-11-24 |
| Interface layer with mesh and sinter paste Grant 10,679,770 - Brandenburg | 2020-06-09 |
| Electrical-circuit Assembly With Heat-sink App 20200008291 - Brandenburg; Scott D. ; et al. | 2020-01-02 |
| Navigation system that displays other-vehicle information Grant 9,726,514 - Pudiyathanda , et al. August 8, 2 | 2017-08-08 |
| Thermoelectric Generator To Engine Exhaust Manifold Interface Using A Direct-Bond-Copper (DBC) Arrangement App 20170098750 - Berlin; Carl W. ; et al. | 2017-04-06 |
| Navigation System That Displays Other-Vehicle Information App 20160370201 - Pudiyathanda; Devaiah Aiappa ; et al. | 2016-12-22 |
| Edge seal for electronics assembly suitable for exposure to electrically conductive coolant Grant 9,131,630 - Brandenburg , et al. September 8, 2 | 2015-09-08 |
| Thermoelectric Generator To Engine Exhaust Manifold Assembly App 20140305481 - BRANDENBURG; SCOTT D. ; et al. | 2014-10-16 |
| Thermoelectric Generator To Engine Exhaust Manifold Assembly App 20140305480 - BRANDENBURG; SCOTT D. ; et al. | 2014-10-16 |
| Self circulating heat exchanger Grant 8,797,739 - Brandenburg , et al. August 5, 2 | 2014-08-05 |
| Liquid cooled electronics assembly suitable to use electrically conductive coolant Grant 8,699,225 - Brandenburg , et al. April 15, 2 | 2014-04-15 |
| Edge Seal For Electronics Assembly Suitable For Exposure To Electrically Conductive Coolant App 20130279113 - BRANDENBURG; SCOTT D. ; et al. | 2013-10-24 |
| Liquid Cooled Electronics Assembly Suitable To Use Electrically Conductive Coolant App 20130258592 - BRANDENBURG; SCOTT D. ; et al. | 2013-10-03 |
| Assembly for liquid cooling electronics by direct submersion into circulated engine coolant Grant 8,488,321 - Brandenburg , et al. July 16, 2 | 2013-07-16 |
| Fluid cooled encapsulated microelectronic package Grant 8,471,380 - Brandenburg , et al. June 25, 2 | 2013-06-25 |
| Assembly For Liquid Cooling Electronics By Direct Submersion Into Circulated Engine Coolant App 20130087307 - BRANDENBURG; SCOTT D. ; et al. | 2013-04-11 |
| Self Circulating Heat Exchanger App 20120325441 - BRANDENBURG; SCOTT D. ; et al. | 2012-12-27 |
| Fluid Cooled Encapsulated Microelectronic Package App 20120001319 - BRANDENBURG; SCOTT D. ; et al. | 2012-01-05 |
| Fluid cooled encapsulated microelectronic package Grant 8,026,597 - Brandenburg , et al. September 27, 2 | 2011-09-27 |
| Microwave communication package Grant 7,855,685 - Walsh , et al. December 21, 2 | 2010-12-21 |
| Method of producing an overmolded electronic module with a flexible circuit pigtail Grant 7,739,791 - Brandenburg , et al. June 22, 2 | 2010-06-22 |
| Liquid metal rotary connector apparatus for a vehicle steering wheel and column Grant 7,726,972 - Brandenburg , et al. June 1, 2 | 2010-06-01 |
| Compliant pin strip with integrated dam bar App 20100032183 - Brandenburg; Scott D. ; et al. | 2010-02-11 |
| Solderless electrical interconnection for electronic package Grant 7,621,757 - Brandenburg , et al. November 24, 2 | 2009-11-24 |
| Wrap-around overmold for electronic assembly Grant 7,616,448 - Degenkolb , et al. November 10, 2 | 2009-11-10 |
| Method of overmolding an electronic assembly having an insert-molded vertical mount connector header Grant 7,603,770 - Brandenburg , et al. October 20, 2 | 2009-10-20 |
| Circuit assembly with surface-mount IC package and heat sink Grant 7,561,436 - Brandenburg , et al. July 14, 2 | 2009-07-14 |
| Methods to provide and expose a diagnostic connector on overmolded electronic packages Grant 7,553,680 - Brandenburg , et al. June 30, 2 | 2009-06-30 |
| Electrical pin interconnection for electronic package Grant 7,537,464 - Brandenburg , et al. May 26, 2 | 2009-05-26 |
| Fluid cooled encapsulated microelectronic package App 20090108439 - Brandenburg; Scott D. ; et al. | 2009-04-30 |
| Method of producing an overmolded electronic module with a flexible circuit pigtail App 20090106974 - Brandenburg; Scott D. ; et al. | 2009-04-30 |
| Microwave communication package App 20090085808 - Walsh; Matthew R. ; et al. | 2009-04-02 |
| Method of overmolding an electronic assembly having an insert-molded vertical mount connector header App 20090085248 - Brandenburg; Scott D. ; et al. | 2009-04-02 |
| Wrap-around overmold for electronic assembly App 20090073663 - Degenkolb; Thomas A. ; et al. | 2009-03-19 |
| Fluid circulator for fluid cooled electronic device Grant 7,486,515 - Brandenburg , et al. February 3, 2 | 2009-02-03 |
| Fluid cooled encapsulated microelectronic package Grant 7,485,957 - Brandenburg , et al. February 3, 2 | 2009-02-03 |
| Technique for manufacturing an overmolded electronic assembly Grant 7,473,585 - Brandenburg , et al. January 6, 2 | 2009-01-06 |
| Metal screen and adhesive composite thermal interface App 20080310115 - Brandenburg; Scott D. ; et al. | 2008-12-18 |
| Compression connection for vertical IC packages Grant 7,447,041 - Brandenburg , et al. November 4, 2 | 2008-11-04 |
| Heat sink electronic package having compliant pedestal Grant 7,440,282 - Brandenburg , et al. October 21, 2 | 2008-10-21 |
| Surface mount connector Grant 7,422,448 - Brandenburg , et al. September 9, 2 | 2008-09-09 |
| Compression connection for vertical IC packages App 20080212296 - Brandenburg; Scott D. ; et al. | 2008-09-04 |
| Fluid circulator for fluid cooled electronic device App 20080192430 - Brandenburg; Scott D. ; et al. | 2008-08-14 |
| Connector applied underfill App 20080176428 - Brandenburg; Scott D. ; et al. | 2008-07-24 |
| Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels Grant 7,364,684 - Brandenburg , et al. April 29, 2 | 2008-04-29 |
| Polymer encapsulated electrical devices Grant 7,352,070 - Ellis , et al. April 1, 2 | 2008-04-01 |
| Electrical pin interconnection for electronic package App 20070295450 - Brandenburg; Scott D. ; et al. | 2007-12-27 |
| Solderless electrical interconnection for electronic package App 20070295452 - Brandenburg; Scott D. ; et al. | 2007-12-27 |
| Electronic package and method of cooling electronics Grant 7,307,841 - Berlin , et al. December 11, 2 | 2007-12-11 |
| Heat sink electronic package having compliant pedestal App 20070268671 - Brandenburg; Scott D. ; et al. | 2007-11-22 |
| Technique for manufacturing an overmolded electronic assembly Grant 7,268,429 - Brandenburg , et al. September 11, 2 | 2007-09-11 |
| Cooled electronic assembly and method for cooling a printed circuit board Grant 7,230,832 - Brandenburg , et al. June 12, 2 | 2007-06-12 |
| Printed circuit board assembly with integrated connector Grant 7,227,758 - Brandenburg , et al. June 5, 2 | 2007-06-05 |
| Fluid cooled encapsulated microelectronic package App 20070114656 - Brandenburg; Scott D. ; et al. | 2007-05-24 |
| Fluid cooled encapsulated microelectronic package Grant 7,205,653 - Brandenburg , et al. April 17, 2 | 2007-04-17 |
| Electronic module with form in-place pedestal Grant 7,202,571 - Thompson , et al. April 10, 2 | 2007-04-10 |
| Surface mount connector App 20070026700 - Brandenburg; Scott D. ; et al. | 2007-02-01 |
| Electronic package and method of cooling electronics App 20070025081 - Berlin; Carl W. ; et al. | 2007-02-01 |
| Microelectronic assembly with underchip optical window, and method for forming same App 20070007668 - Brandenburg; Scott D. ; et al. | 2007-01-11 |
| Electronic assembly with backplate having at least one thermal insert App 20070004090 - Brandenburg; Scott D. ; et al. | 2007-01-04 |
| Technique for manufacturing an overmolded electronic assembly App 20060292751 - Brandenburg; Scott D. ; et al. | 2006-12-28 |
| Cooled electronic assembly and method for cooling a printed circuit board App 20060285300 - Brandenburg; Scott D. ; et al. | 2006-12-21 |
| Technique for manufacturing an overmolded electronic assembly App 20060281230 - Brandenburg; Scott D. ; et al. | 2006-12-14 |
| Circuit Assembly With Surface-mount Ic Package And Heat Sink App 20060274512 - Brandenburg; Scott D. ; et al. | 2006-12-07 |
| Flip Chip Package And Method Of Conducting Heat Therefrom App 20060273467 - Brandenburg; Scott D. ; et al. | 2006-12-07 |
| Method of developing an electronic module Grant 7,134,194 - Brandenburg , et al. November 14, 2 | 2006-11-14 |
| Electronic assembly with solder-bonded heat sink Grant 7,132,746 - Brandenburg , et al. November 7, 2 | 2006-11-07 |
| Epoxy-solder thermally conductive structure for an integrated circuit App 20060118601 - Brandenburg; Scott D. | 2006-06-08 |
| Fluid cooled encapsulated microelectronic package App 20060038284 - Brandenburg; Scott D. ; et al. | 2006-02-23 |
| Electronic module with form in-place pedestal App 20060033195 - Thompson; Brian D. ; et al. | 2006-02-16 |
| Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels App 20060033236 - Brandenburg; Scott D. ; et al. | 2006-02-16 |
| Methods to provide and expose a diagnostic connector on overmolded electronic packages App 20060027394 - Brandenburg; Scott D. ; et al. | 2006-02-09 |
| Microelectronic assembly with underchip optical window, and method for forming same App 20050224967 - Brandenburg, Scott D. ; et al. | 2005-10-13 |
| Technique for connector to printed circuit board decoupling to eliminate flexure Grant 6,905,349 - Brandenburg , et al. June 14, 2 | 2005-06-14 |
| Electronic Module With Removable Circuitry And Method Therefor App 20050105281 - Brandenburg, Scott D. ; et al. | 2005-05-19 |
| Heat sinkable package App 20050093181 - Brandenburg, Scott D. ; et al. | 2005-05-05 |
| Multi-chip module App 20050093144 - Brandenburg, Scott D. ; et al. | 2005-05-05 |
| Method for forming an electronic assembly App 20050081377 - Brandenburg, Scott D. ; et al. | 2005-04-21 |
| Wafer applied thermally conductive interposer Grant 6,875,636 - Brandenburg , et al. April 5, 2 | 2005-04-05 |
| Process and electronic assembly for removing heat from a circuit device App 20050040518 - Brandenburg, Scott D. ; et al. | 2005-02-24 |
| Thermally enhanced electronic module App 20050018402 - Oman, Todd P. ; et al. | 2005-01-27 |
| Printed circuit board assembly with integrated connector App 20050018410 - Brandenburg, Scott D. ; et al. | 2005-01-27 |
| Wafer applied thermally conductive interposer App 20050014312 - Brandenburg, Scott D. ; et al. | 2005-01-20 |
| Mutli-chip module Grant 6,833,628 - Brandenburg , et al. December 21, 2 | 2004-12-21 |
| Lead-based solder alloys containing copper Grant 6,811,892 - Yeh , et al. November 2, 2 | 2004-11-02 |
| Method for forming an electronic assembly Grant 6,807,731 - Brandenburg , et al. October 26, 2 | 2004-10-26 |
| Overmolded electronic package including circuit-carrying substrate Grant 6,779,260 - Brandenburg , et al. August 24, 2 | 2004-08-24 |
| Filtered electrical connector assembly for an overmolded electronic package App 20040132322 - Brandenburg, Scott D. ; et al. | 2004-07-08 |
| Multi-chip Module And Method Of Forming App 20040113281 - Brandenburg, Scott D. ; et al. | 2004-06-17 |
| Lead-based solder alloys containing copper App 20040035909 - Yeh, Shing ; et al. | 2004-02-26 |
| Overmolded circuit board with underfilled surface-mount component and method therefor Grant 6,693,239 - Myers , et al. February 17, 2 | 2004-02-17 |
| Electromagnetic interference shield for overmolded packaging of an electronic assembly App 20030184976 - Brandenburg, Scott D. ; et al. | 2003-10-02 |
| Solder process and solder alloy therefor Grant 6,619,536 - Yeh , et al. September 16, 2 | 2003-09-16 |
| Solder Process And Solder Alloy Therefor App 20030155402 - Yeh, Shing ; et al. | 2003-08-21 |
| Solder process and solder alloy therefor Grant 6,570,260 - Yeh , et al. May 27, 2 | 2003-05-27 |
| Overmolded circuit board with underfilled surface-mount component and method therefor App 20030042035 - Myers, Bruce A. ; et al. | 2003-03-06 |
| Flexible capacitor filter Grant 5,562,498 - Brandenburg , et al. October 8, 1 | 1996-10-08 |
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