Boyd; William D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Boyd; William D..The latest application filed is for "surgical instruments".
- Boyd; William D. - Mason OH
- Boyd; William D - Frisco TX
- Boyd; William D. - Plano TX
- Boyd, William D. - Frisco TX
- Boyd; William D. - Longwood FL
| Patent | Date |
|---|---|
| Surgical Instruments App 20200054386 - Houser; Kevin L. ; et al. | 2020-02-20 |
| Surgical instruments Grant 10,531,910 - Houser , et al. Ja | 2020-01-14 |
| Surgical Instruments App 20180092660 - Houser; Kevin L. ; et al. | 2018-04-05 |
| Surgical instruments Grant 9,707,004 - Houser , et al. July 18, 2 | 2017-07-18 |
| Surgical instruments Grant 9,642,644 - Houser , et al. May 9, 2 | 2017-05-09 |
| Surgical instruments Grant 9,220,527 - Houser , et al. December 29, 2 | 2015-12-29 |
| Surgical Instruments App 20150265308 - Houser; Kevin L. ; et al. | 2015-09-24 |
| Surgical Instruments App 20150257781 - Houser; Kevin L. ; et al. | 2015-09-17 |
| Surgical Instruments App 20140336686 - Houser; Kevin L. ; et al. | 2014-11-13 |
| Surgical instruments Grant 8,808,319 - Houser , et al. August 19, 2 | 2014-08-19 |
| Surgical instruments Grant 8,652,155 - Houser , et al. February 18, 2 | 2014-02-18 |
| Surgical Instruments App 20110288452 - Houser; Kevin L. ; et al. | 2011-11-24 |
| Thermally enhanced single inline package (SIP) Grant 8,053,285 - Haga , et al. November 8, 2 | 2011-11-08 |
| Surgical instruments App 20090030437 - Houser; Kevin L. ; et al. | 2009-01-29 |
| Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement App 20060226521 - Coyle; Anthony L. ; et al. | 2006-10-12 |
| Semiconductor package having integrated metal parts for thermal enhancement Grant 7,084,494 - Coyle , et al. August 1, 2 | 2006-08-01 |
| Semiconductor package having integrated metal parts for thermal enhancement App 20050280124 - Coyle, Anthony L. ; et al. | 2005-12-22 |
| Multi-chip flip package with substrate for inter-die coupling App 20050230842 - Swanson, Leland S. ; et al. | 2005-10-20 |
| Wafer-level assembly method for chip-size devices having flipped chips App 20050151268 - Boyd, William D. ; et al. | 2005-07-14 |
| Adjustable box wrench Grant D390,764 - Boyd , et al. February 17, 1 | 1998-02-17 |
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