loadpatents
name:-0.035449981689453
name:-0.031214952468872
name:-0.00047802925109863
Boyd; Diane C. Patent Filings

Boyd; Diane C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boyd; Diane C..The latest application filed is for "cmos silicide metal gate integration".

Company Profile
0.31.29
  • Boyd; Diane C. - LaGrangeville NY US
  • Boyd; Diane C - LaGrangeville NY
  • Boyd, Diane C. - Langrangeville NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and structure for strained FinFET devices
Grant 8,669,145 - Doris , et al. March 11, 2
2014-03-11
Oxidation method for altering a film structure
Grant 7,741,166 - Belyansky , et al. June 22, 2
2010-06-22
CMOS silicide metal gate integration
Grant 7,655,557 - Amos , et al. February 2, 2
2010-02-02
Method and structure for strained FinFET devices
Grant 7,602,021 - Doris , et al. October 13, 2
2009-10-13
Stressed semiconductor device structures having granular semiconductor material
Grant 7,488,658 - Doris , et al. February 10, 2
2009-02-10
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique
Grant 7,482,243 - Boyd , et al. January 27, 2
2009-01-27
Cmos Silicide Metal Gate Integration
App 20080254622 - Amos; Ricky S. ;   et al.
2008-10-16
HETERO-INTEGRATED STRAINED SILICON n- AND p- MOSFETS
App 20080251813 - Boyd; Diane C. ;   et al.
2008-10-16
CMOS silicide metal gate integration
Grant 7,411,227 - Amos , et al. August 12, 2
2008-08-12
Hetero-integrated strained silicon n- and p-MOSFETs
Grant 7,396,747 - Boyd , et al. July 8, 2
2008-07-08
Stressed Semiconductor Device Structures Having Granular Semiconductor Material
App 20080064172 - Doris; Bruce B. ;   et al.
2008-03-13
HETERO-INTEGRATED STRAINED SILICON n- AND p- MOSFETS
App 20070278517 - Boyd; Diane C. ;   et al.
2007-12-06
ULTRA-THIN Si MOSFET DEVICE STRUCTURE AND METHOD OF MANUFACTURE
App 20070228473 - Boyd; Diane C. ;   et al.
2007-10-04
Hetero-integrated strained silicon n- and p-MOSFETs
Grant 7,273,800 - Boyd , et al. September 25, 2
2007-09-25
Hybrid planar and FinFET CMOS devices
Grant 7,250,658 - Doris , et al. July 31, 2
2007-07-31
Ultra-thin Si MOSFET device structure and method of manufacture
Grant 7,247,569 - Boyd , et al. July 24, 2
2007-07-24
Method and structure for strained FinFET devices
App 20070132039 - Doris; Bruce Bennett ;   et al.
2007-06-14
CMOS transistor structure including film having reduced stress by exposure to atomic oxygen
Grant 7,202,516 - Belyansky , et al. April 10, 2
2007-04-10
SOI wafers with 30-100 .ANG. buried oxide (BOX) created by wafer bonding using 30-100 .ANG. thin oxide as bonding layer
Grant 7,166,521 - Boyd , et al. January 23, 2
2007-01-23
Ultrathin-body schottky contact MOSFET
App 20070001223 - Boyd; Diane C. ;   et al.
2007-01-04
Stressed semiconductor device structures having granular semiconductor material
Grant 7,122,849 - Doris , et al. October 17, 2
2006-10-17
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique
App 20060211184 - Boyd; Diane C. ;   et al.
2006-09-21
CMOS silicide metal gate integration
App 20060189061 - Amos; Ricky S. ;   et al.
2006-08-24
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique
Grant 7,075,150 - Boyd , et al. July 11, 2
2006-07-11
CMOS transistor structure including film having reduced stress by exposure to atomic oxygen
App 20060131659 - Belyansky; Michael P. ;   et al.
2006-06-22
CMOS silicide metal gate integration
Grant 7,056,782 - Amos , et al. June 6, 2
2006-06-06
Oxidation method for altering a film structure
App 20060105516 - Belyansky; Michael P. ;   et al.
2006-05-18
Hetero-integrated strained silicon n-and p-MOSFETs
App 20060091377 - Boyd; Diane C. ;   et al.
2006-05-04
Ultra-thin body super-steep retrograde well (SSRW) FET devices
Grant 7,002,214 - Boyd , et al. February 21, 2
2006-02-21
Ultra-thin Body Super-steep Retrograde Well (ssrw) Fet Devices
App 20060022270 - Boyd; Diane C. ;   et al.
2006-02-02
Method And Structure For Strained Finfet Devices
App 20060014338 - Doris; Bruce Bennett ;   et al.
2006-01-19
Oxidation method for altering a film structure and CMOS transistor structure formed therewith
Grant 6,982,196 - Belyansky , et al. January 3, 2
2006-01-03
Hybrid planar and FinFET CMOS devices
App 20050263831 - Doris, Bruce B. ;   et al.
2005-12-01
CMOS silicide metal gate integration
App 20050186747 - Amos, Ricky S. ;   et al.
2005-08-25
High performance CMOS device structure with mid-gap metal gate
Grant 6,916,698 - Mocuta , et al. July 12, 2
2005-07-12
Hybrid planar and finFET CMOS devices
Grant 6,911,383 - Doris , et al. June 28, 2
2005-06-28
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique
App 20050116289 - Boyd, Diane C. ;   et al.
2005-06-02
Ultra-thin Si MOSFET device structure and method of manufacture
App 20050118826 - Boyd, Diane C. ;   et al.
2005-06-02
Method and process to make multiple-threshold metal gates CMOS technology
App 20050106788 - Amos, Ricky ;   et al.
2005-05-19
Stressed Semiconductor Device Structures Having Granular Semiconductor Material
App 20050106799 - Doris, Bruce B. ;   et al.
2005-05-19
Oxidation Method For Altering A Film Structure And Cmos Transistor Structure Formed Therewith
App 20050093081 - Belyansky, Michael P. ;   et al.
2005-05-05
SOI wafers with 30-100 A buried oxide (BOX) created by wafer bonding using 30-100 A thin oxide as bonding layer
App 20050042841 - Boyd, Diane C. ;   et al.
2005-02-24
Method and process to make multiple-threshold metal gates CMOS technology
Grant 6,846,734 - Amos , et al. January 25, 2
2005-01-25
Fully-depleted SOI MOSFETs with low source and drain resistance and minimal overlap capacitance using a recessed channel damascene gate process
Grant 6,841,831 - Hanafi , et al. January 11, 2
2005-01-11
HYBRID PLANAR AND FinFET CMOS DEVICES
App 20040266076 - Doris, Bruce B. ;   et al.
2004-12-30
SOI wafers with 30-100 .ANG. buried oxide (BOX) created by wafer bonding using 30-100 .ANG. thin oxide as bonding layer
Grant 6,835,633 - Boyd , et al. December 28, 2
2004-12-28
High performance CMOS device structure with mid-gap metal gate
App 20040171205 - Mocuta, Anda C. ;   et al.
2004-09-02
High performance CMOS device structure with mid-gap metal gate
Grant 6,762,469 - Mocuta , et al. July 13, 2
2004-07-13
Method and process to make multiple-threshold metal gates CMOS technology
App 20040094804 - Amos, Ricky ;   et al.
2004-05-20
SOI wafers with 30-100 A buried oxide (box) created by wafer bonding using 30-100 A thin oxide as bonding layer
App 20040018699 - Boyd, Diane C. ;   et al.
2004-01-29
Method of forming a fully-depleted SOI ( silicon-on-insulator) MOSFET having a thinned channel region
Grant 6,660,598 - Hanafi , et al. December 9, 2
2003-12-09
Fully-depleted SOI MOSFETs with low source and drain resistance and minimal overlap capacitance using a recessed channel damascene gate process
App 20030211681 - Hanafi, Hussein I. ;   et al.
2003-11-13
High performance CMOS device structure with mid-gap metal gate
App 20030197230 - Mocuta, Anda C. ;   et al.
2003-10-23
Method Of Forming A Fully-depleted Soi (silicon-on-insulator) Mosfet Having A Thinned Channel Region
App 20030162358 - Hanafi, Hussein I. ;   et al.
2003-08-28
Anisotropic nitride etch process with high selectivity to oxide and photoresist layers in a damascene etch scheme
Grant 6,461,529 - Boyd , et al. October 8, 2
2002-10-08
Resist image reversal by means of spun-on-glass
Grant 6,221,562 - Boyd , et al. April 24, 2
2001-04-24
Field effect transistors with improved implants and method for making such transistors
Grant 6,143,635 - Boyd , et al. November 7, 2
2000-11-07
Method for making field effect transistors having sub-lithographic gates with vertical side walls
Grant 6,040,214 - Boyd , et al. March 21, 2
2000-03-21
Method for varying x-ray hybrid resist space dimensions
Grant 6,014,422 - Boyd , et al. January 11, 2
2000-01-11

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