loadpatents
name:-0.0060138702392578
name:-0.0060229301452637
name:-0.00041294097900391
Bovio; Ezio Patent Filings

Bovio; Ezio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bovio; Ezio.The latest application filed is for "semiconductor wafer thermal removal control".

Company Profile
0.7.7
  • Bovio; Ezio - Bellinzago Novarese IT
  • Bovio; Ezio - Novara IT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Wafer Thermal Removal Control
App 20210178547 - Corsi; Emanuele ;   et al.
2021-06-17
Methods and systems for polishing pad control
Grant 10,960,513 - Corsi , et al. March 30, 2
2021-03-30
Methods and systems for polishing pad control
Grant 10,946,493 - Corsi , et al. March 16, 2
2021-03-16
Methods and systems for polishing pad control
Grant 10,654,145 - Corsi , et al.
2020-05-19
Methods And Systems For Polishing Pad Control
App 20180304437 - Corsi; Emanuele ;   et al.
2018-10-25
Methods And Systems For Polishing Pad Control
App 20180304436 - Corsi; Emanuele ;   et al.
2018-10-25
Methods And Systems For Polishing Pad Control
App 20170001281 - Corsi; Emanuele ;   et al.
2017-01-05
Cleaning Tool For Polysilicon Reactor
App 20130000672 - Bovio; Ezio ;   et al.
2013-01-03
System and method for dressing a wafer polishing pad
Grant 7,846,007 - Stinson , et al. December 7, 2
2010-12-07
Dressing a wafer polishing pad
Grant 7,846,006 - Stinson , et al. December 7, 2
2010-12-07
System And Method For Dressing A Wafer Polishing Pad
App 20090176441 - Stinson; Mark G. ;   et al.
2009-07-09
Dressing a Wafer Polishing Pad
App 20080009231 - Stinson; Mark G. ;   et al.
2008-01-10
Semiconductor wafer, polishing apparatus and method
Grant 7,137,874 - Bovio , et al. November 21, 2
2006-11-21
Method of polishing wafers
Grant 6,878,302 - Corbellini , et al. April 12, 2
2005-04-12

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