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name:-0.0086638927459717
name:-0.0034101009368896
Boyd; Raymond J. Patent Filings

Boyd; Raymond J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boyd; Raymond J..The latest application filed is for "pressure sensing system with heater assembly".

Company Profile
2.5.1
  • Boyd; Raymond J. - Bloomfield NY
  • Boyd; Raymond J. - Holcomb NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Pressure sensing system with heater assembly
Grant 10,746,621 - Gehm , et al. A
2020-08-18
Pressure Sensing System With Heater Assembly
App 20190049327 - Gehm; William J. ;   et al.
2019-02-14
Optical reader with selectable processing characteristics for reading data in multiple formats
Grant 6,505,778 - Reddersen , et al. January 14, 2
2003-01-14
Optical reader with selectable processing characteristics for reading data in multiple formats
Grant 6,176,429 - Reddersen , et al. January 23, 2
2001-01-23
Bar code digitizer including a voltage comparator
Grant 5,864,129 - Boyd January 26, 1
1999-01-26
Bar code reading and data collection unit with ultrasonic wireless data transmission
Grant 5,665,956 - La , et al. September 9, 1
1997-09-09

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