Patent | Date |
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Method and structure for strained FinFET devices Grant 8,669,145 - Doris , et al. March 11, 2 | 2014-03-11 |
Oxidation method for altering a film structure Grant 7,741,166 - Belyansky , et al. June 22, 2 | 2010-06-22 |
CMOS silicide metal gate integration Grant 7,655,557 - Amos , et al. February 2, 2 | 2010-02-02 |
Method and structure for strained FinFET devices Grant 7,602,021 - Doris , et al. October 13, 2 | 2009-10-13 |
Stressed semiconductor device structures having granular semiconductor material Grant 7,488,658 - Doris , et al. February 10, 2 | 2009-02-10 |
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique Grant 7,482,243 - Boyd , et al. January 27, 2 | 2009-01-27 |
Cmos Silicide Metal Gate Integration App 20080254622 - Amos; Ricky S. ;   et al. | 2008-10-16 |
HETERO-INTEGRATED STRAINED SILICON n- AND p- MOSFETS App 20080251813 - Boyd; Diane C. ;   et al. | 2008-10-16 |
CMOS silicide metal gate integration Grant 7,411,227 - Amos , et al. August 12, 2 | 2008-08-12 |
Hetero-integrated strained silicon n- and p-MOSFETs Grant 7,396,747 - Boyd , et al. July 8, 2 | 2008-07-08 |
Stressed Semiconductor Device Structures Having Granular Semiconductor Material App 20080064172 - Doris; Bruce B. ;   et al. | 2008-03-13 |
HETERO-INTEGRATED STRAINED SILICON n- AND p- MOSFETS App 20070278517 - Boyd; Diane C. ;   et al. | 2007-12-06 |
ULTRA-THIN Si MOSFET DEVICE STRUCTURE AND METHOD OF MANUFACTURE App 20070228473 - Boyd; Diane C. ;   et al. | 2007-10-04 |
Hetero-integrated strained silicon n- and p-MOSFETs Grant 7,273,800 - Boyd , et al. September 25, 2 | 2007-09-25 |
Hybrid planar and FinFET CMOS devices Grant 7,250,658 - Doris , et al. July 31, 2 | 2007-07-31 |
Ultra-thin Si MOSFET device structure and method of manufacture Grant 7,247,569 - Boyd , et al. July 24, 2 | 2007-07-24 |
Method and structure for strained FinFET devices App 20070132039 - Doris; Bruce Bennett ;   et al. | 2007-06-14 |
CMOS transistor structure including film having reduced stress by exposure to atomic oxygen Grant 7,202,516 - Belyansky , et al. April 10, 2 | 2007-04-10 |
SOI wafers with 30-100 .ANG. buried oxide (BOX) created by wafer bonding using 30-100 .ANG. thin oxide as bonding layer Grant 7,166,521 - Boyd , et al. January 23, 2 | 2007-01-23 |
Ultrathin-body schottky contact MOSFET App 20070001223 - Boyd; Diane C. ;   et al. | 2007-01-04 |
Stressed semiconductor device structures having granular semiconductor material Grant 7,122,849 - Doris , et al. October 17, 2 | 2006-10-17 |
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique App 20060211184 - Boyd; Diane C. ;   et al. | 2006-09-21 |
CMOS silicide metal gate integration App 20060189061 - Amos; Ricky S. ;   et al. | 2006-08-24 |
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique Grant 7,075,150 - Boyd , et al. July 11, 2 | 2006-07-11 |
CMOS transistor structure including film having reduced stress by exposure to atomic oxygen App 20060131659 - Belyansky; Michael P. ;   et al. | 2006-06-22 |
CMOS silicide metal gate integration Grant 7,056,782 - Amos , et al. June 6, 2 | 2006-06-06 |
Oxidation method for altering a film structure App 20060105516 - Belyansky; Michael P. ;   et al. | 2006-05-18 |
Hetero-integrated strained silicon n-and p-MOSFETs App 20060091377 - Boyd; Diane C. ;   et al. | 2006-05-04 |
Ultra-thin body super-steep retrograde well (SSRW) FET devices Grant 7,002,214 - Boyd , et al. February 21, 2 | 2006-02-21 |
Ultra-thin Body Super-steep Retrograde Well (ssrw) Fet Devices App 20060022270 - Boyd; Diane C. ;   et al. | 2006-02-02 |
Method And Structure For Strained Finfet Devices App 20060014338 - Doris; Bruce Bennett ;   et al. | 2006-01-19 |
Oxidation method for altering a film structure and CMOS transistor structure formed therewith Grant 6,982,196 - Belyansky , et al. January 3, 2 | 2006-01-03 |
Hybrid planar and FinFET CMOS devices App 20050263831 - Doris, Bruce B. ;   et al. | 2005-12-01 |
CMOS silicide metal gate integration App 20050186747 - Amos, Ricky S. ;   et al. | 2005-08-25 |
High performance CMOS device structure with mid-gap metal gate Grant 6,916,698 - Mocuta , et al. July 12, 2 | 2005-07-12 |
Hybrid planar and finFET CMOS devices Grant 6,911,383 - Doris , et al. June 28, 2 | 2005-06-28 |
Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique App 20050116289 - Boyd, Diane C. ;   et al. | 2005-06-02 |
Ultra-thin Si MOSFET device structure and method of manufacture App 20050118826 - Boyd, Diane C. ;   et al. | 2005-06-02 |
Method and process to make multiple-threshold metal gates CMOS technology App 20050106788 - Amos, Ricky ;   et al. | 2005-05-19 |
Stressed Semiconductor Device Structures Having Granular Semiconductor Material App 20050106799 - Doris, Bruce B. ;   et al. | 2005-05-19 |
Oxidation Method For Altering A Film Structure And Cmos Transistor Structure Formed Therewith App 20050093081 - Belyansky, Michael P. ;   et al. | 2005-05-05 |
SOI wafers with 30-100 A buried oxide (BOX) created by wafer bonding using 30-100 A thin oxide as bonding layer App 20050042841 - Boyd, Diane C. ;   et al. | 2005-02-24 |
Method and process to make multiple-threshold metal gates CMOS technology Grant 6,846,734 - Amos , et al. January 25, 2 | 2005-01-25 |
Fully-depleted SOI MOSFETs with low source and drain resistance and minimal overlap capacitance using a recessed channel damascene gate process Grant 6,841,831 - Hanafi , et al. January 11, 2 | 2005-01-11 |
HYBRID PLANAR AND FinFET CMOS DEVICES App 20040266076 - Doris, Bruce B. ;   et al. | 2004-12-30 |
SOI wafers with 30-100 .ANG. buried oxide (BOX) created by wafer bonding using 30-100 .ANG. thin oxide as bonding layer Grant 6,835,633 - Boyd , et al. December 28, 2 | 2004-12-28 |
High performance CMOS device structure with mid-gap metal gate App 20040171205 - Mocuta, Anda C. ;   et al. | 2004-09-02 |
High performance CMOS device structure with mid-gap metal gate Grant 6,762,469 - Mocuta , et al. July 13, 2 | 2004-07-13 |
Method and process to make multiple-threshold metal gates CMOS technology App 20040094804 - Amos, Ricky ;   et al. | 2004-05-20 |
SOI wafers with 30-100 A buried oxide (box) created by wafer bonding using 30-100 A thin oxide as bonding layer App 20040018699 - Boyd, Diane C. ;   et al. | 2004-01-29 |
Method of forming a fully-depleted SOI ( silicon-on-insulator) MOSFET having a thinned channel region Grant 6,660,598 - Hanafi , et al. December 9, 2 | 2003-12-09 |
Fully-depleted SOI MOSFETs with low source and drain resistance and minimal overlap capacitance using a recessed channel damascene gate process App 20030211681 - Hanafi, Hussein I. ;   et al. | 2003-11-13 |
High performance CMOS device structure with mid-gap metal gate App 20030197230 - Mocuta, Anda C. ;   et al. | 2003-10-23 |
Method Of Forming A Fully-depleted Soi (silicon-on-insulator) Mosfet Having A Thinned Channel Region App 20030162358 - Hanafi, Hussein I. ;   et al. | 2003-08-28 |
Anisotropic nitride etch process with high selectivity to oxide and photoresist layers in a damascene etch scheme Grant 6,461,529 - Boyd , et al. October 8, 2 | 2002-10-08 |
Resist image reversal by means of spun-on-glass Grant 6,221,562 - Boyd , et al. April 24, 2 | 2001-04-24 |
Field effect transistors with improved implants and method for making such transistors Grant 6,143,635 - Boyd , et al. November 7, 2 | 2000-11-07 |
Method for making field effect transistors having sub-lithographic gates with vertical side walls Grant 6,040,214 - Boyd , et al. March 21, 2 | 2000-03-21 |
Method for varying x-ray hybrid resist space dimensions Grant 6,014,422 - Boyd , et al. January 11, 2 | 2000-01-11 |