BOYD, JR.; Wendell Glenn

Patent Applications and Registrations

Patent applications and USPTO patent grants for BOYD, JR.; Wendell Glenn.The latest application filed is for "methods, systems, and apparatus for conducting chucking operations using an adjusted chucking voltage if a process shift occurs".

Company Profile

14.9.18

BOYD, JR.; Wendell Glenn - Morgan Hill CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods, Systems, And Apparatus For Conducting Chucking Operations Using An Adjusted Chucking Voltage If A Process Shift Occurs App 20220270936 - BOYD, JR.; Wendell Glenn ; et al.	2022-08-25
Forming Mesas On An Electrostatic Chuck App 20220270907 - BOYD, JR.; Wendell Glenn ; et al.	2022-08-25
Chamber Component With Protective Ceramic Coating Containing Yttrium, Aluminum And Oxygen App 20220254672 - Boyd, Jr.; Wendell Glenn ; et al.	2022-08-11
Polishing jig assembley for a new or refurbished electrostatic chuck App 20220088743 - LU; William Ming-ye ; et al.	2022-03-24
Electrostatic Chuck With Improved Temperature Control App 20220005723 - Panavalappil Kumarankutty; Hanish Kumar ; et al.	2022-01-06
ESC substrate support with chucking force control Grant 11,114,327 - Boyd, Jr. , et al. September 7, 2	2021-09-07
Substrate chucking and dechucking methods Grant 11,114,326 - Boyd, Jr. , et al. September 7, 2	2021-09-07
Method and apparatus for direct measurement of chucking force on an electrostatic chuck Grant 11,054,317 - Potter , et al. July 6, 2	2021-07-06
Substrate Support With Real Time Force And Film Stress Control App 20210066038 - BOYD, JR.; Wendell Glenn ; et al.	2021-03-04
Bond protection around porous plugs Grant 10,847,402 - Boyd, Jr. , et al. November 24, 2	2020-11-24
Substrate Support Assembly With Deposited Surface Features App 20200243368 - Boyd, JR.; Wendell Glenn ; et al.	2020-07-30
Wireless In-situ Real-time Measurement Of Electrostatic Chucking Force In Semiconductor Wafer Processing App 20200194290 - Gopalan; Ramesh ; et al.	2020-06-18
Substrate support assembly with deposited surface features Grant 10,679,885 - Boyd, Jr. , et al.	2020-06-09
Polishing of electrostatic substrate support geometries Grant 10,654,147 - Boyd, Jr. , et al.	2020-05-19
Substrate distance monitoring Grant 10,648,788 - Boyd, Jr. , et al.	2020-05-12
Method And Apparatus For Direct Measurement Of Chucking Force On An Electrostatic Chuck App 20200103294 - Potter; Charles G. ; et al.	2020-04-02
Real time monitoring with closed loop chucking force control Grant 10,460,916 - Boyd, Jr. , et al. Oc	2019-10-29
Bond Protection Around Porous Plugs App 20190304827 - BOYD, JR.; Wendell Glenn ; et al.	2019-10-03
Substrate Chucking And Dechucking Methods App 20190206712 - BOYD, JR.; Wendell Glenn ; et al.	2019-07-04
Cmp Soft Polishing Of Electrostatic Substrate Support Geometries App 20190111541 - BOYD, JR.; Wendell Glenn ; et al.	2019-04-18
Soft Chucking And Dechucking For Electrostatic Chucking Substrate Supports App 20190080949 - BOYD, JR.; Wendell Glenn ; et al.	2019-03-14
Esc Substrate Support With Chucking Force Control App 20190067070 - BOYD, JR.; Wendell Glenn ; et al.	2019-02-28
Real Time Monitoring With Closed Loop Chucking Force Control App 20180330926 - BOYD, JR.; Wendell Glenn ; et al.	2018-11-15
Substrate Support Assembly With Deposited Surface Features App 20180301364 - Boyd, JR.; Wendell Glenn ; et al.	2018-10-18
Substrate support assembly with deposited surface features Grant 10,020,218 - Boyd, Jr. , et al. July 10, 2	2018-07-10
Substrate Distance Monitoring App 20170350688 - BOYD, JR.; Wendell Glenn ; et al.	2017-12-07
Substrate Support Assembly With Deposited Surface Features App 20170140970 - Boyd, JR.; Wendell Glenn ; et al.	2017-05-18

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