Bourget; Lawrence P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bourget; Lawrence P..The latest application filed is for "use of pulsed-dc wafer bias for filling vias/trenches with metal in hdp physical vapor deposition".
- Bourget; Lawrence P. - Reading MA
- Bourget; Lawrence P. - Winchester MA
| Patent | Date |
|---|---|
| Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition Grant 6,051,114 - Yao , et al. April 18, 2 | 2000-04-18 |
| High growth rate plasma diamond deposition process and method of controlling same Grant 5,405,645 - Sevillano , et al. April 11, 1 | 1995-04-11 |
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