Boyd; William E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boyd; William E..The latest application filed is for "stacked ball grid array package module utilizing one or more interposer layers".

Company Profile

0.6.3

Boyd; William E. - San Clemente CA
Boyd; William E. - Nashville TN
Boyd; William E. - Muskegon MI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked ball grid array package module utilizing one or more interposer layers Grant 8,299,594 - Michaels , et al. October 30, 2	2012-10-30
Stacked Ball Grid Array Package Module Utilizing One Or More Interposer Layers App 20100140777 - Michaels; Daniel ; et al.	2010-06-10
Stacked ball grid array package module utilizing one or more interposer layers Grant 7,709,943 - Michaels , et al. May 4, 2	2010-05-04
BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same Grant 7,511,369 - Keith , et al. March 31, 2	2009-03-31
BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same App 20070158805 - Keith; Gann ; et al.	2007-07-12
Stacked ball grid array package module utilizing one or more interposer layers App 20060180912 - Michaels; Daniel ; et al.	2006-08-17
Air conditioner condenser housing Grant D454,186 - Caronna , et al. March 5, 2	2002-03-05
Air conditioner condenser housing Grant D434,480 - Caronna , et al. November 28, 2	2000-11-28
Accessory tray for use in surgery Grant 5,511,674 - Boyd , et al. April 30, 1	1996-04-30

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