| Patent | Date |
|---|
Wire bond through-via structure and method
Grant 9,741,680 - Bindrup , et al. August 22, 2 | 2017-08-22 |
Cap chip and reroute layer for stacked microelectronic module
Grant 9,728,507 - He , et al. August 8, 2 | 2017-08-08 |
Wire bond through-via structure and method
Grant 9,431,275 - Bindrup , et al. August 30, 2 | 2016-08-30 |
Self-calibrating targeting sight
Grant 9,046,322 - Justice , et al. June 2, 2 | 2015-06-02 |
Stackable layer containing ball grid array package
Grant 8,835,218 - Gann , et al. September 16, 2 | 2014-09-16 |
Anti-tamper wrapper interconnect method and a device
Grant 8,637,985 - Bindrup , et al. January 28, 2 | 2014-01-28 |
Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method
Grant 8,637,140 - Yamaguchi , et al. January 28, 2 | 2014-01-28 |
Method for fabricating a neo-layer using stud bumped bare die
Grant 8,609,473 - Lieu , et al. December 17, 2 | 2013-12-17 |
Method for depackaging prepackaged integrated circuit die and a product from the method
Grant 8,586,407 - Lieu , et al. November 19, 2 | 2013-11-19 |
Stacked Physically Uncloneable Function Sense and Respond Module
App 20130141137 - Krutzik; Christian ; et al. | 2013-06-06 |
Energy harvesting buoy
Grant 8,415,819 - Sapir , et al. April 9, 2 | 2013-04-09 |
Cap Chip and Reroute Layer for Stacked Microelectronic Module
App 20130020572 - He; Sambo ; et al. | 2013-01-24 |
Method for precision integrated circuit die singulation using differential etch rates
Grant RE43,877 - Ludwig , et al. December 25, 2 | 2012-12-25 |
Portable lip reading sensor system
Grant 8,271,262 - Hsu , et al. September 18, 2 | 2012-09-18 |
Method for Fabricating a Small Footprint Chip-Scale Package and a Device Made from the Method
App 20120211886 - Lieu; Peter ; et al. | 2012-08-23 |
Anti-Tamper Wrapper Interconnect Method and a Device
App 20120205801 - Bindrup; Randy ; et al. | 2012-08-16 |
Tamper-Resistant Memory Device With Variable Data Transmission Rate
App 20120185636 - Leon; John ; et al. | 2012-07-19 |
Self-Calibrating Targeting Sight
App 20120126001 - Justice; James ; et al. | 2012-05-24 |
Method for Defining an Electronically Conductive Metal Structure on a Three-Dimensional Element and a Device Made From the Method
App 20120094092 - Yamaguchi; James ; et al. | 2012-04-19 |
Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die
App 20120068336 - Lieu; Peter ; et al. | 2012-03-22 |
Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method
App 20120068341 - Lieu; Peter ; et al. | 2012-03-22 |
Wire Bond Through-Via Structure and Method
App 20120068333 - Bindrup; Randy ; et al. | 2012-03-22 |
Method for Control of Solder Collapse in Stacked Microelectronic Structure
App 20120069528 - Bindrup; Randy ; et al. | 2012-03-22 |
Stackable Layer Containing Ball Grid Array Package
App 20110269270 - Gann; Keith ; et al. | 2011-11-03 |
Secure Anti-Tamper Integrated Layer Security Device Comprising Nano-Structures
App 20110227603 - Leon; John ; et al. | 2011-09-22 |
Stackable layer containing ball grid array package
Grant 7,982,300 - Gann , et al. July 19, 2 | 2011-07-19 |
High density array module and connector
App 20110147568 - Miyake; Michael ; et al. | 2011-06-23 |
Field programmable gate array utilizing dedicated memory stacks in a vertical layer format
Grant 7,902,879 - Ozguz , et al. March 8, 2 | 2011-03-08 |
Energy harvesting buoy
App 20110031749 - Sapir; Itzhak ; et al. | 2011-02-10 |
Tamper-resistant electronic circuit and module incorporating electrically conductive nano-structures
App 20110031982 - Leon; John ; et al. | 2011-02-10 |
Stackable Semiconductor Chip Layer Comprising Prefabricated Trench Interconnect Vias
App 20100291735 - Ozguz; Volkan ; et al. | 2010-11-18 |
Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
Grant 7,786,562 - Ozguz , et al. August 31, 2 | 2010-08-31 |
Stacked microelectronic layer and module with three-axis channel T-connects
Grant 7,777,321 - Gann , et al. August 17, 2 | 2010-08-17 |
Stackable Layer Containing Ball Grid Array Package
App 20100181662 - Gann; Keith ; et al. | 2010-07-22 |
Field Programmable Gate Array Utilizing Dedicated Memory Stacks In A Vertical Layer Format
App 20100148822 - Ozguz; Volkan H. ; et al. | 2010-06-17 |
Ball grid array package format layers and structure
Grant 7,714,426 - Gann , et al. May 11, 2 | 2010-05-11 |
Field programmable gate array utilizing dedicated memory stacks in a vertical layer format
Grant 7,649,386 - Ozguz , et al. January 19, 2 | 2010-01-19 |
Field programmable gate array utilizing dedicated memory stacks in a vertical layer format
App 20080074144 - Ozguz; Volkan ; et al. | 2008-03-27 |
Method for precision integrated circuit die singulation using differential etch rates
Grant 7,335,576 - David , et al. February 26, 2 | 2008-02-26 |
Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array
Grant 7,235,785 - Hornback , et al. June 26, 2 | 2007-06-26 |
Method for precision integrated circuit die singulation using differential etch rates
App 20060079072 - David; Ludwig ; et al. | 2006-04-13 |
Stacked microelectronic layer and module with three-axis channel T-connects
App 20060043563 - Gann; Keith D. ; et al. | 2006-03-02 |
Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
App 20050277288 - Ozguz, Volkan ; et al. | 2005-12-15 |
Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array
App 20050205785 - Hornback, Bert ; et al. | 2005-09-22 |
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