Boyko; Christina M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boyko; Christina M..The latest application filed is for "interconnect structure and method of making same".

Company Profile

0.8.3

Boyko; Christina M. - Endicott NY
Boyko; Christina M. - Conklin NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making and interconnect structure Grant 6,931,726 - Boyko , et al. August 23, 2	2005-08-23
Process of removing holefill residue from a metallic surface of an electronic substrate Grant 6,776,852 - Boyko , et al. August 17, 2	2004-08-17
Process for manufacturing a printed wiring board Grant 6,775,907 - Boyko , et al. August 17, 2	2004-08-17
Interconnect structure and method of making same Grant 6,660,945 - Boyko , et al. December 9, 2	2003-12-09
Interconnect structure and method of making same App 20030172525 - Boyko, Christina M. ; et al.	2003-09-18
Process of removing holefill residue from a metallic surface of an electronic substrate App 20030131870 - Boyko, Christina M. ; et al.	2003-07-17
Interconnect structure and method of making same App 20030070839 - Boyko, Christina M. ; et al.	2003-04-17
Interconnect structure for joining a chip to a circuit card Grant 6,121,069 - Boyko , et al. September 19, 2	2000-09-19
Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection Grant 5,953,623 - Boyko , et al. September 14, 1	1999-09-14
Printed circuit board with aligned connections and method of making same Grant 5,450,290 - Boyko , et al. September 12, 1	1995-09-12
Selective electroetch of copper and other metals Grant 5,374,338 - Boyko , et al. December 20, 1	1994-12-20

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