Boyd; John M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boyd; John M..The latest application filed is for "method and apparatus for wafer electroless plating".

Company Profile

0.90.57

Boyd; John M. - Woodlawn CA
Boyd; John M. - Hillsboro OR US
Boyd; John M. - Atascadero CA US
Boyd; John M. - Ataseadero CA
Boyd; John M. - San Luis Obispo CA
Boyd; John M. - Ottawa CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for atomic layer deposition Grant 9,359,673 - Yoon , et al. June 7, 2	2016-06-07
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Method for removing material from semiconductor wafer and apparatus for performing the same Grant 8,691,027 - Korolik , et al. April 8, 2	2014-04-08
Methods for atomic layer deposition Grant 8,623,456 - Yoon , et al. January 7, 2	2014-01-07
Simultaneous electroless plating of two substrates Grant 8,622,020 - Thie , et al. January 7, 2	2014-01-07
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Pre-planarization system and method Grant 8,403,727 - Redeker , et al. March 26, 2	2013-03-26
Method For Removing Material From Semiconductor Wafer And Apparatus For Performing The Same App 20130061887 - Korolik; Mikhail ; et al.	2013-03-14
Methods For Atomic Layer Deposition App 20130040460 - Yoon; Hyungsuk Alexander ; et al.	2013-02-14
System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology Grant 8,330,072 - Boyd , et al. December 11, 2	2012-12-11
Method for removing material from semiconductor wafer and apparatus for performing the same Grant 8,323,420 - Korolik , et al. December 4, 2	2012-12-04
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Apparatus and method for atomic layer deposition Grant 8,287,647 - Yoon , et al. October 16, 2	2012-10-16
Apparatus And Method For Atomic Layer Deposition App 20120248219 - Yoon; Hyungsuk Alexander ; et al.	2012-10-04
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Interconnect Structure And Method Of Manufacturing A Damascene Structure App 20110306203 - Dordi; Yezdi ; et al.	2011-12-15
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Interconnect structure and method of manufacturing a damascene structure Grant 8,026,605 - Dordi , et al. September 27, 2	2011-09-27
Electroless Plating Method and Apparatus App 20110011335 - Thie; William ; et al.	2011-01-20
Apparatus for plating semiconductor wafers Grant 7,862,693 - Dordi , et al. January 4, 2	2011-01-04
Substrate Preparation Using Megasonic Coupling Fluid Meniscus App 20100319726 - Boyd; John M. ; et al.	2010-12-23
Electroless plating method and apparatus Grant 7,829,152 - Thie , et al. November 9, 2	2010-11-09
Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same Grant 7,810,513 - Boyd , et al. October 12, 2	2010-10-12
Apparatus for Applying a Plating Solution for Electroless Deposition App 20100239767 - Dordi; Yezdi ; et al.	2010-09-23
Apparatus for applying a plating solution for electroless deposition Grant 7,752,996 - Dordi , et al. July 13, 2	2010-07-13
System Method And Apparatus For Dry-in, Dry-out, Low Defect Laser Dicing Using Proximity Technology App 20100108652 - Boyd; John M. ; et al.	2010-05-06
System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology Grant 7,675,000 - Boyd , et al. March 9, 2	2010-03-09
Apparatus and method for semiconductor wafer electroplanarization Grant 7,648,616 - Boyd , et al. January 19, 2	2010-01-19
Apparatus and method for plating semiconductor wafers Grant 7,645,364 - Dordi , et al. January 12, 2	2010-01-12
Apparatus For Integrated Surface Treatment And Deposition For Copper Interconnect App 20090320749 - Yoon; Hyungsuk Alexander ; et al.	2009-12-31
Apparatus for Plating Semiconductor Wafers App 20090321250 - Dordi; Yezdi N. ; et al.	2009-12-31
Apparatus and method for integrated surface treatment and deposition for copper interconnect Grant 7,615,486 - Yoon , et al. November 10, 2	2009-11-10
Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid Grant 7,604,011 - Redeker , et al. October 20, 2	2009-10-20
Apparatus and method for confined area planarization Grant 7,598,175 - Boyd , et al. October 6, 2	2009-10-06
Method and system to separate and recycle divergent chemistries Grant 7,596,886 - Boyd , et al. October 6, 2	2009-10-06
Wafer edge surface treatment with liquid meniscus Grant 7,584,761 - Yun , et al. September 8, 2	2009-09-08
Enhanced wafer cleaning method Grant 7,568,488 - Yun , et al. August 4, 2	2009-08-04
Apparatus for developing photoresist and method for operating the same Grant 7,520,284 - Boyd , et al. April 21, 2	2009-04-21
Methods of proximity head brushing Grant 7,503,983 - Boyd , et al. March 17, 2	2009-03-17
Apparatus and method for plating semiconductor wafers App 20080271992 - Dordi; Yezdi N. ; et al.	2008-11-06
Apparatus And Method For Integrated Surface Treatment And Film Deposition App 20080260967 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Atomic Layer Deposition App 20080261412 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Integrated Surface Treatment And Deposition For Copper Interconnect App 20080260940 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Pre And Post Treatment Of Atomic Layer Deposition App 20080260963 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Apparatus and Method for Confined Area Planarization App 20080227369 - Boyd; John M. ; et al.	2008-09-18
Enhanced Wafer Cleaning Method App 20080169008 - Yun; Seokmin ; et al.	2008-07-17
Apparatus and method for confined area planarization Grant 7,396,430 - Boyd , et al. July 8, 2	2008-07-08
Interconnect structure and method of manufacturing a damascene structure App 20080142971 - Dordi; Yezdi ; et al.	2008-06-19
Methods of proximity head brushing App 20080105277 - Boyd; John M. ; et al.	2008-05-08
Electroless Plating Method And Apparatus App 20080085370 - Thie; William ; et al.	2008-04-10
Proximity brush unit apparatus and method Grant 7,353,560 - Boyd , et al. April 8, 2	2008-04-08
Enhanced wafer cleaning method Grant 7,329,321 - Yun , et al. February 12, 2	2008-02-12
Apparatus For Applying A Plating Solution For Electroless Deposition App 20070264436 - Dordi; Yezdi ; et al.	2007-11-15
Apparatus and method for confined area planarization App 20070227656 - Boyd; John M. ; et al.	2007-10-04
Method and apparatus for cleaning a substrate using megasonic power Grant 7,264,007 - Boyd , et al. September 4, 2	2007-09-04
System and method for integrating in-situ metrology within a wafer process Grant 7,252,097 - Boyd , et al. August 7, 2	2007-08-07
Compliant grinding wheel Grant 7,252,736 - Boyd , et al. August 7, 2	2007-08-07
Distribution of energy in a high frequency resonating wafer processing system Grant 7,237,564 - Anderson , et al. July 3, 2	2007-07-03
Method and apparatus for simultaneously cleaning the front side and back side of a wafer Grant 7,231,682 - Boyd , et al. June 19, 2	2007-06-19
Method and Apparatus for Semiconductor Wafer Cleaning Using High-Frequency Acoustic Energy with Supercritical Fluid App 20070119477 - Redecker; Fred C. ; et al.	2007-05-31
Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid Grant 7,191,787 - Redeker , et al. March 20, 2	2007-03-20
Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette Grant 7,179,154 - Boyd , et al. February 20, 2	2007-02-20
Apparatus for oscillating a head and methods for implementing the same Grant 7,170,190 - Treur , et al. January 30, 2	2007-01-30
Method and apparatus to decouple power and cavitation for megasonic cleaning applications Grant 7,165,563 - Boyd , et al. January 23, 2	2007-01-23
Method for removing material from semiconductor wafer and apparatus for performing the same App 20070000518 - Korolik; Mikhail ; et al.	2007-01-04
Apparatus for developing photoresist and method for operating the same App 20060269877 - Boyd; John M. ; et al.	2006-11-30
Method and apparatus for fluid delivery to a backside of a substrate Grant 7,128,279 - Boyd , et al. October 31, 2	2006-10-31
Compliant wafer chuck Grant 7,108,591 - Boyd , et al. September 19, 2	2006-09-19
Methods of and apparatus for pre-planarizing a substrate Grant 7,090,562 - Boyd , et al. August 15, 2	2006-08-15
Enhanced wafer cleaning method App 20060124153 - Yun; Seokmin ; et al.	2006-06-15
Method for performing site-specific backside particle and contamination removal Grant 7,045,019 - Hemker , et al. May 16, 2	2006-05-16
Method and apparatus for megasonic cleaning of patterned substrates Grant 7,040,330 - Boyd , et al. May 9, 2	2006-05-09
Method and apparatus for megasonic cleaning with reflected acoustic waves Grant 7,040,332 - Boyd , et al. May 9, 2	2006-05-09
System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology App 20060088982 - Boyd; John M. ; et al.	2006-04-27
Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system Grant 7,025,854 - Boyd , et al. April 11, 2	2006-04-11
Method and apparatus of a variable height and controlled fluid flow platen in a chemical mechanical polishing system Grant 6,988,934 - Lee , et al. January 24, 2	2006-01-24
Apparatus for reducing compressed dry air usage during chemical mechanical planarization Grant 6,976,906 - Boyd , et al. December 20, 2	2005-12-20
Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection Grant 6,953,515 - Boyd , et al. October 11, 2	2005-10-11
Subaperture chemical mechanical planarization with polishing pad conditioning Grant 6,945,856 - Boyd , et al. September 20, 2	2005-09-20
Wafer bevel edge cleaning system and apparatus Grant 6,910,240 - Boyd , et al. June 28, 2	2005-06-28
Proximity brush unit apparatus and method App 20050132515 - Boyd, John M. ; et al.	2005-06-23
Apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system App 20050121059 - Boyd, John M. ; et al.	2005-06-09
Method and apparatus for conditioning a polishing pad Grant 6,899,601 - Boyd May 31, 2	2005-05-31
System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques Grant 6,869,337 - Boyd , et al. March 22, 2	2005-03-22
Method and apparatus for cooling a resonator of a megasonic transducer Grant 6,857,435 - Boyd , et al. February 22, 2	2005-02-22
Method for controlling galvanic corrosion effects on a single-wafer cleaning system Grant 6,858,091 - Boyd , et al. February 22, 2	2005-02-22
In-situ local heating using megasonic transducer resonator Grant 6,845,778 - Boyd , et al. January 25, 2	2005-01-25
Apparatus for removal/remaining thickness profile manipulation Grant 6,808,442 - Wei , et al. October 26, 2	2004-10-26
Web-style pad conditioning system and methods for implementing the same Grant 6,800,020 - Boyd , et al. October 5, 2	2004-10-05
System and method for integrating in-situ metrology within a wafer process App 20040182422 - Boyd, John M. ; et al.	2004-09-23
Method and apparatus for cooling a resonator of a megasonic transducer App 20040173238 - Boyd, John M. ; et al.	2004-09-09
Method and apparatus for megasonic cleaning with reflected acoustic waves App 20040168706 - Boyd, John M. ; et al.	2004-09-02
Method and apparatus for megasonic cleaning of patterned substrates App 20040163682 - Boyd, John M. ; et al.	2004-08-26
System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques App 20040166782 - Boyd, John M. ; et al.	2004-08-26
Method and apparatus for fluid delivery to a backside of a substrate App 20040144862 - Boyd, John M. ; et al.	2004-07-29
Method and apparatus for conditioning a polishing pad App 20040121710 - Boyd, John M.	2004-06-24
Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film Grant 6,752,703 - Boyd , et al. June 22, 2	2004-06-22
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool Grant 6,733,615 - Boyd , et al. May 11, 2	2004-05-11
Method and apparatus for cooling a resonator of a megasonic transducer Grant 6,729,339 - Boyd , et al. May 4, 2	2004-05-04
Method and apparatus for cleaning a substrate using megasonic power App 20040069319 - Boyd, John M. ; et al.	2004-04-15
Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization App 20040067720 - Boyd, John M. ; et al.	2004-04-08
System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques Grant 6,705,930 - Boyd , et al. March 16, 2	2004-03-16
Method and apparatus for fluid delivery to a backside of a substrate Grant 6,702,202 - Boyd , et al. March 9, 2	2004-03-09
Apparatus and method for qualifying a chemical mechanical planarization process Grant 6,679,763 - Boyd , et al. January 20, 2	2004-01-20
Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization Grant 6,656,024 - Boyd , et al. December 2, 2	2003-12-02
Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection App 20030205325 - Boyd, John M. ; et al.	2003-11-06
Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system App 20030201067 - Boyd, John M. ; et al.	2003-10-30
In-situ local heating using megasonic transducer resonator App 20030183246 - Boyd, John M. ; et al.	2003-10-02
Method and apparatus for conditioning a polishing pad Grant 6,626,743 - Boyd September 30, 2	2003-09-30
Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path Grant 6,616,801 - Boyd September 9, 2	2003-09-09
Field controlled polishing apparatus Grant 6,612,904 - Boehm , et al. September 2, 2	2003-09-02
Method and apparatus for end point triggering with integrated steering Grant 6,612,902 - Boyd , et al. September 2, 2	2003-09-02
Chemical mechanical planarization belt assembly and method of assembly Grant 6,609,961 - Lacy , et al. August 26, 2	2003-08-26
Subaperture chemical mechanical planarization with polishing pad conditioning App 20030153250 - Boyd, John M. ; et al.	2003-08-14
Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection Grant 6,599,765 - Boyd , et al. July 29, 2	2003-07-29
Subaperture chemical mechanical polishing system Grant 6,585,572 - Saldana , et al. July 1, 2	2003-07-01
Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film App 20030119431 - Boyd, John M. ; et al.	2003-06-26
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool App 20030036274 - Boyd, John M. ; et al.	2003-02-20
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool App 20030032287 - Boyd, John M. ; et al.	2003-02-13
Apparatus and method for controlling galvanic corrosion effects on a single-wafer cleaning system App 20030010361 - Boyd, John M. ; et al.	2003-01-16
Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material App 20020142601 - Boyd, John M. ; et al.	2002-10-03
Apparatus and method for qualifying a chemical mechanical planarization process Grant 6,435,952 - Boyd , et al. August 20, 2	2002-08-20
Chemical mechanical planarization belt assembly and method of assembly App 20020090899 - Lacy, Michael S. ; et al.	2002-07-11
Apparatus and method for qualifying a chemical mechanical planarization process App 20020081951 - Boyd, John M. ; et al.	2002-06-27
Field controlled polishing apparatus and method Grant 6,358,118 - Boehm , et al. March 19, 2	2002-03-19
System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques App 20010012751 - Boyd, John M. ; et al.	2001-08-09
Optical view port for chemical mechanical planarization endpoint detection Grant 6,146,242 - Treur , et al. November 14, 2	2000-11-14
Integrated circuit structure and method of fabrication thereof Grant 5,773,871 - Boyd , et al. June 30, 1	1998-06-30
Method for forming integrated circuit structure Grant 5,726,084 - Boyd , et al. March 10, 1	1998-03-10
Buried layer contact for an integrated circuit structure Grant 5,614,750 - Ellul , et al. March 25, 1	1997-03-25
Trench capacitor structure Grant 5,394,000 - Ellul , et al. February 28, 1	1995-02-28
Method of making integrated circuits Grant 5,362,669 - Boyd , et al. November 8, 1	1994-11-08
Method of forming electrodes for trench capacitors Grant 5,275,974 - Ellul , et al. January 4, 1	1994-01-04