Boucher; Edmund B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Boucher; Edmund B..The latest application filed is for "scalable interchangeable multiband power package mounting apparatus".
- Boucher; Edmund B. - Davie FL
- Boucher; Edmund B. - Fort Lauderdale FL
- Boucher; Edmund B. - Boca Raton FL
- Boucher; Edmund B. - Ft. Lauderdale FL
| Patent | Date |
|---|---|
| Scalable Interchangeable Multiband Power Package Mounting Apparatus App 20080079143 - Boucher; Edmund B. ; et al. | 2008-04-03 |
| Reversible heat sink packaging assembly for an integrated circuit Grant 6,813,154 - Diaz , et al. November 2, 2 | 2004-11-02 |
| Thermal dissipation package for an electrical surface mount component Grant 6,784,366 - Boucher , et al. August 31, 2 | 2004-08-31 |
| Reversible Heat Sink Packaging Assembly For An Integrated Circuit App 20040109292 - Diaz, Jose ; et al. | 2004-06-10 |
| Mounting multiple substrate frame and leadless surface mountable assembly using same Grant 6,208,526 - Griffin , et al. March 27, 2 | 2001-03-27 |
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