Bowles; Philip H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bowles; Philip H..The latest application filed is for "microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof".

Company Profile

2.39.44

Bowles; Philip H. - Gilbert AZ
Bowles; Philip H. - San Diego CA US
Bowles; Philip H. - Fountain Hills AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic packages having hermetic cavities and methods for the production thereof Grant 10,442,685 - Bowles , et al. Oc	2019-10-15
Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof Grant 10,053,359 - Bowles , et al. August 21, 2	2018-08-21
Microelectronic packages having split gyroscope structures and methods for the fabrication thereof Grant 9,891,244 - Bowles , et al. February 13, 2	2018-02-13
Sensor device packages and related fabrication methods Grant 9,676,611 - Hooper , et al. June 13, 2	2017-06-13
Sequential wafer bonding Grant 9,604,844 - Bowles , et al. March 28, 2	2017-03-28
Microelectronic Packages Having Axially-partitioned Hermetic Cavities And Methods For The Fabrication Thereof App 20170044005 - BOWLES; Philip H. ; et al.	2017-02-16
Microelectronic Packages Having Split Gyroscope Structures And Methods For The Fabrication Thereof App 20170038209 - BOWLES; PHILIP H. ; et al.	2017-02-09
Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof Grant 9,499,397 - Bowles , et al. November 22, 2	2016-11-22
Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof Grant 9,376,310 - Bowles , et al. June 28, 2	2016-06-28
Microelectronic Packages Having Hermetic Cavities And Methods For The Production Thereof App 20160167952 - BOWLES; PHILIP H. ; et al.	2016-06-16
Sensor package having stacked die Grant 9,365,414 - Bowles , et al. June 14, 2	2016-06-14
Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication Grant 9,359,192 - Bowles , et al. June 7, 2	2016-06-07
Cavity-type semiconductor package and method of packaging same Grant 9,227,838 - Hooper , et al. January 5, 2	2016-01-05
Microelectronic Packages Having Stacked Accelerometer And Magnetometer Die And Methods For The Production Thereof App 20150329352 - BOWLES; PHILIP H. ; et al.	2015-11-19
Sequential Wafer Bonding App 20150321907 - Bowles; Philip H. ; et al.	2015-11-12
Sensor Package Having Stacked Die App 20150298966 - BOWLES; PHILIP H. ; et al.	2015-10-22
Sensor packaging method and sensor packages Grant 9,165,886 - Bowles , et al. October 20, 2	2015-10-20
Microelectronic Packages Having Axially-partitioned Hermetic Cavities And Methods For The Fabrication Thereof App 20150274515 - BOWLES; PHILIP H. ; et al.	2015-10-01
Microelectronic Packages Having Stacked Accelerometer And Magnetometer Die And Methods For The Production Thereof App 20150251903 - BOWLES; PHILIP H. ; et al.	2015-09-10
Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof Grant 9,108,841 - Bowles , et al. August 18, 2	2015-08-18
Sequential wafer bonding Grant 9,090,454 - Bowles , et al. July 28, 2	2015-07-28
Sensor package and method of forming same Grant 9,040,355 - Bowles , et al. May 26, 2	2015-05-26
Vent hole sealing in multiple die sensor device Grant 9,018,029 - Bowles , et al. April 28, 2	2015-04-28
Sensor Device Packages And Related Fabrication Methods App 20150108653 - HOOPER; STEPHEN R. ; et al.	2015-04-23
Sequential Wafer Bonding App 20150061044 - Bowles; Philip H. ; et al.	2015-03-05
Cavity-type Semiconductor Package And Method Of Packaging Same App 20150061106 - HOOPER; STEPHEN R. ; et al.	2015-03-05
Microelectronic packages including patterned die attach material and methods for the fabrication thereof Grant 8,962,389 - Stermer, Jr. , et al. February 24, 2	2015-02-24
Sensor Package And Method Of Forming Same App 20150048462 - BOWLES; PHILIP H. ; et al.	2015-02-19
Cavity-type semiconductor package and method of packaging same Grant 8,906,747 - Hooper , et al. December 9, 2	2014-12-09
Microelectronic Packages Including Patterned Die Attach Material And Methods For The Fabrication Thereof App 20140353772 - Stermer, JR.; William C. ; et al.	2014-12-04
Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture Grant 8,884,413 - Bowles , et al. November 11, 2	2014-11-11
Sensor Packages Having Semiconductor Dies Of Differing Sizes App 20140183729 - Bowles; Philip H.	2014-07-03
Sensor Packaging Method And Sensor Packages App 20140124958 - Bowles; Philip H. ; et al.	2014-05-08
Sensor packages and method of packaging dies of differing sizes Grant 8,709,868 - Bowles April 29, 2	2014-04-29
Method and apparatus for high pressure sensor device Grant 8,686,550 - McDonald , et al. April 1, 2	2014-04-01
Sensor Packaging Method And Sensor Packages App 20140061948 - Bowles; Philip H. ; et al.	2014-03-06
Leadframes, Air-cavity Packages, And Electronic Devices With Offset Vent Holes, And Methods Of Their Manufacture App 20140061883 - BOWLES; PHILIP H. ; et al.	2014-03-06
Sensor Packages And Method Of Packaging Dies Of Differing Sizes App 20140054798 - Bowles; Philip H.	2014-02-27
Sensor packaging method and sensor packages Grant 8,659,167 - Bowles , et al. February 25, 2	2014-02-25
Sensor Packages And Method Of Packaging Dies Of Various Sizes App 20140048946 - Bowles; Philip H. ; et al.	2014-02-20
Sensor Package And Method Of Forming Same App 20140015123 - Bowles; Philip H. ; et al.	2014-01-16
Cavity-type Semiconductor Package And Method Of Packaging Same App 20130313700 - Hooper; Stephen R. ; et al.	2013-11-28
Method And Apparatus For High Pressure Sensor Device App 20130207207 - McDonald; William G. ; et al.	2013-08-15
Stacked And Shielded Packages With Interconnects App 20110250721 - Bowles; Philip H. ; et al.	2011-10-13
Microelectronic assembly with back side metallization and method for forming the same Grant 7,723,224 - Hill , et al. May 25, 2	2010-05-25
Methods and apparatus for RF shielding in vertically-integrated semiconductor devices Grant 7,446,017 - Liu , et al. November 4, 2	2008-11-04
Stacked And Shielded Die Packages With Interconnects App 20080246126 - Bowles; Philip H. ; et al.	2008-10-09
Microelectronic assembly with back side metallization and method for forming the same App 20070293033 - Hill; Darrell G. ; et al.	2007-12-20
Methods and apparatus for RF shielding in vertically-integrated semiconductor devices App 20070281438 - Liu; Lianjun ; et al.	2007-12-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.