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Patent applications and USPTO patent grants for Boutot; David.The latest application filed is for "method for connecting the conductors of a flexible bonded (equipotential) connection layer, as well as crimping tool, connectors and wiring loom fitted with such connectors".
Patent | Date |
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Method for connecting the conductors of a flexible bonded (equipotential) connection layer Grant 9,711,925 - Biesse , et al. July 18, 2 | 2017-07-18 |
Method For Connecting The Conductors Of A Flexible Bonded (equipotential) Connection Layer, As Well As Crimping Tool, Connectors And Wiring Loom Fitted With Such Connectors App 20150107893 - Biesse; Jean-Luc ;   et al. | 2015-04-23 |
Connection, Method, Equipotential Shunt Connection And Equipotential Bonding Current Return Network In A Non-conductive Architecture App 20140354043 - Biesse; Jean-Luc ;   et al. | 2014-12-04 |
Terminal For Electrical Connection And Method For Assembly Thereof App 20100200261 - Boutot; David | 2010-08-12 |
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