Boyer; Keith D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boyer; Keith D..The latest application filed is for "extruded seal plate for horizontal insulated composite architectural panel vertical end joints".

Company Profile

0.8.5

Boyer; Keith D. - Moon Township PA US
Boyer; Keith D. - Connersville IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Insulated metal vertical joint insert Grant 8,661,756 - Boyer , et al. March 4, 2	2014-03-04
Advanced building envelope delivery system and method Grant 8,631,620 - Guinn , et al. January 21, 2	2014-01-21
Extruded seal plate for horizontal insulated composite architectural panel vertical end joints Grant 8,474,202 - Boyer , et al. July 2, 2	2013-07-02
Extruded Seal Plate for Horizontal Insulated Composite Architectural Panel Vertical End Joints App 20120247039 - Boyer; Keith D. ; et al.	2012-10-04
Extruded seal plate for horizontal insulated composite architectural panel vertical end joints Grant 8,261,499 - Boyer , et al. September 11, 2	2012-09-11
Insulated Metal Vertical Joint Insert App 20110252737 - Boyer; Keith D. ; et al.	2011-10-20
Drained and Back Ventilated Thin Composite Wall Cladding System App 20110252731 - Boyer; Keith D. ; et al.	2011-10-20
Advanced Building Envelope Delivery System And Method App 20100170173 - Boyer; Keith D. ; et al.	2010-07-08
Extruded Seal Plate For Horizontal Insulated Composite Architectural Panel Vertical End Joints App 20090260311 - Boyer; Keith D. ; et al.	2009-10-22
Panel mounting clip assembly and wall or roof structure utilizing the same Grant 4,400,922 - Boyer August 30, 1	1983-08-30

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