| Patent | Date |
|---|
System And Method For Choosing And Pouring Beverages
App 20220234880 - Rudick; Arthur G. ; et al. | 2022-07-28 |
System and method for choosing and pouring beverages
Grant 11,312,610 - Rudick , et al. April 26, 2 | 2022-04-26 |
Remote Beverage Selection With A Beverage Dispenser
App 20220073335 - CUPPARI; Scott ; et al. | 2022-03-10 |
Vending mechanism
Grant 10,930,107 - Burnett , et al. February 23, 2 | 2021-02-23 |
System And Method For Choosing And Pouring Beverages
App 20200031656 - Rudick; Art ; et al. | 2020-01-30 |
Diagnostic for Sepsis
App 20200032321 - Hancock; Robert E. W. ; et al. | 2020-01-30 |
Vending Mechanism
App 20190172295 - Burnett; Clayton ; et al. | 2019-06-06 |
System, method, and computer-readable storage medium for payment of online purchases via a portable computing device
Grant 9,953,314 - Jaquez , et al. April 24, 2 | 2018-04-24 |
Modular ultra-wide internal bus mainframe processing units
Grant 9,904,636 - Boyd February 27, 2 | 2018-02-27 |
Modular Ultra-wide Internal Bus Mainframe Processing Units
App 20170116140 - Boyd; John | 2017-04-27 |
Diagnostic for Sepsis
App 20170073734 - Hancock; Robert E. W. ; et al. | 2017-03-16 |
Controlled ambient system for interface engineering
Grant 9,117,860 - Boyd , et al. August 25, 2 | 2015-08-25 |
Processes And Systems For Engineering A Barrier Surface For Copper Deposition
App 20150214093 - Dordi; Yezdi ; et al. | 2015-07-30 |
Methods For Barrier Interface Preparation Of Copper Interconnect
App 20150132946 - Yoon; Hyungsuk Alexander ; et al. | 2015-05-14 |
Apparatus For Barrier Interface Preparation Of Copper Interconnect
App 20150128861 - Yoon; Hyungsuk Alexander ; et al. | 2015-05-14 |
Apparatus for the removal of a fluorinated polymer from a substrate
Grant 8,926,789 - Yoon , et al. January 6, 2 | 2015-01-06 |
Method for barrier interface preparation of copper interconnect
Grant 8,916,232 - Yoon , et al. December 23, 2 | 2014-12-23 |
Processes And Systems For Engineering A Copper Surface For Selective Metal Deposition
App 20140322446 - Dordi; Yezdi ; et al. | 2014-10-30 |
Location-based networking methods and systems for performing the same
Grant 8,838,685 - Boyd September 16, 2 | 2014-09-16 |
Processes and systems for engineering a copper surface for selective metal deposition
Grant 8,771,804 - Dordi , et al. July 8, 2 | 2014-07-08 |
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
Grant 8,747,960 - Dordi , et al. June 10, 2 | 2014-06-10 |
Methods And Apparatuses For Three Dimensional Integrated Circuits
App 20140145334 - BOYD; John ; et al. | 2014-05-29 |
Methods and apparatuses for three dimensional integrated circuits
Grant 8,673,769 - Boyd , et al. March 18, 2 | 2014-03-18 |
Computer-based methods and systems for arranging meetings between users and methods and systems for verifying background information of users
Grant 8,621,005 - Boyd , et al. December 31, 2 | 2013-12-31 |
System, Method, and Computer-Readable Storage Medium for Payment of Online Purchases via a Portable Computing Device
App 20130297390 - Jaquez; Abiel ; et al. | 2013-11-07 |
System, Method, and Computer-Readable Storage Medium For Identifying A Product
App 20130297464 - Jaquez; Abiel ; et al. | 2013-11-07 |
Computer-based Methods and Systems for Verifying User Affiliations for Private or White Label Services
App 20130254300 - Berk; Adam ; et al. | 2013-09-26 |
Device with post-contact back end of line through-hole via integration
Grant 8,519,461 - Boyd , et al. August 27, 2 | 2013-08-27 |
Method and apparatus for material deposition
Grant 8,490,573 - Dordi , et al. July 23, 2 | 2013-07-23 |
Methods For Three-dimensional Integrated Circuit Through Hole Via Gapfill And Overburden Removal
App 20130171820 - Boyd; John ; et al. | 2013-07-04 |
Electroplating head and method for operating the same
Grant 8,419,917 - Dordi , et al. April 16, 2 | 2013-04-16 |
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal
Grant 8,323,460 - Boyd , et al. December 4, 2 | 2012-12-04 |
Processes and Systems for Engineering a Barrier Surface for Copper Deposition
App 20120269987 - Dordi; Yezdi ; et al. | 2012-10-25 |
Device With Post-contact Back End Of Line Through-hole Via Integration
App 20120205807 - Boyd; John ; et al. | 2012-08-16 |
Processes and systems for engineering a barrier surface for copper deposition
Grant 8,241,701 - Dordi , et al. August 14, 2 | 2012-08-14 |
Methods of post-contact back end of line through-hole via integration
Grant 8,187,968 - Boyd , et al. May 29, 2 | 2012-05-29 |
Methods and systems for barrier layer surface passivation
Grant 8,133,812 - Dordi , et al. March 13, 2 | 2012-03-13 |
Systems And Methods For Providing Mobile Targeted Advertisements
App 20110288917 - Wanek; James ; et al. | 2011-11-24 |
Methods and systems for low interfacial oxide contact between barrier and copper metallization
Grant 8,053,355 - Redeker , et al. November 8, 2 | 2011-11-08 |
Computer-based Methods and Systems for Arranging Meetings Between Users and Methods and Systems for Verifying Background Information of Users
App 20110270926 - Boyd; John ; et al. | 2011-11-03 |
Method and apparatus for plating semiconductor wafers
Grant 8,048,283 - Dordi , et al. November 1, 2 | 2011-11-01 |
Apparatus And Method For Depositing And Planarizing Thin Films Of Semiconductor Wafers
App 20110155563 - Ravkin; Mike ; et al. | 2011-06-30 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
Grant 7,947,157 - Ravkin , et al. May 24, 2 | 2011-05-24 |
Method and Apparatus for Material Deposition
App 20110081779 - Dordi; Yezdi ; et al. | 2011-04-07 |
Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency
Grant 7,909,934 - Boyd , et al. March 22, 2 | 2011-03-22 |
Thermal methods for cleaning post-CMP wafers
Grant 7,884,017 - Wang , et al. February 8, 2 | 2011-02-08 |
Location-Based Networking Methods and Systems for Performing the Same
App 20110022659 - Boyd; John | 2011-01-27 |
Method for electroless depositing a material on a surface of a wafer
Grant 7,875,554 - Dordi , et al. January 25, 2 | 2011-01-25 |
Methods And Systems For Low Interfacial Oxide Contact Between Barrier And Copper Metallization
App 20100267229 - Redeker; Fritz ; et al. | 2010-10-21 |
Apparatus For The Removal Of A Fluorinated Polymer From A Substrate
App 20100181025 - Yoon; Hyungsuk Alexander ; et al. | 2010-07-22 |
Method and Apparatus for Plating Semiconductor Wafers
App 20100170803 - Dordi; Yezdi ; et al. | 2010-07-08 |
Methods for providing a confined liquid for immersion lithography
Grant 7,749,689 - Hemker , et al. July 6, 2 | 2010-07-06 |
Methods and systems for low interfacial oxide contact between barrier and copper metallization
Grant 7,749,893 - Redeker , et al. July 6, 2 | 2010-07-06 |
Thermal Methods For Cleaning Post-cmp Wafers
App 20100136788 - Wang; Zhonghui Alex ; et al. | 2010-06-03 |
Thermal methods for cleaning post-CMP wafers
Grant 7,709,400 - Wang , et al. May 4, 2 | 2010-05-04 |
Method and apparatus for plating semiconductor wafers
Grant 7,704,367 - Dordi , et al. April 27, 2 | 2010-04-27 |
Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
Grant 7,691,278 - Yoon , et al. April 6, 2 | 2010-04-06 |
Methods Of Post-contact Back End Of Line Through-hole Via Integration
App 20100044867 - Boyd; John ; et al. | 2010-02-25 |
Methods And Systems For Barrier Layer Surface Passivation
App 20100009535 - Dordi; Yezdi ; et al. | 2010-01-14 |
Self assembled monolayer for improving adhesion between copper and barrier layer
App 20090304914 - Nalla; Praveen ; et al. | 2009-12-10 |
Methods of post-contact back end of the line through-hole via integration
Grant 7,615,480 - Boyd , et al. November 10, 2 | 2009-11-10 |
Electroplating Head and Method for Operating the Same
App 20090242413 - Dordi; Yezdi ; et al. | 2009-10-01 |
Methods and systems for barrier layer surface passivation
Grant 7,592,259 - Dordi , et al. September 22, 2 | 2009-09-22 |
Computer-based Methods For Arranging Meetings And Systems For Performing The Same
App 20090222519 - Boyd; John | 2009-09-03 |
Method and apparatus for semiconductor wafer planarization
Grant 7,582,565 - Redeker , et al. September 1, 2 | 2009-09-01 |
Electroplating head and method for operating the same
Grant 7,563,348 - Dordi , et al. July 21, 2 | 2009-07-21 |
Methods of post-contact back end of line through-hole via integration
App 20080315418 - Boyd; John ; et al. | 2008-12-25 |
Methods and apparatuses for three dimensional integrated circuits
App 20080315422 - Boyd; John ; et al. | 2008-12-25 |
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal
App 20080314756 - Boyd; John ; et al. | 2008-12-25 |
Thermal methods for cleaning post-CMP wafers
App 20080280456 - Wang; Zhonghui Alex ; et al. | 2008-11-13 |
Methods for Providing a Confined Liquid for Immersion Lithography
App 20080171292 - Hemker; David ; et al. | 2008-07-17 |
Method and Apparatus for Semiconductor Wafer Planarization
App 20080166885 - Redeker; Fred C. ; et al. | 2008-07-10 |
Self-limiting plating method
App 20080152823 - Boyd; John ; et al. | 2008-06-26 |
Method and Apparatus for Material Deposition
App 20080153291 - Dordi; Yezdi ; et al. | 2008-06-26 |
Methods and systems for low interfacial oxide contact between barrier and copper metallization
App 20080142972 - Redeker; Fritz ; et al. | 2008-06-19 |
Methods and systems for barrier layer surface passivation
App 20080146025 - Dordi; Yezdi ; et al. | 2008-06-19 |
Apparatus and method for providing a confined liquid for immersion lithography
Grant 7,367,345 - Hemker , et al. May 6, 2 | 2008-05-06 |
Method and apparatus for semiconductor wafer planarization
Grant 7,368,017 - Redeker , et al. May 6, 2 | 2008-05-06 |
Method and apparatus for material deposition in semiconductor fabrication
Grant 7,358,186 - Dordi , et al. April 15, 2 | 2008-04-15 |
Method For Gap Fill In Controlled Ambient System
App 20080057182 - Boyd; John ; et al. | 2008-03-06 |
Controlled ambient system for interface engineering
App 20080057221 - Boyd; John ; et al. | 2008-03-06 |
Methods and apparatus for barrier interface preparation of copper interconnect
App 20080057198 - Yoon; Hyungsuk Alexander ; et al. | 2008-03-06 |
Processes and systems for engineering a copper surface for selective metal deposition
App 20070292604 - Dordi; Yezdi ; et al. | 2007-12-20 |
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
App 20070292615 - Dordi; Yezdi ; et al. | 2007-12-20 |
Processes and systems for engineering a barrier surface for copper deposition
App 20070292603 - Dordi; Yezdi ; et al. | 2007-12-20 |
Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
App 20070072433 - Yoon; Hyungsuk Alexander ; et al. | 2007-03-29 |
Protecting thin semiconductor wafers during back-grinding in high-volume production
Grant 7,186,629 - Wesselmann , et al. March 6, 2 | 2007-03-06 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
Grant 7,153,400 - Ravkin , et al. December 26, 2 | 2006-12-26 |
Method and system for native-byte form handling
Grant 7,146,369 - White , et al. December 5, 2 | 2006-12-05 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
App 20060260932 - Ravkin; Mike ; et al. | 2006-11-23 |
Semiconductor wafer material removal apparatus and method for operating the same
Grant 7,048,608 - Boyd , et al. May 23, 2 | 2006-05-23 |
Semiconductor Wafer Material Removal Apparatus And Method For Operating The Same
App 20060063470 - Boyd; John ; et al. | 2006-03-23 |
Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
Grant 6,995,067 - Boyd , et al. February 7, 2 | 2006-02-07 |
Protecting thin semiconductor wafers during back-grinding in high-volume production
App 20060008650 - Wesselmann; Mark ; et al. | 2006-01-12 |
Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency
App 20060000487 - Boyd; John ; et al. | 2006-01-05 |
Method and apparatus for plating semiconductor wafers
App 20050284767 - Dordi, Yezdi ; et al. | 2005-12-29 |
Electroplating head and method for operating the same
App 20050284748 - Dordi, Yezdi ; et al. | 2005-12-29 |
Methods using active retainer rings for improving edge performance in CMP applications
Grant 6,913,521 - Owczarz , et al. July 5, 2 | 2005-07-05 |
Method and apparatus for semiconductor wafer planarization
App 20050126932 - Redeker, Fred C. ; et al. | 2005-06-16 |
Method and apparatus for material deposition
App 20050130415 - Dordi, Yezdi ; et al. | 2005-06-16 |
Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
Grant 6,864,181 - Redeker , et al. March 8, 2 | 2005-03-08 |
Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
App 20050042861 - Redeker, Fred C. ; et al. | 2005-02-24 |
Method and system for native-byte form handling
App 20050027709 - White, Eric ; et al. | 2005-02-03 |
Method and system for native-byte form handling
Grant 6,850,941 - White , et al. February 1, 2 | 2005-02-01 |
Method using active retainer rings for improving edge performance in CMP applications
App 20040235399 - Owczarz, Alek ; et al. | 2004-11-25 |
Method and apparatus for assessment of effectiveness of advertisements on an Internet hub network
App 20040204983 - Shen, David ; et al. | 2004-10-14 |
Method And Apparatus To Form A Planarized Cu Interconnect Layer Using Electroless Membrane Deposition
App 20040192030 - Redeker, Fred C. ; et al. | 2004-09-30 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
App 20040178060 - Ravkin, Mike ; et al. | 2004-09-16 |
Platen design for improving edge performance in CMP applications
Grant 6,776,695 - Owczarz , et al. August 17, 2 | 2004-08-17 |
Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
App 20040154637 - Boyd, John ; et al. | 2004-08-12 |
Pressurized membrane platen design for improving performance in CMP applications
Grant 6,607,425 - Kistler , et al. August 19, 2 | 2003-08-19 |
Interlocking Chemical Mechanical Polishing System
App 20020185467 - Boyd, John ; et al. | 2002-12-12 |
Piezoelectric platen design for improving performance in CMP applications
App 20020081945 - Kistler, Rod ; et al. | 2002-06-27 |
Platen design for improving edge performance in CMP applications
App 20020081947 - Owczarz, Alek ; et al. | 2002-06-27 |
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