Boyd; Steven D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Boyd; Steven D..The latest application filed is for "plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor".
- Boyd; Steven D. - Woodbury MN
| Patent | Date |
|---|---|
| Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor Grant 7,147,767 - Boyd , et al. December 12, 2 | 2006-12-12 |
| Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor App 20040112756 - Boyd, Steven D. ; et al. | 2004-06-17 |
| Flame Retardant Carbonate Polymers And Use Thereof App 20030022971 - Boyd, Steven D. ; et al. | 2003-01-30 |
| Bis (perfluoralkanesulfonyl)imide surfactant salts in electrochemical systems Grant 6,280,883 - Lamanna , et al. August 28, 2 | 2001-08-28 |
| SEC | 0001266610 | BOYD STEVEN D |
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