loadpatents
Patent applications and USPTO patent grants for Boudreaux; Brent A..The latest application filed is for "integrated pcb interconnect system".
Patent | Date |
---|---|
Integrated PCB interconnect system Grant 9,941,567 - Boudreaux April 10, 2 | 2018-04-10 |
Integrated PCB Interconnect System App 20170019997 - BOUDREAUX; Brent A. | 2017-01-19 |
Multi-processor module Grant 7,475,175 - Klein , et al. January 6, 2 | 2009-01-06 |
Heat spreader with multiple stacked printed circuit boards Grant 7,345,885 - Boudreaux , et al. March 18, 2 | 2008-03-18 |
Thermally expanding base of heatsink to receive fins Grant 7,286,352 - Curtis , et al. October 23, 2 | 2007-10-23 |
Mechanical highly compliant thermal interface pad Grant 7,131,199 - Peterson , et al. November 7, 2 | 2006-11-07 |
Heatsink for electronic heat generating components App 20060232932 - Curtis; Robert B. ;   et al. | 2006-10-19 |
Heat sink Grant 7,117,929 - Curtis , et al. October 10, 2 | 2006-10-10 |
Thermal pouch interface Grant 7,096,926 - Belady , et al. August 29, 2 | 2006-08-29 |
Heat spreader with multiple stacked printed circuit boards App 20060133043 - Boudreaux; Brent A. ;   et al. | 2006-06-22 |
Heat sink App 20060086481 - Curtis; Robert ;   et al. | 2006-04-27 |
High surface area heat sink Grant 7,028,754 - Boudreaux April 18, 2 | 2006-04-18 |
Routing system Grant 7,018,215 - Williams , et al. March 28, 2 | 2006-03-28 |
High surface area heat sink App 20050236142 - Boudreaux, Brent A. | 2005-10-27 |
Electromagnetic interference shield for electronic devices on a circuit board Grant 6,958,445 - Boudreaux , et al. October 25, 2 | 2005-10-25 |
System and method for heat dissipation App 20050219820 - Belady, Christian L. ;   et al. | 2005-10-06 |
Stack up assembly Grant 6,947,286 - Belady , et al. September 20, 2 | 2005-09-20 |
Stack up assembly Grant 6,922,340 - Belady , et al. July 26, 2 | 2005-07-26 |
Stack up assembly App 20050152117 - Belady, Christian L. ;   et al. | 2005-07-14 |
Mechanical highly compliant thermal interface pad Grant 6,910,271 - Peterson , et al. June 28, 2 | 2005-06-28 |
Mechanical highly compliant thermal interface pad App 20050132571 - Peterson, Eric C. ;   et al. | 2005-06-23 |
Routing system App 20050136728 - Williams, Gary W. ;   et al. | 2005-06-23 |
Stack up assembly Grant 6,900,987 - Belady , et al. May 31, 2 | 2005-05-31 |
Stack up assembly Grant 6,873,530 - Belady , et al. March 29, 2 | 2005-03-29 |
Stack up assembly Grant 6,862,186 - Belady , et al. March 1, 2 | 2005-03-01 |
Stack up assembly App 20040257773 - Belady, Christian L. ;   et al. | 2004-12-23 |
Stack up assembly App 20040257772 - Belady, Christian L. ;   et al. | 2004-12-23 |
Stack up assembly App 20040246680 - Belady, Christian L. ;   et al. | 2004-12-09 |
Stack up assembly App 20040246681 - Belady, Christian L. ;   et al. | 2004-12-09 |
Cooling apparatus for stacked components Grant 6,819,562 - Boudreaux , et al. November 16, 2 | 2004-11-16 |
Multi-processor module App 20040225821 - Klein, David A. ;   et al. | 2004-11-11 |
Stack up assembly Grant 6,816,378 - Belady , et al. November 9, 2 | 2004-11-09 |
Stack Up Assembly App 20040212964 - Belady, Christian L. ;   et al. | 2004-10-28 |
Thermal pouch interface App 20040194915 - Belady, Christian L. ;   et al. | 2004-10-07 |
Cooling apparatus for stacked components App 20040150957 - Boudreaux, Brent A. ;   et al. | 2004-08-05 |
Power Module For Multi-chip Printed Circuit Boards App 20040150954 - Belady, Christian L. ;   et al. | 2004-08-05 |
Power module for multi-chip printed circuit boards Grant 6,771,507 - Belady , et al. August 3, 2 | 2004-08-03 |
Modular input/output expansion system for an external computer Grant 6,748,458 - Andrewartha , et al. June 8, 2 | 2004-06-08 |
Mechanical highly compliant thermal interface pad App 20040079519 - Peterson, Eric C. ;   et al. | 2004-04-29 |
Adjustable pedestal thermal interface Grant 6,695,042 - Boudreaux , et al. February 24, 2 | 2004-02-24 |
Adjustable Pedestal Thermal Interface App 20040020634 - Boudreaux, Brent A. ;   et al. | 2004-02-05 |
Management system for multiple cables Grant 6,675,720 - Peterson , et al. January 13, 2 | 2004-01-13 |
Thermal pouch interface App 20030178174 - Belady, Christian L. ;   et al. | 2003-09-25 |
Heat-activated self-aligning heat sink Grant 6,625,026 - Boudreaux , et al. September 23, 2 | 2003-09-23 |
Clamp system for high speed cable termination Grant 6,540,531 - Syed , et al. April 1, 2 | 2003-04-01 |
Shielded Cable System For High Speed Cable Termination App 20030042032 - Syed, Farrukh S. ;   et al. | 2003-03-06 |
Management system for multiple cables App 20030042096 - Peterson, Martha G. ;   et al. | 2003-03-06 |
Clamp System For High Speed Cable Termination App 20030045140 - Syed, Farrukh S. ;   et al. | 2003-03-06 |
Modular input/output expansion system for an external computer App 20030046452 - Andrewartha, J. Michael ;   et al. | 2003-03-06 |
Cable Bundle Clamp App 20030045159 - Boudreaux, Brent A. | 2003-03-06 |
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