Bowen; Neal
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bowen; Neal.The latest application filed is for "methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies".
- Bowen; Neal - Kuna ID
| Patent | Date |
|---|---|
| Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies Grant 9,716,023 - Farrens , et al. July 25, 2 | 2017-07-25 |
| Methods For Temporarily Bonding A Device Wafer To A Carrier Wafer, And Related Assemblies App 20160020129 - Farrens; Sharon N. ; et al. | 2016-01-21 |
| Two die semiconductor assembly and system including same Grant 7,372,129 - Bowen May 13, 2 | 2008-05-13 |
| Method of fabricating a two die semiconductor assembly Grant 7,368,320 - Bowen May 6, 2 | 2008-05-06 |
| Two die semiconductor assembly and system including same App 20050184367 - Bowen, Neal | 2005-08-25 |
| Two die semiconductor assembly and method of fabrication App 20050046005 - Bowen, Neal | 2005-03-03 |
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