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Patent applications and USPTO patent grants for Boucher, John N..The latest application filed is for "substrate dicing method".
Patent | Date |
---|---|
Substrate dicing method App 20040112360 - Boucher, John N. ;   et al. | 2004-06-17 |
Substrate dicing method Grant 6,659,843 - Boucher , et al. December 9, 2 | 2003-12-09 |
Substrate dicing method App 20020193049 - Boucher, John N. ;   et al. | 2002-12-19 |
Substrate dicing method Grant 6,354,909 - Boucher , et al. March 12, 2 | 2002-03-12 |
Package useful in storing and handling fragile dicing blade Grant 5,819,931 - Boucher , et al. October 13, 1 | 1998-10-13 |
Semiconductor wafer dicing method Grant 5,718,615 - Boucher , et al. February 17, 1 | 1998-02-17 |
Semiconductor wafer dicing saw Grant D387,364 - Boucher , et al. December 9, 1 | 1997-12-09 |
Machine tool rotary table locking apparatus Grant 5,676,360 - Boucher , et al. October 14, 1 | 1997-10-14 |
Abrasive blade having a polycrystalline ceramic core Grant 4,787,362 - Boucher , et al. November 29, 1 | 1988-11-29 |
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