loadpatents
name:-0.1131420135498
name:-0.06640100479126
name:-0.0029020309448242
Boudreaux; Brent A. Patent Filings

Boudreaux; Brent A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boudreaux; Brent A..The latest application filed is for "integrated pcb interconnect system".

Company Profile
0.24.26
  • Boudreaux; Brent A. - Denton TX
  • Boudreaux; Brent A. - Highland Village TX
  • Boudreaux; Brent A - Highland Village TX
  • Boudreaux; Brent A. - Highland Villiage TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated PCB interconnect system
Grant 9,941,567 - Boudreaux April 10, 2
2018-04-10
Integrated PCB Interconnect System
App 20170019997 - BOUDREAUX; Brent A.
2017-01-19
Multi-processor module
Grant 7,475,175 - Klein , et al. January 6, 2
2009-01-06
Heat spreader with multiple stacked printed circuit boards
Grant 7,345,885 - Boudreaux , et al. March 18, 2
2008-03-18
Thermally expanding base of heatsink to receive fins
Grant 7,286,352 - Curtis , et al. October 23, 2
2007-10-23
Mechanical highly compliant thermal interface pad
Grant 7,131,199 - Peterson , et al. November 7, 2
2006-11-07
Heatsink for electronic heat generating components
App 20060232932 - Curtis; Robert B. ;   et al.
2006-10-19
Heat sink
Grant 7,117,929 - Curtis , et al. October 10, 2
2006-10-10
Thermal pouch interface
Grant 7,096,926 - Belady , et al. August 29, 2
2006-08-29
Heat spreader with multiple stacked printed circuit boards
App 20060133043 - Boudreaux; Brent A. ;   et al.
2006-06-22
Heat sink
App 20060086481 - Curtis; Robert ;   et al.
2006-04-27
High surface area heat sink
Grant 7,028,754 - Boudreaux April 18, 2
2006-04-18
Routing system
Grant 7,018,215 - Williams , et al. March 28, 2
2006-03-28
High surface area heat sink
App 20050236142 - Boudreaux, Brent A.
2005-10-27
Electromagnetic interference shield for electronic devices on a circuit board
Grant 6,958,445 - Boudreaux , et al. October 25, 2
2005-10-25
System and method for heat dissipation
App 20050219820 - Belady, Christian L. ;   et al.
2005-10-06
Stack up assembly
Grant 6,947,286 - Belady , et al. September 20, 2
2005-09-20
Stack up assembly
Grant 6,922,340 - Belady , et al. July 26, 2
2005-07-26
Stack up assembly
App 20050152117 - Belady, Christian L. ;   et al.
2005-07-14
Mechanical highly compliant thermal interface pad
Grant 6,910,271 - Peterson , et al. June 28, 2
2005-06-28
Mechanical highly compliant thermal interface pad
App 20050132571 - Peterson, Eric C. ;   et al.
2005-06-23
Routing system
App 20050136728 - Williams, Gary W. ;   et al.
2005-06-23
Stack up assembly
Grant 6,900,987 - Belady , et al. May 31, 2
2005-05-31
Stack up assembly
Grant 6,873,530 - Belady , et al. March 29, 2
2005-03-29
Stack up assembly
Grant 6,862,186 - Belady , et al. March 1, 2
2005-03-01
Stack up assembly
App 20040257773 - Belady, Christian L. ;   et al.
2004-12-23
Stack up assembly
App 20040257772 - Belady, Christian L. ;   et al.
2004-12-23
Stack up assembly
App 20040246680 - Belady, Christian L. ;   et al.
2004-12-09
Stack up assembly
App 20040246681 - Belady, Christian L. ;   et al.
2004-12-09
Cooling apparatus for stacked components
Grant 6,819,562 - Boudreaux , et al. November 16, 2
2004-11-16
Multi-processor module
App 20040225821 - Klein, David A. ;   et al.
2004-11-11
Stack up assembly
Grant 6,816,378 - Belady , et al. November 9, 2
2004-11-09
Stack Up Assembly
App 20040212964 - Belady, Christian L. ;   et al.
2004-10-28
Thermal pouch interface
App 20040194915 - Belady, Christian L. ;   et al.
2004-10-07
Cooling apparatus for stacked components
App 20040150957 - Boudreaux, Brent A. ;   et al.
2004-08-05
Power Module For Multi-chip Printed Circuit Boards
App 20040150954 - Belady, Christian L. ;   et al.
2004-08-05
Power module for multi-chip printed circuit boards
Grant 6,771,507 - Belady , et al. August 3, 2
2004-08-03
Modular input/output expansion system for an external computer
Grant 6,748,458 - Andrewartha , et al. June 8, 2
2004-06-08
Mechanical highly compliant thermal interface pad
App 20040079519 - Peterson, Eric C. ;   et al.
2004-04-29
Adjustable pedestal thermal interface
Grant 6,695,042 - Boudreaux , et al. February 24, 2
2004-02-24
Adjustable Pedestal Thermal Interface
App 20040020634 - Boudreaux, Brent A. ;   et al.
2004-02-05
Management system for multiple cables
Grant 6,675,720 - Peterson , et al. January 13, 2
2004-01-13
Thermal pouch interface
App 20030178174 - Belady, Christian L. ;   et al.
2003-09-25
Heat-activated self-aligning heat sink
Grant 6,625,026 - Boudreaux , et al. September 23, 2
2003-09-23
Clamp system for high speed cable termination
Grant 6,540,531 - Syed , et al. April 1, 2
2003-04-01
Shielded Cable System For High Speed Cable Termination
App 20030042032 - Syed, Farrukh S. ;   et al.
2003-03-06
Management system for multiple cables
App 20030042096 - Peterson, Martha G. ;   et al.
2003-03-06
Clamp System For High Speed Cable Termination
App 20030045140 - Syed, Farrukh S. ;   et al.
2003-03-06
Modular input/output expansion system for an external computer
App 20030046452 - Andrewartha, J. Michael ;   et al.
2003-03-06
Cable Bundle Clamp
App 20030045159 - Boudreaux, Brent A.
2003-03-06

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