loadpatents
name:-0.014708042144775
name:-0.0071349143981934
name:-0.0006248950958252
Boursier; Bruno Patent Filings

Boursier; Bruno

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boursier; Bruno.The latest application filed is for "preforms made directly from thermosetting composite chips".

Company Profile
0.8.11
  • Boursier; Bruno - Dublin CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-component composite structures
Grant 10,239,289 - Boursier
2019-03-26
Preforms made directly from thermosetting composite chips
Grant 9,724,854 - Boursier August 8, 2
2017-08-08
Preforms Made Directly From Thermosetting Composite Chips
App 20160332339 - Boursier; Bruno
2016-11-17
Module for holding at least one bushing
Grant 9,370,905 - Moeller Larsen , et al. June 21, 2
2016-06-21
Multi-component Composite Structures
App 20150375481 - Boursier; Bruno
2015-12-31
Tracers For Use In Compression Molding Of Unidirectional Discontinuous Fiber Composite Molding Compound
App 20150355111 - Boursier; Bruno
2015-12-10
Method For Making A Discontinuous Fiber Molding Compound
App 20140377556 - Boursier; Bruno
2014-12-25
Machinable composite material
Grant 8,864,070 - Boursier October 21, 2
2014-10-21
High pressure molding of composite parts
Grant 8,734,925 - Kweder , et al. May 27, 2
2014-05-27
Over-molding Of Load-bearing Composite Structures
App 20130309435 - Boursier; Bruno
2013-11-21
Module For Holding At Least One Bushing
App 20130285284 - Moeller Larsen; Flemming ;   et al.
2013-10-31
High Pressure Molding Of Composite Parts
App 20130101406 - Kweder; Matthew ;   et al.
2013-04-25
Machinable Composite Material
App 20120040169 - Boursier; Bruno
2012-02-16

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