Boyden; Demick
Patent Applications and Registrations
Patent applications and USPTO patent grants for Boyden; Demick.The latest application filed is for "airflow/cooling solution for chassis with orthogonal boards".
- Boyden; Demick - Pleasanton CA US
| Patent | Date |
|---|---|
| Cable management system Grant 8,503,851 - Boyden , et al. August 6, 2 | 2013-08-06 |
| Cable management system Grant 8,233,762 - Boyden , et al. July 31, 2 | 2012-07-31 |
| Airflow/cooling solution for chassis with orthogonal boards Grant 7,885,066 - Boyden , et al. February 8, 2 | 2011-02-08 |
| Airflow/cooling Solution For Chassis With Orthogonal Boards App 20100014248 - Boyden; Demick ; et al. | 2010-01-21 |
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