Bower; William B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bower; William B..The latest application filed is for "heat seal die and system and method for portion control sized packaging".
- Bower; William B. - Palo Alto CA
| Patent | Date |
|---|---|
| Heat seal die and system and method for portion control sized packaging Grant 7,219,483 - Adair, Jr. , et al. May 22, 2 | 2007-05-22 |
| Heat seal die and system and method for portion control sized packaging App 20030051441 - Adair, James Robert JR. ; et al. | 2003-03-20 |
| Resealable packaging material Grant 5,089,320 - Straus , et al. February 18, 1 | 1992-02-18 |
| Heatseal die Grant 4,582,555 - Bower April 15, 1 | 1986-04-15 |
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